209523 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for layer connectors
Semiconductor device having a device fixed on a substrate with an adhesive
#302Micro-pillar assisted semiconductor bonding
#303Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#304Semiconductor device
#305Package systems
#306GaN power device with solderable back metal
#307Semiconductor device and automobile
#308Metal pad offset for multi-layer metal layout
#309SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#310Ultra-thin semiconductor device and preparation method thereof
#311Stacked semiconductor device and method of forming the same related cases
#312Optoelectronic component with integrated protection diode and method of producing same
#313Mounting method
#314Semiconductor device with thick bottom metal and preparation method thereof
#315Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#316Semiconductor package with via-coupled power transistors
#317Jointed structure and method of manufacturing same
#318Semiconductor devices and methods of making the same
#319Hermetically sealed wafer packages
#320Electronic device including soldered surface-mount component
#321Dam for three-dimensional integrated circuit
#322Enhanced board level reliability for wafer level packages
#323Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package
#324Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers
#325Chip diode and diode package
#326Integrated circuit package
#327Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#328Solder paste, joining method using the same and joined structure
#329Sealing structure for a bonded wafer and method of forming the sealing structure
#330Semiconductor modules with semiconductor dies bonded to a metal foil
#331Bonded processed semiconductor structures and carriers
#332Electric power semiconductor device
#333Stacked semiconductor system having interposer of half-etched and molded sheet metal
#334Semiconductor device having multiple contact clips
#335Substrate composite, method and device for bonding of substrates
#336Method for manufacturing semiconductor apparatus
#337Semiconductor device
#338Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#339Wafer-level die attach metallization
#340Discrete semiconductor device package and manufacturing method
#341Fabrication methods of chip device packages
#342Semiconductor device and semiconductor device connection structure
#343Chip device packages and fabrication methods thereof
#344Semiconductor devices and methods of forming thereof
#345Methods of stress balancing in gallium arsenide wafer processing
#346Conductive paste and die bonding method
#347Electronic component
#348Junction and electrical connection
#349Method for processing a wafer and wafer structure
#350Integrated fan-out package structures with recesses in molding compound
#351Methods of fabricating wafer-level flip chip device packages
#352Metallic particle paste, cured product using same, and semiconductor device
#353Semiconductor device and method for manufacturing the same
#354Method for manufacturing a semiconductor device, and semiconductor device
#355Multichip power semiconductor device
#356Optical coupling module
#357Semiconductor device and manufacturing method of semiconductor device
#358Substrate, method of fabricating the same, and application the same
#359Substrateless power device packages
#360Light emitting diodes and a method of packaging the same
#361Bonding structure including metal nano particle
#362Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig
#363Multichip device including a substrate
#364Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
#365Semiconductor device
#366III-Nitride device with solderable front metal
#367Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
#368Wafer level chip scale package with exposed thick bottom metal
#369Semiconductor device
#370Electronic component and manufacturing method for electronic component
#371Through silicon vias for semiconductor devices and manufacturing method thereof
#372STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
#373Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
#374Joining method, method for producing electronic device and electronic part
#375Method for mounting a semiconductor chip on a carrier
#376III-nitride rectifier package
#377Wafer process for molded chip scale package (MCSP) with thick backside metallization
#378Semiconductor element, semiconductor device and method for manufacturing semiconductor element
#379Semiconductor device and electronic apparatus
#380Semiconductor device
#381Electric power semiconductor device and method for producing same
#382Chip diode and diode package
#383Stacked semiconductor device and method of forming the same related cases
#384Light emitting device
#385Copper nanorod-based thermal interface material (TIM)
#386Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
#387Chip package and method for forming the same
#388Solderless die attach to a direct bonded aluminum substrate
#389Semiconductor device, and manufacturing method for same
#390Method for forming a thin semiconductor device
#391Power transistor arrangement and method for manufacturing the same
#392Preform including a groove extending to an edge of the preform
#393Semiconductor device and power source device
#394Method for manufacturing a semiconductor device having multiple heat sinks
#395Integrated circuit package
#396Heat sink-integrated double-sided cooled power module
#397Method to integrate different function devices fabricated by different process technologies
#398Package systems and manufacturing methods thereof
#399Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#400Power semiconductor devices
#401Semiconductor device
#402Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
#403Semiconductor device and method for producing the same
#404Solder, solder joint structure and method of forming solder joint structure
#405Low profile surface mount package with isolated tab
#406Semiconductor packaging containing sintering die-attach material
#407Solder fatigue arrest for wafer level package
#408Packaged nano-structured component and method of making a packaged nano-structured component
#409Strong, heat stable junction
#410Bump package and methods of formation thereof
#411Illumination device capable of decreasing shadow of lighting effect
#412Integrated power module for multi-device parallel operation
#413Direct multiple substrate die assembly
#414Semiconductor device and method of manufacturing same
#415Semiconductor unit and semiconductor device using the same
#416Chip package and a method for manufacturing a chip package
#417Mounted structure
#418Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
#419Electronic device and method of fabricating an electronic device
#420Method and system for gallium nitride electronic devices using engineered substrates
#421Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#422Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#423Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
#424Semiconductor component support and semiconductor device
#425GaN power device with solderable back metal
#426Backside processing of semiconductor devices
#427Methods for producing a bond and a semiconductor module
#428Submicron connection layer and method for using the same to connect wafers
#429Method and apparatus for dispensing flux-free solder on a substrate
#430Method for manufacturing a chip package
#431Package-in-packages and methods of formation thereof
#432METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS TO SILICON CARBIDE
#433Solderless die attach to a direct bonded aluminum substrate
#434Wafer-level flip chip device packages and related methods
#435Bonding material and bonding body, and bonding method
#436Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
#437Discrete semiconductor device package and manufacturing method
#438Semiconductor device
#439Semiconductor packages and methods of formation thereof
#440Method of fabricating a power semiconductor chip package
#441Light emitting device chip scale package
#442Semiconductor package and methods of formation thereof
#443Electronic components assembly
#444Electronic Module
#445SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
#446Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#447Bonded processed semiconductor structures and carriers
#448Multichip power semiconductor device
#449Polymer via plugs with high thermal integrity
#450System in package and method for manufacturing the same
#451Power semiconductor module
#452Semiconductor device package having backside contact and method for manufacturing
#453Semiconductor device using diffusion soldering
#454OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA
#455Methods of stress balancing in gallium arsenide wafer processing
#456MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP BONDING
#457Precious metal paste for bonding semiconductor element
#458Module including a discrete device mounted on a DCB substrate
#459Electrically bonded arrays of transfer printed active components
#460Chip-to-wafer bonding method and three-dimensional integrated semiconductor device
#461Receiver module and device
#462Package structure and the method to manufacture thereof
#463Circuit connector apparatus and method therefor
#464Electronic device with multi-layer contact
#465Metallization structure for high power microelectronic devices
#466Method for separating a plurality of dies and a processing device for separating a plurality of dies
#467Semiconductor structure and manufacturing method thereof
#468Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
#469Multi-die semiconductor package
#470PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#471Semiconductor module
#472Semiconductor laser mounting with intact diffusion barrier layer
#473Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
#474Structure and method for power field effect transistor
#475Method for manufacturing wafer-bonded semiconductor device
#476Power semiconductor chip having two metal layers on one face
#477Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#478BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL
#479Electronic component
#480Composite layered chip package
#481Semiconductor device having antenna element and method of manufacturing same
#482SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#483Semiconductor device including a contact clip having protrusions and manufacturing thereof
#484Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
#485Conductive connecting member and manufacturing method of same
#486Electrically conductive paste, and electrically conducive connection member produced using the paste
#487Die backside standoff structures for semiconductor devices
#488Semiconductor device and bonding material for semiconductor device
#489Hermetically sealed wafer packages
#490Layered chip package and method of manufacturing same
#491Layered chip package and method of manufacturing same
#492Semiconductor device
#493Power converter, semiconductor device, and method for manufacturing power converter
#494Conductive pads defined by embedded traces
#495Semiconductor device including excess solder
#496Connecting and bonding adjacent layers with nanostructures
#497Method for producing a metal layer on a substrate and device
#498Method for soldering surface-mount component and surface-mount component
#499High voltage cascoded III-nitride rectifier package utilizing clips on package surface
#500Microelectronic chip, component containing such a chip and manufacturing method
#501Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
#502Device and method including a soldering process
#503CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT
#504Method for processing a semiconductor wafer or die, and particle deposition device
#505Method for the production of an electronic component and electronic component produced according to this method
#506Flip chip semiconductor device
#507Semiconductor apparatus, method for manufacturing the same and electric device
#508Mosfet package
#509Semiconductor device, manufacturing method of semiconductor device, and power source device
#510HEAT SINK AND METHOD OF MANUFACTURING THE SAME
#511Method for mounting a semiconductor chip on a carrier
#512Semiconductor device including a lead frame
#513Device including two semiconductor chips and manufacturing thereof
#514Semiconductor apparatus having penetration electrode and method for manufacturing the same
#515Chip package and method for forming the same
#516SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
#517Semiconductor device
#518Substrate bonding method and semiconductor device
#519Power semiconductor device package method
#520BOND PACKAGE AND APPROACH THEREFOR
#521Solder paste, joining method using the same and joined structure
#522Simultaneous wafer bonding and interconnect joining
#523Package structure
#524Metallic thermal joint for high power density chips
#525Semiconductor device and manufacturing method thereof
#526Connecting and bonding adjacent layers with nanostructures
#527METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#528Method Of Manufacturing Semiconductor Package Board
#529Conductive pads defined by embedded traces
#530Contact pad
#531Laser assisted transfer welding process
#532Light emitting device with electrode having recessed concave portion
#533SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
#534Chip Attachment Layer Having Traverse-Aligned Conductive Filler Particles
#535Electronic component and electronic device
#536Semiconductor device and method for manufacturing the same
#537Substrateless power device packages
#538Integrated circuits with backside metalization and production method thereof
#539Incident radiation detector packaging
#540Package systems having a eutectic bonding material and manufacturing methods thereof
#541Package systems having an opening in a substrate thereof and manufacturing methods thereof
#542Method and system for improving reliability of a semiconductor device
#543Stacked multi-die packages with impedance control
#544SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE
#545Substrate bonding with metal germanium silicon material
#546Semiconductor device with parasitic bipolar transistor
#547Semiconductor module and method for production thereof
#548Power semiconductor chip package
#549Apparatus and method configured to lower thermal stresses
#550Layered chip package and method of manufacturing same
#551Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers
#552Contacting means and method for contacting electrical components
#553ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
#554Layered chip package and method of manufacturing same
#555Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#556Backside processing of semiconductor devices
#557SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND
#558Layered chip package and method of manufacturing same
#559Laminated semiconductor substrate, laminated chip package and method of manufacturing the same
#560Forming a semiconductor package including a thermal interface material
#561Semiconductor device
#562Heat spreader as mechanical reinforcement for ultra-thin die
#563Method for manufacturing a semiconductor component and structure therefor
#564Method and system for forming a thin semiconductor device
#565Sintering silver paste material and method for bonding semiconductor chip
#566SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#567Semiconductor structure and manufacturing method thereof
#568Die backside standoff structures for semiconductor devices
#569Apparatus for applying solder to semiconductor chips using decals with aperatures present therein
#570Substrate having laser sintered underplate
#571Method of manufacturing semiconductor apparatus
#572Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
#573CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME
#574Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device
#575Semiconductor device and manufacturing method of the same
#576Die level integrated interconnect decal manufacturing method and apparatus
#577Wafer level integrated interconnect decal and manufacturing method thereof
#578Semiconductor device
#579Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#580Method for disposing a component
#581Semiconductor device and automotive ac generator
#582METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#583Solder alloy and semiconductor device
#584III-nitride power device with solderable front metal
#585Manufacturing of a device including a semiconductor chip
#586Semiconductor device
#587Semiconductor device with surface electrodes
#588STACK PACKAGE
#589GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#590Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#591Circuit substrate and display device
#592SEMICONDUCTOR DEVICE
#593Chip package and fabrication method thereof
#594Bonding structure and method for manufacturing same
#595Semiconductor device, production method for the same, and substrate
#596Power semiconductor module and method for operating a power semiconductor module
#597Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#598Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material
#599Apparatus and method configured to lower thermal stresses
#600Semiconductor device