PACKAGE AND METHOD FOR MAKING THE SAME

Injection molded soldering process and arrangement for three-dimensional structures

Microelectromechanical system package

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Electronic device with connection bumps

Electromagnetic bandgap structure and printed circuit board

System and method for separating and packaging integrated circuits

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method of fabricating a semiconductor device employing electroless plating

Fabrication method of semiconductor package

Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween

Localized alloying for improved bond reliability

FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE

System in package device

Wafer level CSP packaging concept

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Semiconductor package with electromagnetic shielding capabilities

DEVICES FOR COOLING AND POWER

Manufacturing method of semiconductor device

Stress free package and laminate-based isolator package

PHOTOELECTRONIC WIRED FLEXIBLE PRINTED CIRCUIT BOARD USING OPTICAL FIBER

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Driver chip and display apparatus having the same

Wireless chip and electronic device having wireless chip

SEMICONDUCTOR DEVICE

Chip having side pad, method of fabricating the same and package using the same

Semiconductor device

Semiconductor structure and method for forming the same

Heat sink with preattached thermal interface material and method of making same

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing

Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging

Semiconductor device having a high frequency electrode positioned with a via hole

Method of manufacturing an RFID tag

Semiconductor integrated circuit device including wiring lines and interconnections

Semiconductor device

Embedded waveguide and embedded electromagnetic shielding

Microminiature power converter

Direct Die Attachment

Circuit substrate and the semiconductor package having the same

Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device

Semiconductor package and method of manufacturing the same

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor device and manufacturing method thereof

Semiconductor device and package including the same

Bump structure with annular support

Redistribution circuit structure

System-in-package packaging for minimizing bond wire contamination and yield loss

Stacked integrated circuit package system and method of manufacture therefor

SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Under bump metallurgy structure of a package and method of making same

MOSFET package

Optical semiconductor package having an optical module with a progressively varying refractive index

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Power MOSFET wafer level chip-scale package

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

METAL-GRAPHITE FOAM COMPOSITE AND A COOLING APPARATUS FOR USING THE SAME

Illumination System Comprising Ceramic Luminescence Converter

Electronic component built-in substrate and method for manufacturing the same

DISPLAY DEVICE

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

INJECTION MOLDED SOLDER BALL METHOD

Heat dissipating semiconductor package

Semiconductor package, manufacturing method thereof and IC chip

STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME

Method of packaging semiconductor devices

Method for reduction of soft error rates in integrated circuits

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Isolation structures for CMOS image sensor chip scale packages

Component mounting apparatus

Copper-elastomer hybrid thermal interface material to cool under-substrate silicon

Heat transfer device in a rotating structure

Stacked type chip package structure

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE

HEAT TRANSFER APPARATUS CONTAINING A COMPLIANT FLUID FILM INTERFACE AND METHOD THEREFOR

CHIP STACK WITH PRECISION ALIGNMENT, HIGH YIELD ASSEMBLY AND THERMAL CONDUCTIVITY

Semiconductor device package having pseudo chips

Flip-chip packages allowing reduced size without electrical shorts and methods of manufacturing the same

Wafer level package with die receiving through-hole and method of the same

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Semiconductor components having through interconnects

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Package on package design to improve functionality and efficiency

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES

Heat dissipation semiconductor pakage

Ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages

Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device

Strip patterned transmission line

Manufacturing method of chip package

Semiconductor device and method of manufacturing the same

Integrated circuit package with molded cavity

Stacked packages with bridging traces

Package structures

Array capacitor for decoupling multiple voltages

METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING

Package level noise isolation

Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor

Integrated circuits and interconnect structure for integrated circuits

Fluorination pre-treatment of heat spreader attachment indium thermal interface material

Transfer assembly for manufacturing electronic devices

Semiconductor chip and method of manufacturing semiconductor chip

Fabrication for electroplating thick metal pads

Semiconductor device and method of forming passive devices

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY

Thinned die integrated circuit package

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

Flip chip mounting method by no-flow underfill

Flip chip mounting method by no-flow underfill having level control function

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Method of making circuitized substrate with a resistor

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Voltage regulator integrated with semiconductor chip

Carrier structure embedded with semiconductor chips and method for manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor device and method of protecting passivation layer in a solder bump process

Semiconductor device and manufacturing method of the same

Stacked-die packages with silicon vias and surface activated bonding

High surface area aluminum bond pad for through-wafer connections to an electronic package

Heat dissipating chip structure and fabrication method thereof and package having the same

Microelectronic assemblies having compliancy and methods therefor

ELECTRONIC COMPONENT

Microelectronic packages having improved input/output connections and methods therefor

Flip chip shielded RF I/O land grid array package

Method for incorporating existing silicon die into 3D integrated stack

Process for making contact with and housing integrated circuits

Semiconductor device

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Multilayer wiring board and power supply structure to be embedded in multilayer wiring board

Method of manufacturing multi-layer printed circuit board

Integrated circuit device mounting with folded substrate and interposer

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Method for fabricating a circuit component

Increasing the resistance of a high frequency input/output power delivery decoupling path

Method of manufacturing wafer level chip size package

Semiconductor package, manufacturing method thereof and IC chip

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Electronic package

Controlling flow of underfill using polymer coating and resulting devices

Thin passivation layer on 3D devices

DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Chip structure and process for forming the same

Semiconductor device

Chip package

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Heat-dissipating structure and heat-dissipating semiconductor package having the same

Multi-chip package having two or more heat spreaders

SEMICONDUCTOR DEVICE

Semiconductor package

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Stacked package and method for manufacturing the package

Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate

Semiconductor device package diepad having features formed by electroplating

Semiconductor component with through-vias

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Integrated Circuit Packaging Using Electrochemically Fabricated Structures

Wiring board manufacturing method

Semiconductor chip and production process therefor

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

Wafer bonding method of system in package

Die positioning for packaged integrated circuits

Chip scale package structure with metal pads exposed from an encapsulant

Microelectronic substrate including embedded components and spacer layer and method of forming same

Liquid metal thermal interface material system

Semiconductor device

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Chip structure and process for forming the same

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Structure and process for WL-CSP with metal cover

Method for manufacturing semiconductor device and semiconductor device

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Semiconductor device with hollow structure

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Multi-layer semiconductor package

PACKAGE DEVICE

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

Light emitting chip package and light source module

Semiconductor wafer

Modular sensor assembly and methods of fabricating the same

Apparatus and process for precise encapsulation of flip chip interconnects

Reverse build-up process for fine bump pitch approach

Electronic packages and components thereof formed by co-deposited carbon nanotubes

Microchip assembly including an inductor and fabrication method

Method and apparatus for supporting a computer chip on a printed circuit board assembly

Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting

Semiconductor device and manufacturing method therefor

Semiconductor device including microstrip line and coplanar line

Semiconductor package and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Post passivation interconnection process and structures

Semiconductor device and manufacturing method thereof

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Heat spreader for a multi-chip package

Wafer applied thermal-mechanical interface

Intergrated Circuits Device Having a Reinforcement Structure

Stacked die package

High I/O semiconductor chip package and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Carrier structure embedded with semiconductor chip

Embedded array capacitor with top and bottom exterior surface metallization

Solid-state imaging device

Low thermal resistance high power LED

Flip-chip mounting resin composition and bump forming resin composition

Compact chip package macromodels for chip-package simulation

Method for decapsulating package

Chip structure and process for forming the same

Method of disposing and arranging dummy patterns

Stacked structures and methods of fabricating stacked structures

Method and apparatus for linear die transfer

Reduction of damage to thermal interface material due to asymmetrical load

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

Multilayer wiring board and its manufacturing method

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Slim design main board

ELECTRODE, DEVICE AND ELECTRONIC APPARATUS HAVING THE DEVICE

Radio frequency identification (RFID) tag and manufacturing method thereof

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES

Silica nanoparticles thermoset resin compositions

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

METHOD OF FORMING METAL LAYER WIRING STRUCTURE ON BACKSIDE OF WAFER, METAL LAYER WIRING STRUCTURE FORMED USING THE METHOD, METHOD OF STACKING CHIP PACKAGE, AND CHIP PACKAGE STACK STRUCTURE FORMED USING THE METHOD

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Rotation joint and semiconductor device having the same

Chip structure and process for forming the same

Solder bump structure and method of manufacturing same

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Systems and methods to passivate on-die redistribution interconnects

Heat dissipating semiconductor package and fabrication method therefor

Semiconductor device

STACKED CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Collective and synergistic MRAM shields

Top layers of metal for integrated circuits

Stacked Modules and Method

Method of making a contact on a backside of a die

Method for manufacturing semiconductor device with reduced damage to metal wiring layer

Method for manufacturing semiconductor device

Wire and solder bond forming methods

Wire and solder bond forming methods

WAFER SCALE THIN FILM PACKAGE

Method of packaging a semiconductor device and a prefabricated connector

Electronic component and method for manufacturing the same

Information handling system utilizing circuitized substrate with split conductive layer

Acoustic wave device

CONDUCTOR POLYMER COMPOSITE CARRIER WITH ISOPROPERTY CONDUCTIVE COLUMNS

Methods for manufacturing thermally enhanced flip-chip ball grid arrays

MULTI-CHIP STRUCTURE

Self-aligned through vias for chip stacking

Semiconductor package and fabrication method thereof

Heatplates for heatsink attachment for semiconductor chips

Embedded chip package with improved heat dissipation performance and method of making the same

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Electronic component and method for manufacturing the same

Chip carrier film having leads with improved strength and semiconductor package utilizing the film

Semiconductor package having improved heat spreading performance

Package structure of memory card and manufacturing method thereof

Packaged semiconductor chips

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Low fabrication cost, high performance, high reliability chip scale package

ELECTRONIC DEVICE

Systems and arrangements to assess thermal performance

Memory module and memory device

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor device and method for manufacturing same

High performance system-on-chip using post passivation process

Integrated circuit chips with fine-line metal and over-passivation metal

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor package

Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same

Integration using package stacking with multi-layer organic substrates

Bridge stack integrated circuit package system

Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus

Precision high-frequency capacitor formed on semiconductor substrate

Method for producing color-converting light-emitting device using electrophoresis

Wiring board and method of manufacturing the same

SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP

Electronic Device, a Chip Contacting Method and a Contacting Device

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Semiconductor assembly with one metal layer after base metal removal

Semiconductor device and manufacturing method of the same

Fan out type wafer level package structure and method of the same

Stacked integrated circuit package-in-package system

Semiconductor element and process of manufacturing semiconductor element

Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips

Solder ball mounting method and solder ball mounting apparatus

Solder ball mounting method and solder ball mounting substrate manufacturing method