209381 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body inside the bonding area
Sub-classes:Semiconductor device and method of manufacturing a semiconductor device
#2Semiconductor device and method of manufacturing a semiconductor device
#3Semiconductor device and method of manufacturing a semiconductor device
#4Pressure-activated electrical interconnection by micro-transfer printing
#5Pressure-activated electrical interconnection by micro-transfer printing
#6Semiconductor device
#7Method for producing a structure for microelectronic device assembly
#8Semiconductor package with improved redistribution layer design and fabricating method thereof
#9SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
#10Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#11Compliant interconnects in wafers
#12Method of manufacturing an interconnect structure for a semiconductor device
#13Integrated circuit chip and flip chip package having the integrated circuit chip
#14Interconnect structure for a semiconductor device
#15Semiconductor package with passivation island for reducing stress on solder bumps
#16Semiconductor package with passivation island for reducing stress on solder bumps
#17Semiconductor package and method for manufacturing the same
#18Method for manufacture of wafer level package with air pads
#19Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#20Semiconductor package and method for manufacturing the same
#21Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device