209384 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body inside the bonding area Flow barrier
Method for packaging stacking flip chip
#2COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
#3Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#4Packaged semiconductor devices and methods of packaging thereof
#5Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#6Semiconductor device
#7Collars for under-bump metal structures and associated systems and methods
#8Electronic component and electronic device
#9Method for disposing a component