Substrate with lossy material insert

Method of making multi-chip electronic package with reduced line skew

Method of manufacturing printed circuit board

Bonding structure and fabrication thereof

Laminated bond of multilayer circuit board having embedded chips

High-contrast laser mark on substrate surfaces

Variation of Conductive Cross Section and/or Material to Enhance Performance and/or Reduce Material Consumption of Electronic Assemblies

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor device

Solder pillar bumping and a method of making the same

Semiconductor device and a method of manufacturing the same

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Array quad flat no-lead package and method of forming same

Semiconductor integrated circuit and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

Flip chip metallization method and devices

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronics module and method for manufacturing the same

Light-Emitting Device

High performance system-on-chip using post passivation process

Semiconductor mounting substrate and method for manufacturing the same

CHIP STRUCTURE AND WAFER STRUCTURE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Packaging for high power integrated circuits

Cooled Integrated Circuit

Continuously Referencing Signals over Multiple Layers in Laminate Packages

Semiconductor device with recess portion over pad electrode

Audio Processing Device with Encapsulated Electronic Component

Light emitting chip package and manufacturing method thereof

Probe arrays and method for making

Multilayer circuit board and manufacturing method thereof

Systems and methods for providing two phase cooling

Terminal pad structures and methods of fabricating same

Composite solder TIM for electronic package

Method for fabricating heat dissipating package structure

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Stacked Modules and Method

Substrate with heat-dissipating dummy pattern for semiconductor packages

Circuit board assembly

Semiconductor device and method for manufacturing the same

Stacked Modules and Method

Semiconductor device having a specified terminal layout pattern

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

CHIP WITH BUMP STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Stacked modules and method

Semiconductor package preventing generation of static electricity therein

Materials, structures and methods for microelectronic packaging

Semiconductor device and method for producing the same

Bumping electronic components using transfer substrates

Memory management method and system

Package for an implantable neural stimulation device

3D chip arrangement including memory manager

Microbump function assignment in a buck converter

ELECTRONIC APPARATUS

Conductive heat transport cooling system and method for a multi-component electronics system

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Semiconductor device

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUFACTURING METHOD THEREOF

Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins

Electronic device including a nickel-palladium alloy layer

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

LAYER FOR CHIP CONTACT ELEMENT

Electronic device and method of manufacturing the same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Focused stress relief using reinforcing elements

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Circuit board arrangement and method for producing a circuit board arrangement

Embedded array capacitor with side terminals

Semiconductor-embedded substrate and manufacturing method thereof

Micro-via structure design for high performance integrated circuits

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Reworkable passive element embedded printed circuit board

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Wire Bump Material

Optical interconnect device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device having sealing film and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Sintered metallic thermal interface materials for microelectronic cooling assemblies

Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies

ELECTRONIC DEVICE AND PRODUCTION METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Variable depth microchannels

Method for fabricating resin-molded semiconductor device having posts with bumps

Set of resin compositions for preparing system-in-package type semiconductor device

Circuit module with interposer and method for manufacturing the same

Semiconductor light-emitting device with improved heatsinking

Semiconductor apparatus and method of producing the same

Integrated circuit package system with encapsulation lock

Method and apparatus for prevention of solder corrosion

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Electrical interconnection structure formation

Semiconductor device and method for manufacturing the same

Via structure

Wafer level chip package and a method of fabricating thereof

Stacked die semiconductor device having circuit tape

Integrated circuit devices with multi-dimensional pad structures

METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR

Packaged microelectronic components with terminals exposed through encapsulant

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Chip Comprising at Least One Test Contact Configuration

Electronic packages with fine particle wetting and non-wetting zones

Process for manufacturing semiconductor devices

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

Method for manufacturing semiconductor device

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Vapor heat spreader

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Wafer level chip scale package and method for manufacturing the same

Structure of mounting electronic component

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Shielding noisy conductors in integrated passive devices

Underfill for light emitting device

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER

Package for an implantable neural stimulation device

Flexible core for enhancement of package interconnect reliablity

Method of manufacturing a combined multilayer circuit board having embedded chips

Three-Dimensional Memory Module (3D-MM) Excelling Contemporary Micro-Drive (CMD)

Electronic part module and method of making the same

Component embedded printed circuit board

Passive component and electronic component module

IC package with a protective encapsulant and a stiffening encapsulant

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same

Semiconductor device and method of producing the same

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Structure of wafer level package with area bump

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor chip and method for fabricating the same

Method for implementing component placement suspended within grid array packages for enhanced electrical performance

MULTI-CHIP ASSEMBLY

Flexible core for enhancement of package interconnect reliability

Chip package and method for fabricating the same

Multi-chip package with spacer for blocking interchip heat transfer

Semiconductor package

Semiconductor light emitting device

Microball placement solutions

Printed wiring board

Method of manufacturing a component-embedded printed circuit board

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Adhesion by plasma conditioning of semiconductor chip

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Multilayer printed wiring board

Multilayered printed wiring board

Multi-chip module

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Semiconductor device and fabricating method thereof

Stacked structure of chips and water structure for making the same

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Module and mounted structure using the same

Method and flip chip structure for power devices

Image sensor

Method for step-down transition of a solder head in the injection molding soldering process

Apparatus and method for bonding anisotropic conductive film using laser beam

Planar array contact memory cards

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Top layers of metal for integrated circuits

Semiconductor device and method for manufacturing same

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Circuit substrate and semiconductor device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Post passivation interconnection schemes on top of the IC chips

High performance system-on-chip using post passivation process

Semiconductor chip structure

Structure for bumped wafer test

High performance system-on-chip using post passivation process

REINFORCED SEMICONDUCTOR PACKAGE AND STIFFENER THEREOF

Chip package structure and circuit board thereof

Stackable semiconductor package

Stacked semiconductor components with through wire interconnects (TWI)

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Contact array layout for improving ESD capability of CMOS transistors

Chip package and method for fabricating the same

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

Light emitting diode package and fabrication method thereof

Component arrangement provided with a carrier substrate

Microphone module and method for fabricating the same

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device

Functional device-mounted module and a method for mounting functional device-mounted module

Semiconductor integrated circuit device

Semiconductor device and method for manufacturing the same

Laser release process for very thin Si-carrier build

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Interconnection structure of integrated circuit chip

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

Package structure and heat sink module thereof

Integrated chip carrier with compliant interconnect

Package substrate

Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Chip scale package for power devices and method for making the same

Light emitting device package and method for manufacturing the same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Mold compound cap in a flip chip multi-matrix array package and process of making same

Structure and method of making sealed capped chips

Reliability enhancement process

Method for fabricating chip-stacked semiconductor package

Semiconductor device with stacked chips and method for manufacturing thereof

High capacity thin module system and method

High capacity thin module system and method

Multi-layered printed circuit board

Side connectors for RFID chip

EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP

Solder Interconnect Joints For A Semiconductor Package

Versatile Si-based packaging with integrated passive components for mmWave applications

Integrated circuit package system employing wafer level chip scale packaging

Integrated circuit package-on-package stacking system

Semiconductor device and method of manufacturing the same

Electrical through contact

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Methods of forming electronic structures including conductive shunt layers and related structures

Solder Ball Pad Structure

Electronic packages with roughened wetting and non-wetting zones

Method and architecture for power management of an electronic device

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Microelectronic device connection structure

Silicon-based thin substrate and packaging schemes

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device with interface peeling preventing rewiring layer

Solder bumps in flip-chip technologies

Contact structure having a compliant bump and a test pad

Semiconductor device and manufacturing method for the same

Substrate and process for semiconductor flip chip package

Semiconductor device having bumps in a same row for staggered probing

Multi-die DC-DC boost power converter with efficient packaging

Double-sided die

Package for housing light-emitting element and method for manufacturing package for housing light-emitting element

Bonding apparatus

Substrate having stiffener fabrication method

Electronic component module and radio comunications equipment

Leaded stacked packages having elevated die paddle

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device

Semiconductor device with reduced contact resistance

BLM structure for application to copper pad

CAPILLARY UNDERFILL AND MOLD ENCAPSULATION METHOD AND APPARATUS

Stack type semiconductor package and method of fabricating the same

Pillar Bump Package Technology

Methods and apparatus for packaging integrated circuit devices

Method, device and system for controlling heating circuits

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Semiconductor device and manufacturing method for the same

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

Chip scale package (CSP) assembly apparatus and method

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Integrated circuit module

Heat treatment jig and heat treatment jig set

Electronic package with epoxy or cyanate ester resin encapsulant

Aligned nanotube bearing composite material

Method for forming a molded circuit board

Wiring substrate, semiconductor device, and method of manufacturing the same

Chip structure with redistribution traces

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Cooling module against ESD and electronic package, assembly and system using the same

Integrated circuit heat spreader stacking method