Patents-Review.com
ClassID:

209392 ⎘

H01L2224/0218 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area Structure of the auxiliary member

Recent Application in this class:
#1
20250105178
2025-03-27

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

 #2
20240113016
2024-04-04

SEMICONDUCTOR DEVICE

 #3
20210225787
2021-07-22

Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof

 #4
20210143115
2021-05-13

Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same

 #5
20210057529
2021-02-25

Semiconductor device

 #6
20200357758
2020-11-12

Semiconductor substrate and manufacturing method therefor

 #7
20200328168
2020-10-15

SEMICONDUCTOR CHIPS INCLUDING REDISTRIBUTION LAYER

 #8
20200273764
2020-08-27

Low stress moisture resistant structure of semiconductor device

 #9
20200083184
2020-03-12

Semiconductor package

 #10
20200043876
2020-02-06

Adhesion Enhancing Structures for a Package

 #11
20190378807
2019-12-12

Semiconductor package and method of manufacturing same

 #12
20190109106
2019-04-11

Semiconductor copper metallization structure and related methods

 #13
20180350626
2018-12-06

Semiconductor device package with a conductive post

 #14
20180166407
2018-06-14

Semiconductor copper metallization structure and related methods

 #15
20180061791
2018-03-01

Semiconductor copper metallization structure and related methods

 #16
20170330870
2017-11-16

Semiconductor device with a conductive post

 #17
20170186725
2017-06-29

Semiconductor device manufacturing method and semiconductor wafer

 #18
20170098619
2017-04-06

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

 #19
20170062362
2017-03-02

Semiconductor device and method of manufacturing same

 #20
20160379940
2016-12-29

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

 #21
20160329288
2016-11-10

Semiconductor structure with sacrificial anode and method for forming

 #22
20160315058
2016-10-27

Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same

 #23
20160307859
2016-10-20

Method of fabricating semiconductor device having voids between top metal layers of metal interconnects

 #24
20150179605
2015-06-25

Method for aligning micro-electronic components

 #25
20140346663
2014-11-27

Semiconductor structure with sacrificial anode and passivation layer and method for forming

 #26
20090085186
2009-04-02

Semiconductor device and methods of manufacturing semiconductor devices