209400 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body not in direct contact with the bonding area Structure of the auxiliary member
SUBSTRATE
#2ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#3ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#4SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER
#5CHIP STRUCTURE
#6ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
#7Semiconductor die with solder restraining wall
#8Semiconductor die contact structure and method
#9Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same
#10Coupling of integrated circuits (ICS) through a passivation-defined contact pad
#11Method for fabricating semiconductor device with stress relief structure
#12Semiconductor device structure with air gap and method for forming the same
#13SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#14Semiconductor die contact structure and method
#15Semiconductor package
#16Chip structure and method for forming the same
#17Die stack structure and method of fabricating the same
#18Semiconductor die contact structure and method
#19Semiconductor device and method for manufacturing the same
#20Optimized solder pads for microelectronic components
#21Semiconductor die contact structure and method
#22Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
#23Semiconductor device, and method of fabricating the same
#24Self-alignment structure for wafer level chip scale package
#25Microelectronic assembly having a heat spreader for a plurality of die
#26Method for aligning micro-electronic components
#27Microelectronic assembly having a heat spreader for a plurality of die
#28Semiconductor die contact structure and method
#29Semiconductor device and method of manufacturing the same