209404 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Redistribution layers [RDL] for bonding areas Manufacturing methods of the redistribution layers
METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE
#902Semiconductor chip, method of fabricating the same and semiconductor chip stack package
#903Wafer level chip scale packaging
#904Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes
#905Top layers of metal for high performance IC's
#906Low fabrication cost, high performance, high reliability chip scale package
#907Protected solder ball joints in wafer level chip-scale packaging
#908Manufacturing method of redistribution circuit structure
#909Method of manufacturing semiconductor device with through hole
#910Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
#911Back end integrated WLCSP structure without aluminum pads
#912Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#913Wafer-level chip scale package and method for fabricating and using the same
#914Method of manufacturing wafer level package
#915Semiconductor device having low dielectric insulating film and manufacturing method of the same
#916Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions
#917Method of manufacturing semiconductor device
#918Semiconductor device and methods of manufacturing semiconductor devices
#919Conductive metal structure applied to a module IC and method of manufacturing the same
#920Flip chip for electrical function test and manufacturing method thereof
#921Semiconductor integrated circuit device and method of fabricating the same
#922SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#923Semiconductor device and method for manufacturing the same
#924Electronic device wafer level scale packges and fabrication methods thereof
#925Top layers of metal for high performance IC's
#926Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device
#927Integrated circuit including parylene material layer
#928Image sensor package with trench insulator and fabrication method thereof
#929Semiconductor device and method of providing common voltage bus and wire bondable redistribution
#930SYSTEM IN PACKAGE AND METHOD FOR FABRICATING THE SAME
#931Semiconductor package and method for manufacturing the same for decreasing number of processes
#932SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#933SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER
#934SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR
#935Semiconductor device and method for manufacturing the same
#936Enhanced copper posts for wafer level chip scale packaging
#937Silicon-on-insulator structures for through via in silicon carriers
#938Semiconductor device and method of manufacturing same
#939Semiconductor device
#940Semiconductor device and method for manufacturing semiconductor device
#941Semiconductor device
#942Semiconductor chip with post-passivation scheme formed over passivation layer
#943Chip package
#944Top layers of metal for high performance IC's
#945Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#946Stackable semiconductor device and fabrication method thereof
#947Method of forming solder bump on high topography plated Cu
#948Method of manufacturing electronic device, substrate and semiconductor device
#949Semiconductor device manufacturing method and semiconductor device
#950Semiconductor module, method of manufacturing semiconductor module, and mobile device
#951Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof
#952Semiconductor device and manufacturing method thereof
#953Semiconductor module, portable device and method for manufacturing semiconductor module
#954Packaging conductive structure for a semiconductor substrate having a metallic layer
#955Panel, semiconductor device and method for the production thereof
#956Semiconductor device comprising electromigration prevention film and manufacturing method thereof
#957Bump structure and manufacturing method thereof
#958Integrated circuit package system with bump over via
#959Sensor semiconductor package and fabrication
#960MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#961SEMICONDUCTOR DEVICE
#962Redistribution circuit structure
#963Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
#964Voltage regulator integrated with semiconductor chip
#965Microelectronic assemblies having compliancy and methods therefor
#966Top layers of metal for high performance IC's
#967Chip structure and process for forming the same
#968Top layers of metal for high performance IC's
#969Top layers of metal for high performance IC's
#970Chip structure and process for forming the same
#971Chip structure and process for forming the same
#972SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LAYER OF SEMICONDUCTOR CHIP DIRECTLY CONTACTED WITH SUBSTRATE AND METHOD OF FABRICATING THE SAME
#973Post passivation interconnection schemes on top of the IC chips
#974Semiconductor chip and production process therefor
#975Chip structure and process for forming the same
#976Semiconductor device and manufacturing method of the same
#977Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
#978Semiconductor module, method for manufacturing semiconductor modules and mobile device
#979SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE
#980Chip structure and process for forming the same
#981Chip structure and process for forming the same
#982Systems and methods to passivate on-die redistribution interconnects
#983Top layers of metal for integrated circuits
#984Method for manufacturing semiconductor device
#985WAFER SCALE THIN FILM PACKAGE
#986Post passivation interconnection schemes on top of the IC chips
#987Packaged semiconductor chips
#988LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#989Low fabrication cost, high performance, high reliability chip scale package
#990Integrated circuit chips with fine-line metal and over-passivation metal
#991Low fabrication cost, high performance, high reliability chip scale package
#992Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
#993Low fabrication cost, high performance, high reliability chip scale package
#994Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
#995Method of fabricating semiconductor package structure
#996Top layers of metal for high performance IC's
#997Top layers of metal for high performance IC's
#998Integrated circuit chips with fine-line metal and over-passivation metal
#999INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#1000Integrated circuit chips with fine-line metal and over-passivation metal
#1001Integrated circuit chips with fine-line metal and over-passivation metal
#1002Integrated circuit chips with fine-line metal and over-passivation metal
#1003INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#1004Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#1005Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same
#1006Semiconductor device having sealing film and manufacturing method thereof
#1007Method for fabricating resin-molded semiconductor device having posts with bumps
#1008Wafer level chip package and a method of fabricating thereof
#1009Wafer level chip scale package and method for manufacturing the same
#1010Semiconductor device and method of producing the same
#1011Semiconductor chip and method for fabricating the same
#1012Apparatus and method for packaging circuits
#1013Top layers of metal for high performance IC's
#1014Chip structure and process for forming the same
#1015Top layers of metal for high performance IC's
#1016Top layers of metal for high performance IC's
#1017Chip structure and process for forming the same
#1018Top layers of metal for integrated circuits
#1019Chip package and method for fabricating the same
#1020Semiconductor device and method for manufacturing the same
#1021Methods and apparatus for packaging integrated circuit devices
#1022Method for producing chip packages, and chip package produced in this way
#1023Semiconductor device and method of producing the same
#1024Electronic device with EMI screen and packing process thereof
#1025Semiconductor constructions and assemblies, and electronic systems
#1026Top layers of metal for high performance IC's
#1027Top layers of metal for high performance IC's
#1028Top layers of metal for high performance IC's
#1029Top layers of metal for high performance IC's
#1030Top layers of metal for high performance IC's
#1031Top layers of metal for high performance IC's
#1032Top layers of metal for high performance IC's
#1033Top layers of metal for high performance IC's
#1034Top layers of metal for high performance IC's
#1035Top layers of metal for high performance IC's
#1036Top layers of metal for high performance IC's
#1037Top layers of metal for high performance IC's
#1038Top layers of metal for high performance IC's
#1039Top layers of metal for high performance IC's
#1040Top layers of metal for high performance IC's
#1041Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#1042Top layers of metal for high performance IC's
#1043Top layers of metal for high performance IC's
#1044Top layers of metal for high performance IC's
#1045Top layers of metal for high performance IC's
#1046Top layers of metal for high performance IC's
#1047Top layers of metal for high performance IC's
#1048Top layers of metal for high performance IC's
#1049Top layers of metal for high performance IC's
#1050Top layers of metal for high performance IC's
#1051Top layers of metal for high performance IC's
#1052Top layers of metal for high performance IC's
#1053Top layers of metal for high performance IC's
#1054Top layers of metal for high performance IC's
#1055Top layers of metal for high performance IC's
#1056Top layers of metal for high performance IC's
#1057Top layers of metal for high performance IC's
#1058Top layers of metal for high performance IC's
#1059Top layers of metal for high performance IC's
#1060Semiconductor device and method for fabricating the same
#1061Non-cyanide gold electroplating for fine-line gold traces and gold pads
#1062Top layers of metal for high performance IC's
#1063Top layers of metal for high performance IC's
#1064Top layers of metal for high performance IC's
#1065Top layers of metal for high performance IC's
#1066Top layers of metal for high performance IC's
#1067Top layers of metal for high performance IC's
#1068Top layers of metal for high performance IC's
#1069Top layers of metal for high performance IC's
#1070Top layers of metal for high performance IC's
#1071Top layers of metal for high performance IC's
#1072Semiconductor device having low dielectric insulating film and manufacturing method of the same
#1073Wafer level semiconductor chip packages and methods of making the same
#1074Top layers of metal for high performance IC's
#1075Top layers of metal for high performance IC's
#1076Top layers of metal for high performance IC's
#1077Top layers of metal for high performance IC's
#1078Top layers of metal for high performance IC's
#1079Top layers of metal for high performance IC's
#1080Top layers of metal for high performance IC's
#1081Process for bonding and electrically connecting microsystems integrated in several distinct substrates
#1082Method of wafer level chip size packaging
#1083Conductive structures including titanium-tungsten base layers
#1084Semiconductor apparatus and method of producing the same
#1085Semiconductor device and method of producing the same
#1086Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#1087Fabrication method of semiconductor integrated circuit device
#1088Carbon nanotube via interconnect
#1089High-performance semiconductor package
#1090Method for fabricating a BGA device and BGA device
#1091Post passivation interconnection schemes on top of the IC chips
#1092Semiconductor device and manufacturing method for the same
#1093Semiconductor package having an optical device and a method of making the same
#1094Semiconductor device and method for manufacturing the semiconductor device
#1095Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
#1096Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#1097Methods of forming metal layers using multi-layer lift-off patterns
#1098Solder bump confinement system for an integrated circuit package
#1099Method of fabricating wafer level package
#1100Electronic devices including solder bumps on compliant dielectric layers
#1101Wafer level package having floated metal line and method thereof
#1102Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#1103WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME
#1104Semiconductor chip with bond area
#1105Compliant terminal mountings with vented spaces and methods
#1106Compliant terminal mountings with vented spaces and methods
#1107Methods of fabricating interconnects for semiconductor components
#1108Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#1109Methods and apparatus for packaging integrated circuit devices
#1110METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE
#1111Semiconductor device and method for manufacturing same, and semiconductor wafer
#1112Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#1113Semiconductor chip having bond pads
#1114Semiconductor chip having bond pads
#1115Wafer level chip scale packaging structure and method of fabricating the same
#1116Wafer level package having redistribution interconnection layer and method of forming the same
#1117Semiconductor chip having bond pads
#1118Fine pitch interconnect and method of making
#1119Semiconductor chip with post-passivation scheme formed over passivation layer
#1120Method for forming solder contacts on mounted substrates
#1121Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
#1122Semiconductor device with pad electrode for testing and manufacturing method of the same
#1123Integrated circuit solder bumping system
#1124Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
#1125Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#1126Routing under bond pad for the replacement of an interconnect layer
#1127Semiconductor chip having bond pads
#1128Semiconductor chip having bond pads and multi-chip package
#1129Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#1130Method for forming a double embossing structure
#1131Semiconductor device with reduced thickness of the semiconductor substrate
#1132Semiconductor device and method of manufacturing the same
#1133Semiconductor device electronic component, circuit board, and electronic device
#1134Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#1135Metal pad or metal bump over pad exposed by passivation layer
#1136Bonding pad on IC substrate and method for making the same
#1137Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#1138Multi-component integrated circuit contacts
#1139Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#1140SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME
#1141Method of manufacturing a semiconductor device
#1142Microelectronic assemblies having compliant layers
#1143Circuit device and method of manufacturing thereof
#1144Bond pad structure comprising multiple bond pads with metal overlap
#1145Method of making the semiconductor device, circuit board, and electronic instrument
#1146Semiconductor device having a leading wiring layer
#1147Apparatus for conducting heat in a flip-chip assembly
#1148Microelectronic assemblies having compliant layers
#1149Semiconductor device and fabrication method thereof
#1150Semiconductor device and method of manufacturing the same
#1151Semiconductor device having a functional surface
#1152Semiconductor device with via hole for electric connection
#1153METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME
#1154Semiconductor package having an optical device and a method of making the same
#1155Microelectronic assemblies having compliancy
#1156Semiconductor device and manufacturing method thereof
#1157Semiconductor device and manufacturing method of the same
#1158Apparatus for plating a semiconductor wafer and plating solution bath used therein
#1159Method of metal sputtering for integrated circuit metal routing
#1160Semiconductor devices having post passivation interconnections and a buffer layer
#1161Semiconductor device and fabrication method thereof
#1162Semiconductor device and fabrication method thereof
#1163Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
#1164Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#1165Method for re-routing lithography-free microelectronic devices
#1166Method of manufacturing semiconductor device and support structure for semiconductor substrate
#1167Method and apparatus for polymer dielectric surface recovery by ion implantation
#1168Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
#1169Semiconductor device with penetrating electrode
#1170Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#1171Wiring board and method for producing same
#1172Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#1173Semiconductor device, circuit board, electro-optic device, electronic device
#1174Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
#1175Semiconductor device and method of manufacturing the same
#1176Method for fabricating packaged die
#1177Chip scale package with micro antenna and method for manufacturing the same
#1178Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
#1179Method of forming electrode for semiconductor device
#1180Semiconductor device manufacturing method
#1181Top layers of metal for integrated circuits
#1182Wafer level packages and methods of fabrication
#1183Top layers of metal for high performance IC's
#1184Semiconductor device and method for fabricating the same
#1185Top layers of metal for high performance IC's
#1186Semiconductor and method for producing a semiconductor
#1187Electrode structure of a semiconductor device and method of manufacturing the same
#1188Manufacturing method of semiconductor device
#1189Method for fabricating pad redistribution layer
#1190Method of manufacturing semiconductor device
#1191Top layers of metal for high performance IC's
#1192Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#1193Semiconductor integrated circuit device
#1194Multi-component integrated circuit contacts
#1195Manufacturing method of semiconductor device
#1196Top layers of metal for high performance IC's
#1197Method of manufacturing semiconductor device and support structure for semiconductor substrate
#1198Chip structure and process for forming the same
#1199Semiconductor device and method of manufacturing the same
#1200Top layers of metal for high performance IC's