H01L2224/02233 - CPC Classification Index

ClassID:

209396 ⎘

H01L2224/02233 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body not in direct contact with the bonding area

Sub-classes:

H01L2224/02235 » Reinforcing structures 72
H01L2224/0224 » Alignment aids 24
H01L2224/02245 » Flow barrier 25
H01L2224/0225 » Structure of the auxiliary member 24
H01L2224/02255 » Shape of the auxiliary member 57
H01L2224/0226 » Material of the auxiliary member 44

Recent Application in this class:

20250357399

ISOLATION STRUCTURE FOR BOND PAD STRUCTURE

20240290740

ISOLATION STRUCTURE FOR BOND PAD STRUCTURE

20240128218

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

20230290749

ISOLATION STRUCTURE FOR BOND PAD STRUCTURE

20220093555

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHODS OF FORMING THE SAME

20210233822

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

20210217691

Package with metal-insulator-metal capacitor and method of manufacturing the same

20200020623

Package with metal-insulator-metal capacitor and method of manufacturing the same

20190229048

Package with metal-insulator-metal capacitor and method of manufacturing the same

20190206821

SUBSTRATE ASSEMBLY WITH SPACER ELEMENT

20180211908

Package with metal-insulator-metal capacitor and method of manufacturing the same

20150270236

Chip package and method thereof

20140217594

Semiconductor device

20130307119

Package with metal-insulator-metal capacitor and method of manufacturing the same

20130075872

Metal pad structures in dies

20120306070

Electrical connection for chip scale packaging

20120241985

Method of fabricating a semiconductor chip with supportive terminal pad

20110309505

Electrode pad having a recessed portion

20110006434

Under land routing

20100193945

Reinforced structure for a stack of layers in a semiconductor component

20100155942

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

20090057893

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

20080246113

Semiconductor device including redistribution line structure and method of fabricating the same

20070290343

Electronic component, semiconductor device employing same, and method for manufacturing electronic component