Method and structure for manufacturing improved yield semiconductor packaged devices

Stacked multi-chip semiconductor package improving connection reliability of stacked chips

Semiconductor device and manufacturing method thereof

Electronic assembly having an indium wetting layer on a thermally conductive body

Stacking system and method

Semiconductor assembly having substrate with electroplated contact pads

Semiconductor device

Semiconductor device, manufacturing method and apparatus for the same

Fabrication method of wafer level chip scale packages

Method for fabricating chip structure

Method for forming bump on electrode pad with use of double-layered film

Method of forming a solder bump and the structure thereof

Pre-doped reflow interconnections for copper pads

Semiconductor device mounted on and electrically connected to circuit board

Transfer molding of integrated circuit packages

Method and stencil for extruding material on a substrate

Semiconductor device with reduced contact resistance

Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus

Method for forming interconnects on thin wafers

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Wiring board and production method thereof, and semiconductor apparatus

Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell

Semiconductor device and method capable of scribing chips with high yield

Semiconductor component and system having thinned, encapsulated dice

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device that improves electrical connection reliability

Semiconductor device with slanting side surface for external connection

System-in-package (SIP) structure and fabrication thereof

On chip transformer isolator

Flip chip FET device

Method and stencil for extruding material on a substrate

Screen printing method of forming conductive bumps

Manufacturing method of semiconductor device

Structure and method of forming metal buffering layer

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Semiconductor device

Asymmetric bump structure

Semiconductor device and method of manufacturing the same

Flex-based circuit module

Moisture-resistant electronic device package and methods of assembly

Top layers of metal for high performance IC's

Method for fabricating leadless packages with mold locking characteristics

Method for fabrication of wafer level package incorporating dual compliant layers

Semiconductor device and interposer

Fine-pitch packaging substrate and a method of forming the same

Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon

Substrate for solder joint

Semiconductor device

Bump structure

Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package

Leadless leadframe with an improved die pad for mold locking

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Package modification for channel-routed circuit boards

Method of making a heatsink device

Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material

Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface

Semiconductor device and method of manufacturing the semiconductor device

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

Electronic device package structures

Windowed package for electronic circuitry

Chip embedded package structure

Method of bumping die pads for wafer testing

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Mounting with auxiliary bumps

Method of manufacturing an electronic parts packaging structure

Barrier for interconnect and method

Top layers of metal for high performance IC's

Methods of forming solder bumps on exposed metal pads

Semiconductor device and manufacturing method thereof

Method for making an interconnect pad

Method and apparatus for synthesizing high-frequency signals for wireless communications

Semiconductor device and fabrication process therefor

Display device and manufacturing method of the same

Semiconductor chip having pads with plural junctions for different assembly methods

Integrated circuit die for wire bonding and flip-chip mounting

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Semiconductor device using semiconductor chip

Semiconductor component having multiple stacked dice

Semiconductor device

Method for manufacturing an interconnect

High voltage power device with low diffusion pipe resistance

Printed circuit board and fabrication method thereof

Semiconductor chip having pads with plural junctions for different assembly methods

Multiple chip semiconductor package

Fan out type wafer level package structure and method of the same

High-frequency amplification device

Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device

Compliant interconnect assembly

Method for manufacturing semiconductor device

Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps

Method and apparatus for improved power routing

Semiconductor device and manufacturing method of the same

Method of making assemblies having stacked semiconductor chips

Component built-in module and method for producing the same

Wafer level chip scale packaging structure and method of fabricating the same

Flip-chip type semiconductor devices and conductive elements thereof

Semiconductor packages, and methods of forming semiconductor packages

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Manufacturing method for semiconductor device, semiconductor device and semiconductor chip

Semiconductor device with stacked semiconductor chips of the same type

High performance system-on-chip discrete components using post passivation process

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Power semiconductor switching devices and power semiconductor devices

Method for fabricating encapsulated semiconductor components

Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package

Electronic component mounting method and apparatus

Circuit device and method of manufacturing the circuit device

Semiconductor device with read out prevention and method of producing same

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus

Integrated circuit with intergrated capacitor and methods for making same

Wafer support and release in wafer processing

Wafer stacking using interconnect structures of substantially uniform height

Self-coplanarity bumping shape for flip-chip

Method of making chip package with grease heat sink

Carrier substrates and conductive elements thereof

Semiconductor flip-chip package and method for the fabrication thereof

Self-coplanarity bumping shape for flip chip

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Method and semiconductor device having copper interconnect for bonding

Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both

Fixture and method for uniform electroless metal deposition on integrated circuit bond pads

Methods of forming bumps using barrier layers as etch masks

Low fabrication cost, high performance, high reliability chip scale package

Adhesion by plasma conditioning of semiconductor chip surfaces

Semiconductor device and manufacturing metthod thereof

Chip package and process thereof

Copper interconnect

Integrated heat spreader with downset edge, and method of making same

Semiconductor chip package

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Top layers of metal for high performance IC's

Solder bump structure and method for forming a solder bump

Method of routing an electrical connection on a semiconductor device and structure therefor

Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

Method of producing an electronic component with flexible bonding

Manufacturing method of semiconductor device

Structure of semiconductor chip and display device using the same

Stress and force management techniques for a semiconductor die

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device with recessed post electrode

Methods and apparatus for packaging integrated circuit devices

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Multi-chip package (MCP) with a conductive bar and method for manufacturing the same

Semiconductor chip and display device using the same

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Wafer level semiconductor package with build-up layer and method for fabricating the same

Manufacturing and testing of electrostatic discharge protection circuits

Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Top layers of metal for high performance IC's

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Bump and fabricating process thereof

Package structure with two solder arrays

Solderable top metalization and passivation for source mounted package

Method and apparatus for bonding a wire

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Semiconductor element and wafer level chip size package therefor

Semiconductor device and manufacturing method thereof

Method for fabricating a chip-scale-packaging (CSP) having an inductor

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Driver chip and display apparatus having the same

Absolute power detector

Circuit component with bump formed over chip

Submount and semiconductor device

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and manufacturing method for the same

Packaged semiconductor device

Bonding structure and fabrication thereof

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Capacitor-related systems for addressing package/motherboard resonance

Testable electrostatic discharge protection circuits

Flip-chip light emitting diode device without sub-mount

Titanium stripping solution

Method to prevent passivation layer peeling in a solder bump formation process

Via structure of packages for high frequency semiconductor devices

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Packaged die on PCB with heat sink encapsulant and methods

Low coefficient of thermal expansion build-up layer packaging and method thereof

Interconnect system without through-holes

Semiconductor device and manufacturing method thereof

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

Manufacturing method for semiconductor device and semiconductor device

Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Circuit carrier

High performance system-on-chip using post passivation process

Thin-film capacitor device, mounting module for the same, and method for fabricating the same

Microelectronic packages and methods therefor

Method of producing a COF flexible printed wiring board

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof

Semiconductor copper bond pad surface protection

Semiconductor device and manufacturing method thereof

Diamond-silicon hybrid integrated heat spreader

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device

Systems and methods of plating via interconnects

Manufacturing method of semiconductor device

Wafer-level chip scale package and method for fabricating and using the same

Method of making an integrated circuit

Electronic component and fabricating method

Wafer-level package and method for production thereof

Electronic component and fabricating method

Semiconductor device having bonding pad above low-k dielectric film

Process for making fine pitch connections between devices and structure made by the process

Semiconductor device and method of manufacturing the same

Electronic component and fabricating method

Microelectronic assembly having array including passive elements and interconnects

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

High performance system-on-chip discrete components using post passivation process

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Flip-chip adaptor package for bare die

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

Semiconductor device and method for manufacturing the same

Bumpless wafer scale device and board assembly

Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device

Die-wafer package and method of fabricating same

Electronic devices and its production methods

High Q factor integrated circuit inductor

Selective passivation of exposed silicon

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Method of forming solder bump with reduced surface defects

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Driver chip and display apparatus having the same

Adhesion by plasma conditioning of semiconductor chip

Method of fabricating a semiconductor package utilizing a thermosetting resin base member

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor device

Interconnect structure for power transistors

Method of manufacturing high performance copper inductors with bond pads

Method of forming segmented ball limiting metallurgy

Hermetic passivation structure with low capacitance

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Methods and apparatus for automotive radar sensors

Through-wafer contact to bonding pad

Lithography device for semiconductor circuit pattern generation

Test assembly including a test die for testing a semiconductor product die

Mounting board and electronic device using same

Electronic component mounting method and apparatus

Methods of making microelectronic assemblies

Method for fabrication of a contact structure

Method for manufacturing semiconductor device with plural semiconductor chips

RF power amplifier and method for packaging the same

UBM for fine pitch solder ball and flip-chip packaging method using the same

Wafer-level assembly method for chip-size devices having flipped chips

Semiconductor device having capacitors for reducing power source noise

Semiconductor device and manufacturing method thereof

Semiconductor chip and manufacturing method for the same, and semiconductor device

Method for producing an electronic device connected to a printed circuit board

Moisture resistant, flexible epoxy/cyanate ester formulation

Encapsulated semiconductor components and methods of fabrication

Method of manufacturing an electronic device, and electronic device

System and method for optically interconnecting memory devices

Semiconductor device and semiconductor module

Semiconductor device and method for manufacturing the same

Solder ball pad structure

Power supply connection structure to a semiconductor device

Semiconductor device

Flexible rewiring plate for semiconductor components, and process for producing it

Method and device for manufacturing bonding pads for chip scale packaging

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

Method of manufacturing a semiconductor device including a semiconductor chip having an inclined surface

Semiconductor device and method of fabricating the same

Semiconductor device and fabrication method thereof

Methods of providing solder structures for out plane connections

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Method for manufacturing metal structure having different heights

Microconverter and laminated magnetic-core inductor

Various structure/height bumps for wafer level-chip scale package

Method of assembling a ball grid array package with patterned stiffener layer

Method and apparatus for improved power routing

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Flip-chip solder bump formation using a wirebonder apparatus

Structure and method for fabricating a bond pad structure

Structure and method for reinforcing a bond pad on a chip

Underfill integration for optical packages

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor package with improved solder joint reliability

Chip-scale package and carrier for use therewith

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method of producing an electronic component

Fan out type wafer level package structure and method of the same

Semiconductor device and a method of manufacturing the same

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Configuration for testing the bonding positions of conductive drops and test method for using the same

Thinned die integrated circuit package

Method for fabricating chip package

Temperature sustaining flip chip assembly process

Chip and wafer integration process using vertical connections

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling