Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Semiconductor device and method of fabricating the same

Bonding structure with buffer layer and method of forming the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Module assembly and method for stacked BGA packages

Chip adhesive

Semiconductor/printed circuit board assembly, and computer system

Method of applying a pattern of particles to a substrate

Wafer level chip scale packaging structure and method of fabricating the same

Bond pad for flip chip package

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Semiconductor package

Redistribution of substrate interconnects

Wafer level stack structure for system-in-package and method thereof

Methods and apparatus for packaging integrated circuit devices

Integrated circuit carrier apparatus method and system

Three-dimensional integrated circuit with integrated heat sinks

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Compliant interconnect assembly

Method of manufacturing a semiconductor device

Process for manufacturing a through insulated interconnection in a body of semiconductor material

Relaxed tolerance flip chip assembly

Semiconductor device and method of manufacturing the same

Method and semiconductor device having copper interconnect for bonding

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor device and manufacturing method thereof

Bond pad scheme for Cu process

Structure and method of making capped chips having vertical interconnects

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Semiconductor package with lid heat spreader

Semiconductor device

Chip package with die and substrate

Technique for attaching die to leads

Bath and method for high rate copper deposition

Chip package with die and substrate

Method of fabricating ultra thin flip-chip package

Stacked semiconductor packages

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Depopulation of a ball grid array to allow via placement

Back-face and edge interconnects for lidded package

Circuit device

Chip structure and process for forming the same

Processes and tools for forming lead-free alloy solder precursors

Structure and method of making capped chips using sacrificial layer

Method for producing wiring substrate

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Flexible and elastic dielectric integrated circuit

Membrane 3D IC fabrication

Light emitting diode and manufacturing method thereof

Methods of plating via interconnects

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Wafer-level moat structures

Thin film circuit board device and method for manufacturing the same

Method of producing an electronic component and a panel with a plurality of electronic components

Reinforced bond pad

Semiconductor device and method of manufacturing the same

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Memory expansion and chip scale stacking system and method

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Circuit carrier and production thereof

System having semiconductor component with encapsulated, bonded, interconnect contacts

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

Placement of sacrificial solder balls underneath the PBGA substrate

Microelectronic substrates with integrated devices

Designs and methods for conductive bumps

Semiconductor device

Memory expansion and chip scale stacking system and method

Integrated circuit package design

Method for the lateral contacting of a semiconductor chip

Moisture-resistant electronic device package and methods of assembly

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor package with through-hole

Solder bump structure and method for forming the same

Power amplifier circuitry and method

Power amplifier circuitry and method

Power amplifier circuitry and method

Power amplifier circuitry and method

Semiconductor device and method of manufacturing the same

Flip chip substrate design

Stress-controlled dielectric integrated circuit

Semiconductor package and method of manufacturing the same

Process of manufacturing a solder-fill for applying to semiconductor package

Method for chemical etch control of noble metals in the presence of less noble metals

Bond pad techniques for integrated circuits

Semiconductor device and manufacturing method thereof

Multi-dice chip scale semiconductor components

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Pad structures including insulating layers having a tapered surface

Flip-chip interconnect with increased current-carrying capability

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Process for forming lead-free bump on electronic component

Wire bonding for thin semiconductor package

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Process for making contact with and housing integrated circuits

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

Relaxed tolerance flip chip assembly

Semiconductor device including a semiconductor chip mounted on a metal base

Wirebonded assemblage method and apparatus

Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices

Method of metal sputtering for integrated circuit metal routing

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Semiconductor chip with bumps and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Asymmetric plating

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith

Under bump metallurgic layer

Multi-chip semiconductor device with specific chip arrangement

Multi-chip package and manufacturing method thereof

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Silicon building blocks in integrated circuit packaging

Method for producing a semiconductor device in chip format

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Composite lid for land grid array (LGA) flip-chip package assembly

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Packaged microelectronic components

Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same

Semiconductor device and semiconductor device manufacturing method

Nickel bonding cap over copper metalized bondpads

Semiconductor device with strain relieving bump design

Method for assembling a ball grid array package with multiple interposers

Semiconductor device and a method of manufacturing the same

Method of forming a package

Techniques for packaging a multiple device component

Electronic device package

Semiconductor chip with fuse unit

Standoffs for centralizing internals in packaging process

Nickel bonding cap over copper metalized bondpads

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Multiple substrate microelectronic devices and methods of manufacture

Module part

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Thermal enhanced extended surface tape for integrated circuit heat dissipation

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Semiconductor device and switching element

Method, system, and apparatus for transfer of dies using a pin plate

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Multichip semiconductor device, chip therefor and method of formation thereof

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Chip structure

Semiconductor device including a diffusion layer

Under-bump metallugical structure

Semiconductor device having chip size package with improved strength

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Semiconductor device

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Aluminum cap with electroless nickel/immersion gold

Manufacturing method of semiconductor device, including differently spaced bump electrode arrays

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Method, system, and apparatus for authenticating devices during assembly

Semiconductor device and method of manufacturing the same

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Semiconductor device and manufacturing method thereof

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Bump electrodes having multiple under ball metallurgy (UBM) layers

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Multiple chip semiconductor package

Fabrication method for stacked multi-chip package

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Method, system, and apparatus for high volume transfer of dies

Activation plate for electroless and immersion plating of integrated circuits

Process of forming bonding columns

Imaging system

Optical module, method of manufacturing the same, optical communication device and electronic device using the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Corrosion-resistant copper bond pad and integrated device

Method for assembling integral type electronic device, and integral type electronic device

Semiconductor device

Chip package with grease heat sink

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Manufacturing method for a printed circuit board

Transfer assembly for manufacturing electronic devices

Acentric non-round electrical interconnections

Integrated circuit packages having stress-relieving features

Semiconductor package structure having thermal management structure

Power distribution for active-on-active die stack with reduced resistance

Underbump metallization dimension variation with improved reliability

Chip package structure and method for forming the same

Method and system for co-packaging photonics integrated circuit with an application specific integrated circuit

Semiconductor structure and method for forming the same

Circuit carrier structure, manufacturing method thereof and chip package structure

Method for forming package structure

Fine pitch copper pillar package and method

Patterning polymer layer to reduce stress

Interconnect using embedded carbon nanofibers

Integrated circuit component and package structure having the same

Flip-chip wire bondless power device

Electrostatic discharge protection devices including a field-induced switching element

Electronic device comprising a conductive pad on a protruding-through electrode

Interconnect structures for preventing solder bridging, and associated systems and methods

Semiconductor device including optional pad interconnect

Stress relief solutions on WLCSP large/bulk copper plane design

Package structure with protrusion structure

Electronic apparatus

Method for manufacturing memory having stacked integrated circuit chip

Semiconductor device and method for manufacturing the same

Apparatuses comprising semiconductor dies in face-to-face arrangements

Metal pad modification

Combing bump structure and manufacturing method thereof

Fan-out wafer level integration for photonic chips

Multi-chip semiconductor package, vertically-stacked devices and manufacturing thereof

Wafer level package with EMI shielding

Method for forming semiconductor device structure with bumps

Leadframe package with side solder ball contact and method of manufacturing

Semiconductor structure and method for forming the same

Re-distribution layer structure and manufacturing method thereof

Insulating protrusion in the trench of a re-distribution layer structure

Injection molded solder bumping

Method for producing semiconductor package

Semiconductor package and fabricating method thereof

Joint structure for metal pillars

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer-level chip scale package with side protection

Temporary connection traces for wafer sort testing

Final passivation for wafer level warpage and ULK stress reduction

Mixed UBM and mixed pitch on a single die

Robust pillar structure for semicondcutor device contacts

Fine pitch copper pillar package and method

Integrated interface structure

Liquid metal flip chip devices

Semiconductor device comprising a conductive pad on a protruding-through electrode

Package structures having height-adjusted molding members and methods of forming the same

Semiconductor structure and method of forming

Semiconductor structure and manufacturing method thereof

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

Package-on-package structure and method

Fan-out wafer level packaging and manufacturing method thereof

All intermetallic compound with stand off feature and method to make

Semiconductor device

Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same

Wafer backside redistribution layer warpage control

Wafer level package (WLP) and method for forming the same

Structure of ESD protection circuits on BEOL layer

Method for forming stacked metal contact in electrical communication with aluminum wiring in semiconductor wafer of integrated circuit

Device packaging

MPS-C2 semiconductor device having shorter supporting posts

Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height

Integrated chip package structure using silicon substrate and method of manufacturing the same