209404 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Redistribution layers [RDL] for bonding areas Manufacturing methods of the redistribution layers
Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#602Integrated circuit having electromagnetic shielding capability and manufacturing method thereof
#603Methods of packaging semiconductor devices and structures thereof
#604Structure and method for integrated circuits packaging with increased density
#605Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
#606Semiconductor structure having recess and manufacturing method thereof
#607Semiconductor package device and forming the same
#608STACKED DIE PACKAGE WITH REDISTRIBUTION LAYER
#609Chip package and method for forming the same
#610CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#611Chip packaging structures and treatment methods thereof
#612Chip packages and methods of manufacturing the same
#6133D chip-on-wafer-on-substrate structure with via last process
#6143D chip-on-wafer-on-substrate structure with via last process
#615Metal-semiconductor contact structure with doped interlayer
#616Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#617Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)
#618SCRIBE LINE STRUCTURE AND METHOD OF FORMING SAME
#619Fan-out stacked system in package (SIP) and the methods of making the same
#620Method for forming hybrid bonding with through substrate via (TSV)
#621Method for forming chip package
#622Metal pillar bump packaging strctures and fabrication methods thereof
#623Semiconductor Device Package and Method of the Same
#624Semiconductor device package and method of the same
#625Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers
#626Methods for controlling warpage in packaging
#627Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip
#628Semiconductor device and manufacturing method thereof
#629Chip package having extended depression for electrical connection and method of manufacturing the same
#630Thermal performance structure for semiconductor packages and method of forming same
#631Substrate design for semiconductor packages and method of forming same
#632Substrate design for semiconductor packages and method of forming same
#633Semiconductor device including a dielectric material
#634Semiconductor packaging structure and manufacturing method for the same
#635Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device
#636Semiconductor device and manufacturing method thereof
#637Methods and structures for packaging semiconductor dies
#638Semiconductor structure and manufacturing method thereof
#639Semiconductor package and fabrication method thereof
#640SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#641Method of packaging a semiconductor device
#642Backside redistribution layer (RDL) structure
#643Integrated structure and method for fabricating the same
#644Method for handling very thin device wafers
#645Protective layer for contact pads in fan-out interconnect structure and method of forming same
#646Electronic component with sheet-like redistribution structure
#647Carrier-less silicon interposer using photo patterned polymer as substrate
#648Chip package and method for forming the same
#649Optically-masked microelectronic packages and methods for the fabrication thereof
#650Fabrication method of semiconductor package
#651Semiconductor device and method for manufacturing the same
#652Integrated fan-out package structures with recesses in molding compound
#653Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#654Stacked semiconductor package and method for manufacturing the same
#655Crack stopping structure in wafer level packaging (WLP)
#656Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#657Method for manufacturing a fan-out WLP with package
#658Packaging methods and structures for semiconductor devices
#659Chip package and fabrication method thereof
#660Stacked redistribution layers on die
#661Pad configurations for an electronic package assembly
#662Semiconductor devices
#663Chip to package interface
#664Chip package
#665Chip package and method for forming the same
#666Chip package and method for forming the same
#667Differential excitation of ports to control chip-mode mediated crosstalk
#668Fan-out interconnect structure and method for forming same
#669Differential excitation of ports to control chip-mode mediated crosstalk
#670Semiconductor device having conductive pads and a method of manufacturing the same
#671Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#672Self-aligned protection layer for copper post structure
#673Semiconductor device with discrete blocks
#674Chip to package interface
#675Microelectronic packages having trench vias and methods for the manufacture thereof
#676Integrated system and method of making the integrated system
#677Semiconductor structure with thin film resistor and terminal bond pad
#678Three dimensional microelectronic components and fabrication methods for same
#679THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHODS FOR SAME
#680Bump structure for stacked dies
#681Protected solder ball joints in wafer level chip-scale packaging
#682Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#683Semiconductor packages and methods of fabricating the same
#684Conductive bump structure on substrate and fabrication method thereof
#685Functional spacer for SIP and methods for forming the same
#686Post-passivation interconnect structure AMD method of forming same
#687Semiconductor packaging structure and method
#688Enhanced flip chip package
#689Packaged semiconductor device with a molding compound and a method of forming the same
#690Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
#691PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
#692Methods of packaging semiconductor devices and structures thereof
#693METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE
#694Packaging methods and structures for semiconductor devices
#695ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#696Method for manufacturing a circuit device
#697Chip with encapsulated sides and exposed surface
#698Self-aligned protection layer for copper post structure
#699Chip package and method for forming the same
#700Composite layered chip package
#701Semiconductor device with solder bump formed on high topography plated Cu pads
#702Multi-component integrated circuit contacts
#703Semiconductor device and a method of manufacturing the same
#704Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#705Layered chip package and method of manufacturing same
#706Layered chip package and method of manufacturing same
#707Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
#708Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#709METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#710INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AND METHODS RELATING THERETO
#711Robust FBEOL and UBM structure of C4 interconnects
#712Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#713Chip package and fabrication method thereof
#714Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#715Method for the production of an electronic component and electronic component produced according to this method
#716Power module for an automobile
#717WIRE WRAP COMPOSITIONS AND METHODS RELATING THERETO
#718COVERLAY COMPOSITIONS AND METHODS RELATING THERETO
#719THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELATING THERETO
#720Semiconductor device and method for manufacturing semiconductor device
#721Thin film transistor compositions, and methods relating thereto
#722ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHODS RELATING THERETO
#723Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding
#724On-Chip RF shields with front side redistribution lines
#725Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
#726CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
#727SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
#728Contact Array for Substrate Contacting
#729Wafer level chip package and a method of fabricating thereof
#730METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES
#731Semiconductor packages
#732BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
#733Microelectronic assemblies having compliancy and methods therefor
#734Semiconductor device and method of bonding different size semiconductor die at the wafer level
#735Chip assembly having via interconnects joined by plating
#736Layered chip package and method of manufacturing same
#737Semiconductor device and manufacturing method of semiconductor device
#738Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure
#739Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
#740Method of manufacturing wafer level package
#741Layered chip package and method of manufacturing same
#742SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME
#743Layered chip package and method of manufacturing same
#744Laminated semiconductor substrate, laminated chip package and method of manufacturing the same
#745Semiconductor device having a multilayer structure
#746Pad configurations for an electronic package assembly
#747PACKAGING METHOD OF SEMICONDUCTOR DEVICE
#748METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#749Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
#750Semiconductor integrated circuit having a multi-chip structure
#751Method for producing chip packages, and chip package produced in this way
#752Chip structure and process for forming the same
#753Semiconductor chip with post-passivation scheme formed over passivation layer
#754MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY
#755Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
#756Electronic device package and fabrication method thereof
#757Image sensor package and fabrication method thereof
#758METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#759CHIP PACKAGE
#760Circuit component with conductive layer structure
#761SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
#762Semiconductor device and penetrating electrode testing method
#763Light-emitting device, light-emitting element and method of manufacturing same
#764Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#765Method of fabricating a conductive post on an electrode
#766Chip package and method for forming the same
#767Semiconductor chip with a bonding pad having contact and test areas
#768Post passivation interconnection schemes on top of the IC chips
#769Chip package and fabrication method thereof
#770Semiconductor device having conductive pads and a method of manufacturing the same
#771Method for establishing and closing a trench of a semiconductor component
#772Chip package and fabrication method thereof
#773Bond pad connection to redistribution lines having tapered profiles
#774Semiconductor device and method for manufacturing the same
#775Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
#776Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
#777Semiconductor package and manufacturing method thereof
#778Microelectronic assemblies having compliant layers
#779Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
#780Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#781SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE
#782Reducing Device Mismatch by Adjusting Titanium Formation
#783Semiconductor module, method of manufacturing semiconductor module, and mobile device
#784Semiconductor device and method of manufacturing the same
#785Fabrication method of semiconductor device having conductive bumps
#786Robust FBEOL and UBM structure of C4 interconnects
#787Enhanced copper posts for wafer level chip scale packaging
#788Method of manufacturing semiconductor device
#789Self-aligned protection layer for copper post structure
#790Method of manufacturing wafer level device package
#791Chip package with heavily doped region and fabrication method thereof
#792Chip package with heavily doped regions and fabrication method thereof
#793Chip package and fabrication method thereof
#794Integrated circuit (IC) having TSVS with dielectric crack suppression structures
#795Method for producing substrate for mounting device and method for producing a semiconductor module
#796Packaged semiconductor chips
#797Semiconductor device and a method of manufacturing the same
#798Formation of TSV backside interconnects by modifying carrier wafers
#799Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#800Semiconductor device, and method of fabricating semiconductor device
#801Circuit Device and Method of Manufacturing Thereof
#802Semiconductor integrated circuit device
#803Semiconductor device
#804Semiconductor structure
#805SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#806Wafer backside structures having copper pillars
#807Method of making electronic device
#808Panel, semiconductor device and method for the production thereof
#809Integrated circuit chip using top post-passivation technology and bottom structure technology
#810Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#811Microelectronic assemblies having compliancy and methods therefor
#812Semiconductor apparatus and method of manufacturing semiconductor apparatus
#813METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#814Method of manufacturing ball grid array type semiconductor device
#815Method of manufacturing semiconductor device
#816Semiconductor package structure
#817Semiconductor module, method for manufacturing semiconductor module, and portable device
#818Multi-component integrated circuit contacts
#819Semiconductor package and method for manufacturing the same for decreasing number of processes
#820WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO
#821Solder bump confinement system for an integrated circuit package
#822Light sensor using wafer-level packaging
#823Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
#824Semiconductor device having sealing film and manufacturing method thereof
#825Electronic device package and fabrication method thereof
#826Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips
#827SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF
#828SEMICONDUCTOR DEVICE
#829Method for forming thin film resistor and terminal bond pad simultaneously
#830Method of forming bump structure having tapered sidewalls for stacked dies
#831DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE
#832Apparatus and method for packaging circuits
#833METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#834Semiconductor device with solder bump formed on high topography plated Cu pads
#835Semiconductor chip with through-silicon-via and sidewall pad
#836SEMICONDUCTOR DEVICE
#837Top layers of metal for high performance IC's
#838Component with Mechanically Loadable Connecting Surface
#839Semiconductor package, semiconductor module, and method for fabricating the semiconductor package
#840Bond pad connection to redistribution lines having tapered profiles
#841Zigzag pattern for TSV copper adhesion
#842Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
#843SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE
#844On-chip RF shields with front side redistribution lines
#845Packaging technology
#846System and process for fabricating semiconductor packages
#847Protecting sidewalls of semiconductor chips using insulation films
#848Method of manufacturing a semiconductor device
#849Light-emitting device, light-emitting element and method of manufacturing same
#850Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
#851Wafer level package and method of manufacturing the same
#852Methods of forming semiconductor constructions and assemblies
#853LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#854Semiconductor device
#855Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
#856SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#857Semiconductor device, through hole having expansion portion and thin insulating film
#858Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
#859Packaging conductive structure and method for forming the same
#860Chip package and method for fabricating the same
#861Packaging structural member
#862SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING
#863Wafer level edge stacking
#864Semiconductor chip having alignment mark and method of manufacturing the same
#865Silicon-on-insulator structures for through via in silicon carriers
#866Semiconductor package with joint reliability, entangled wires including insulating material
#867Semiconductor package and method for manufacturing semiconductor package
#868Top layers of metal for high performance IC's
#869Wafer level package and manufacturing method thereof
#870Printed circuit board comprising semiconductor chip and method of manufacturing the same
#871METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER
#872Wiring substrate and semiconductor package
#873WAFER LEVEL REDISTRIBUTION USING CIRCUIT PRINTING TECHNOLOGY
#874Semiconductor chip and method for fabricating the same
#875Semiconductor device and a semiconductor device manufacturing method
#876Semiconductor device and a method for manufacturing the same
#877Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same
#878Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponder
#879RELIABILITY WCSP LAYOUTS
#880Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining
#881Semiconductor device fabrication method
#882Solder ball attachment jig and method for manufacturing semiconductor device using the same
#883Integrated circuit system having different-size solder bumps and different-size bonding pads
#884Semiconductor device and method for manufacturing same
#885Method for mounting semiconductor device
#886CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME
#887Semiconductor integrated circuit device
#888Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween
#889Semiconductor device manufacturing method
#890RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME
#891SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE
#892Semiconductor device and a method of manufacturing the same
#893Image sensor having through via
#894Device mounting board and manufacturing method therefor, and semiconductor module
#895Method for manufacturing a wafer level package
#896SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#897Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#898Semiconductor device, circuit board, and electronic instrument
#899SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#900Semiconductor device and method of manufacturing the same