209522 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
Semiconductor component and method for producing the same
#9902Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same
#9903Methods and apparatus for packaging integrated circuit devices
#9904Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods
#9905Method for the packaging of optical or optoelectronic components, and optical or optoelectronic package element producible according to the method
#9906Two component photodiode detector
#9907Build-up printed wiring board substrate having a core layer that is part of a circuit
#9908Underfill and mold compounds including siloxane-based aromatic diamines
#9909Arrangement for solder bump formation on wafers
#9910Compressible films surrounding solder connectors
#9911PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME
#9912Direct-type backlight unit having surface light source
#9913Electronic device with EMI screen and packing process thereof
#9914Package board integrated with power supply
#9915Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#9916Superfine-circuit semiconductor package structure
#9917Heat-dissipating package structure and fabrication method thereof
#9918Semiconductor constructions and assemblies, and electronic systems
#9919Package mounted module
#9920Integrated circuit packaging system with ultra-thin die
#9921Semiconductor package, method of production of same, printed circuit board, and electronic apparatus
#9922Semiconductor device
#9923Sub-mount for mounting light emitting device and light emitting device package
#9924Wiring board and semiconductor device excellent in folding endurance
#9925THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS
#9926Method of providing mixed size solder bumps on a substrate using a solder delivery head
#9927Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#9928Semiconductor package substrate for flip chip packaging
#9929Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method
#9930Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
#9931Detachable stiffener for ultra-thin die
#9932Method for fabricating a wafer level package with device wafer and passive component integration
#9933Wafer-level bonding for mechanically reinforced ultra-thin die
#9934Wafer-level assembly of heat spreaders for dual IHS packages
#9935RFID tag manufacturing methods and RFID tags
#9936Integrated microelectronic package temperature sensor
#9937Substrate with stiffener and manufacturing method thereof
#9938Defining pin functionality at device power on
#9939Illumination Device and Display Device Using Illumination Device
#9940Integrated circuit incorporating wire bond inductance
#9941Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation
#9942Flip-chip package structure with stiffener
#9943Semiconductor device comprising chip on chip structure
#9944Integrated circuit (IC) chip and method for fabricating the same
#9945Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#9946Semiconductor package system and method of improving heat dissipation of a semiconductor package
#9947Planar array contact memory cards
#9948Semiconductor package having optimal interval between bond fingers for reduced substrate size
#9949Flipped, stacked-chip IC packaging for high bandwidth data transfer buses
#9950Heat spreader as mechanical reinforcement for ultra-thin die
#9951SINGLE PACKAGE DETECTOR AND DIGITAL CONVERTER INTEGRATION
#9952COMPLIANT ELECTRICAL CONTACTS
#9953Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#9954SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#9955Package Using Selectively Anodized Metal and Manufacturing Method Thereof
#9956Three dimensional integrated circuit and method of making the same
#9957Semiconductor package including connector disposed in troughhole
#99583D electronic packaging structure having a conductive support substrate
#9959RF INTEGRATED CIRCUIT WITH ESD PROTECTION AND ESD PROTECTION APPARATUS THEREOF
#9960Semiconductor device, manufacturing method and apparatus for the same
#9961Multilayer printed wiring board
#9962Top layers of metal for high performance IC's
#9963Top layers of metal for high performance IC's
#9964Top layers of metal for high performance IC's
#9965Top layers of metal for high performance IC's
#9966Top layers of metal for high performance IC's
#9967Top layers of metal for high performance IC's
#9968Top layers of metal for high performance IC's
#9969Top layers of metal for high performance IC's
#9970Top layers of metal for high performance IC's
#9971Top layers of metal for high performance IC's
#9972Top layers of metal for high performance IC's
#9973Top layers of metal for high performance IC's
#9974Top layers of metal for high performance IC's
#9975Top layers of metal for high performance IC's
#9976Structure and method for producing multiple size interconnections
#9977Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#9978Semiconductor device and method for manufacturing same
#9979Top layers of metal for high performance IC's
#9980Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#9981Composition for removing a photoresist and method of forming a bump electrode
#9982METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
#9983Methods of forming solder connections and structure thereof
#9984Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#9985Chip and flat panel display apparatus comprising the same
#9986Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#9987Top layers of metal for high performance IC's
#9988Top layers of metal for high performance IC's
#9989Top layers of metal for high performance IC's
#9990Top layers of metal for high performance IC's
#9991Integrated circuit having improved interconnect structure
#9992Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#9993Semiconductor device having improved contacts
#9994Top layers of metal for high performance IC's
#9995Integrated circuit (IC) carrier assembly incorporating serpentine suspension
#9996Semiconductor device and method for producing the semiconductor device
#9997Semiconductor integrated circuit device, and method of designing and manufacturing the same
#9998Semiconductor device
#9999Interconnections resistant to wicking
#10000Assembly and method of assembling by soldering an object and a support
#10001HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#10002Method of fabricating circuit board having different electrical connection structures
#10003Top layers of metal for high performance IC's
#10004Top layers of metal for high performance IC's
#10005Top layers of metal for high performance IC's
#10006Top layers of metal for high performance IC's
#10007Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#10008METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#10009Microelectronic element chips
#10010Top layers of metal for high performance IC's
#10011Top layers of metal for high performance IC's
#10012Top layers of metal for high performance IC's
#10013Top layers of metal for high performance IC's
#10014Top layers of metal for high performance IC's
#10015Top layers of metal for high performance IC's
#10016Top layers of metal for high performance IC's
#10017Top layers of metal for high performance IC's
#10018Top layers of metal for high performance IC's
#10019Semiconductor device and method for fabricating the same
#10020Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the Same
#10021Chip stack, method of fabrication thereof, and semiconductor package having the same
#10022Modular bonding pad structure and method
#10023Stacked package electronic device
#10024Microelectronic package having solder-filled through-vias
#10025Barrier layer for fine-pitch mask-based substrate bumping
#10026Non-cyanide gold electroplating for fine-line gold traces and gold pads
#10027Top layers of metal for high performance IC's
#10028Top layers of metal for high performance IC's
#10029Top layers of metal for high performance IC's
#10030Top layers of metal for high performance IC's
#10031Top layers of metal for high performance IC's
#10032Top layers of metal for high performance IC's
#10033Top layers of metal for high performance IC's
#10034Top layers of metal for high performance IC's
#10035Top layers of metal for high performance IC's
#10036Top layers of metal for high performance IC's
#10037WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
#10038Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#10039Semiconductor device having low dielectric insulating film and manufacturing method of the same
#10040Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#10041Wafer level semiconductor chip packages and methods of making the same
#10042Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package
#10043Integrated circuit having stress tuning layer
#10044Top layers of metal for high performance IC's
#10045Method for fabricating three-dimensional all organic interconnect structures
#10046Micro-package, multi-stack micro-package, and manufacturing method therefor
#10047Method for fabricating semiconductor package with multi-layer die contact and external contact
#10048SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#10049Semiconductor Device and Method of Fabricating the Same
#10050Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements
#10051Semiconductor device and method of producing the same
#10052Top layers of metal for high performance IC's
#10053Top layers of metal for high performance IC's
#10054Top layers of metal for high performance IC's
#10055Top layers of metal for high performance IC's
#10056Top layers of metal for high performance IC's
#10057Top layers of metal for high performance IC's
#10058Stacked bump structure and manufacturing method thereof
#10059COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#10060Method of fabricating microelectronic devices
#10061Devices and systems having at least one dam structure
#10062Increased interconnect density electronic package and method of fabrication
#10063Methods of forming blind wafer interconnects, and related structures and assemblies
#10064Semiconductor device including a buffer layer structure for reducing stress
#10065Wafer level stack structure for system-in-package and method thereof
#10066Process for bonding and electrically connecting microsystems integrated in several distinct substrates
#100673D interconnect with protruding contacts
#10068Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown
#10069Method for forming C4 connections on integrated circuit chips and the resulting devices
#10070Polymer matrices for polymer solder hybrid materials
#10071Semiconductor device and method of manufacturing the same
#10072Semiconductor device with via hole of uneven width
#10073Semiconductor device and method of manufacturing the semiconductor device
#10074Method of making circuitized substrate with internal organic memory device
#10075Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip
#10076Semiconductor device and method of manufacturing the same
#10077Semiconductor components having encapsulated through wire interconnects (TWI)
#10078Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#10079Embedded integrated circuit package system
#10080Method of manufacturing a through electrode
#10081Method of wafer level chip size packaging
#10082Conductive structures including titanium-tungsten base layers
#10083Direct-write wafer level chip scale package
#10084MULTICHIP PACKAGE SYSTEM
#10085Alternative flip chip in leaded molded package design and method for manufacture
#10086Semiconductor device and method of producing the same
#10087NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
#10088Apparatuses and methods to enhance passivation and ILD reliability
#10089Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#10090Hybrid stacking package system
#10091INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
#10092High frequency IC package and method for fabricating the same
#10093Semiconductor module having discrete components and method for producing the same
#10094ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#10095SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION
#10096Multichip package system
#10097Semiconductor device having adhesion increasing film to prevent peeling
#10098Semiconductor device and method for manufacturing the same
#10099Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#10100Method for forming metal bumps
#10101Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#10102Fabrication method of semiconductor integrated circuit device
#10103Article and assembly for magnetically directed self assembly
#10104Stacked integrated circuit package system with connection protection
#10105Luminescent Light Source, Method for Manufacturing the Same, and Light-Emitting Apparatus
#10106Carbon nanotube via interconnect
#10107SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#10108Semiconductor chip comprising a metal coating structure and associated production method
#10109Ball grid array package construction with raised solder ball pads
#10110High-performance semiconductor package
#10111Semiconductor device and manufacturing method thereof
#10112Semiconductor device that improves electrical connection reliability
#10113Connecting structure, method for forming bump, and method for producing device-mounting substrate
#10114Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#10115Integrated circuit die with pedestal
#10116Folding chip planar stack package
#10117Integrated-circuit chip with offset external pads and method for fabricating such a chip
#10118Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#10119Multilayer printed circuit board
#10120Semiconductor device and medium of fabricating the same
#10121Method for fabricating a BGA device and BGA device
#10122INDIUM FEATURES ON MULTI-CONTACT CHIPS
#10123SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#10124Semiconductor integrated circuit device
#10125Semiconductor integrated circuit device
#10126Semiconductor component having test pads and method and apparatus for testing same
#10127Power transistor and power semiconductor device
#10128Stacked integrated circuit package-in-package system
#10129Method for manufacturing bump of wafer level package
#10130Semiconductor component having test pads and method and apparatus for testing same
#10131Fiducial scheme adapted for stacked integrated circuits
#10132Semiconductor device
#10133Aluminum bump bonding for fine aluminum wire
#10134Semiconductor device
#10135Chip package and wafer treating method for making adhesive chips
#10136Vertical semiconductor power switch, electronic component and methods of producing the same
#10137Method, system, and apparatus for gravity assisted chip attachment
#10138Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#10139Method of forming a bump and a connector structure having the bump
#10140Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
#10141Semiconductor device
#10142Integrated circuit package system
#10143Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#10144Semiconductor device and manufacturing process thereof
#10145Integrating a heat spreader with an interface material having reduced void size
#10146Signal transmission device
#10147Chip package and method for fabricating the same
#10148SEMICONDUCTOR DEVICE WITH BATTERY
#10149Semiconductor device having capacitors for reducing power source noise
#10150Method for diffusion soldering
#10151MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#10152METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE
#10153Wiring board with connection electrode formed in opening and semiconductor device using the same
#10154Semiconductor device, electronic device and fabrication method of the same
#10155Redistribution connecting structure of solder balls
#10156Chip underfill in flip-chip technologies
#10157Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
#10158Light emitting device
#10159Semiconductor device and manufacturing method for the same
#10160Manufacturing method of semiconductor device
#10161Method and apparatus for forming stacked die and substrate structures for increased packing density
#10162Packaging structure and method of an image sensor module
#10163Semiconductor device and manufacturing method for the same
#10164Semiconductor package having an optical device and a method of making the same
#10165Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies
#10166Multi-chip device and method for manufacturing the same
#10167Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
#10168METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
#10169DRIVE IC AND DISPLAY DEVICE HAVING THE SAME
#10170Nanoscale probes for electrophysiological applications
#10171Connection structure and method for fabricating the same
#10172Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#10173Semiconductor device
#10174Method for fabricating a through-hole interconnection substrate
#10175Encapsulant composition and electronic package utilizing same
#10176Methods of forming metal layers using multi-layer lift-off patterns
#10177Method of forming a thin film capacitor
#10178Solder bump confinement system for an integrated circuit package
#10179Composition and method for pre-surgical skin disinfection
#10180Light-emitting device
#10181CHIP CONNECTOR
#10182Plurality of devices attached by solder bumps
#10183Solder bump on a semiconductor substrate
#10184Semiconductor device with an improved solder joint
#10185Electronic devices including solder bumps on compliant dielectric layers
#10186Module part
#10187Stacked integrated circuit package system with face to face stack configuration
#10188Microelectronic devices and methods for manufacturing microelectronic devices
#10189Semiconductor device and manufacturing method thereof
#10190Photo-detection device
#10191Solder composition and method of bump formation therewith
#10192Semiconductor device and method of manufacturing thereof
#10193Bonding pad structure
#10194Multi-chips stacked package
#10195Wafer level package having floated metal line and method thereof
#10196Tooling for coupling multiple electronic chips
#10197Apparatus for solder crack deflection
#10198Semiconductor device with surface-mountable external contacts and method for manufacturing the same
#10199Wafer level stack structure for system-in-package and method thereof
#10200Semiconductor device, interposer chip and manufacturing method of semiconductor device