209523 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for layer connectors
METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE
#602Semiconductor device and manufacturing method therefor
#603Layered chip for use in soldering
#604Electronic device and method of manufacturing the same
#605NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
#606Semiconductor package
#607Structure and method for power field effect transistor
#608Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink
#609Semiconductor device and method of manufacturing the same
#610Semiconductor device
#611Method of manufacturing semiconductor device
#612Semiconductor device and method of manufacturing the same
#613Substrate bonding with metal germanium silicon material
#614Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method
#615SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#616Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#617WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
#618Semiconductor device
#619Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation
#620Very extremely thin semiconductor package
#621Method of manufacturing a semiconductor device
#622Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display
#623Method of manufacturing a semiconductor device
#624Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device
#625Through wafer via and method of making same
#626Semiconductor device and method of manufacturing a semiconductor device
#627Semiconductor device, production method for the same, and substrate
#628Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates
#629SYSTEM WITH RADIO FREQUENCY INTEGRATED CIRCUITS
#630Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
#631Component protection for advanced packaging applications
#632Semiconductor device including a plurality of chips and method of manufacturing semiconductor device
#633Semiconductor device and method
#634SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#635RELIABILITY IMPROVEMENT IN A COMPOUND SEMICONDUCTOR MMIC
#636SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#637Method for forming lead frame land grid array
#638Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
#639Semiconductor device and manufacturing method of the same
#640Semiconductor device and automotive AC generator
#641Semiconductor module with switching components and driver electronics
#642Device and method including a soldering process
#643Apparatus and method configured to lower thermal stresses
#644Semiconductor package
#645Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
#646I/O pad structures for integrated circuit devices
#647Connecting and bonding adjacent layers with nanostructures
#648Electronic component with buffer layer
#649Method of manufacturing an integrated circuit module
#650WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES
#651Semiconductor device and manufacturing method therefor
#652Forming a semiconductor package including a thermal interface material
#653Manufacturing Method of Semiconductor Integrated Circuit Device
#654Substrate bonding method and semiconductor device
#655SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#656Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#657Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts
#658LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
#659INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS
#660INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME
#661Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
#662Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure
#663SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#664Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#665Semiconductor package having stacked semiconductor chips
#666SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL
#667Semiconductor device including isolation layer
#668MOSFET package
#669Bonding method and bonding material using metal particle
#670ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY
#671Thinned die integrated circuit package
#672Semiconductor apparatus and manufacturing method of semiconductor apparatus
#673LDO regulator with ground connection through package bottom
#674Semiconductor Device And Production Method For Semiconductor Device
#675Semiconductor device and manufacturing method of the same
#676Semiconductor chip, semiconductor device and methods for producing the same
#677Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device
#678Electronic assemblies having a low processing temperature
#679Semiconductor device and method for manufacturing the same
#680Device having several contact areas
#681Semiconductor device
#682Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film
#683Interconnect structure for semiconductor package
#684Diffusion soldered semiconductor device
#685Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
#686Nickel tin bonding system for semiconductor wafers and devices
#687Method for fabricating a wafer level package with device wafer and passive component integration
#688Wafer-level assembly of heat spreaders for dual IHS packages
#689Heat spreader as mechanical reinforcement for ultra-thin die
#690Method for producing a chip-substrate connection
#691Methods and apparatus having an integrated circuit attached to fused silica
#692Light emitting devices suitable for flip-chip bonding
#693Gold/silicon eutectic die bonding method
#694SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#695Vertical semiconductor power switch, electronic component and methods of producing the same
#696GaAs integrated circuit device and method of attaching same
#697Semiconductor device and manufacturing the same
#698Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
#699Semiconductor device having tin-based solder layer and method for manufacturing the same
#700Stack of semiconductor chips
#701Method of manufacturing semiconductor device
#702Semiconductor device
#703Electronic device and semiconductor device
#704Electronics package with an integrated circuit device having post wafer fabrication integrated passive components
#705Circuit module
#706Solder deposition and thermal processing of thin-die thermal interface material
#707Method for the planar joining of components of semiconductor devices and a diffusion joining structure
#708Bonding structure with buffer layer and method of forming the same
#709Semiconductor packages having leadframe-based connection arrays
#710Flip-chip light emitting diode device without sub-mount
#711Constant voltage diode
#712Method for manufacturing liquid crystal display device
#713Semiconductor device and automotive AC generator
#714Semiconductor device
#715MOSFET package
#716MOSFET package
#717Semiconductor device
#718Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#719Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method
#720System and method for die attach using a backside heat spreader
#721Method for fabricating a semiconductor device having a heat radiation layer
#722Solder deposition on wafer backside for thin-die thermal interface material
#723Semiconductor device and method of manufacturing the same
#724Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
#725Wafer level package including a device wafer integrated with a passive component
#726Semiconductor device and manufacturing method thereof
#727MOSFET package
#728MOSFET package
#729Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment
#730Semiconductor package integral heat spreader
#731Semiconductor device and method of manufacturing a semiconductor device
#732Semiconductor device and manufacturing method thereof
#733Solder composition
#734Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
#735Semiconductor device and manufacturing method therefor
#736Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
#737Epoxy-solder thermally conductive structure for an integrated circuit
#738Die bonded device and method for transistor packages
#739Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
#740Wafer-level diamond spreader
#741Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#742Solder foil, semiconductor device and electronic device
#743Electronic assemblies having a low processing temperature
#744Semiconductor device having tin-based solder layer and method for manufacturing the same
#745Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#746Method of stacking wafers with anisotropic conductive adhesive
#747Wafer-level diamond spreader
#748Electronic assembly having an indium wetting layer on a thermally conductive body
#749Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#750Semiconductor device
#751Method for manufacturing semiconductor device having solder layer
#752Semiconductor device and manufacturing method of the same
#753In-process semiconductor packages with leadframe grid arrays
#754Wafer support and release in wafer processing
#755Power semiconductor component with increased robustness
#756Flip-chip light emitting diode device without sub-mount
#757Semiconductor device
#758Wafer stacking with anisotropic conductive adhesive
#759Semiconductor device and method of manufacturing the same
#760Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#761Method for manufacturing thin GaAs die with copper-back metal structures
#762Thinned die integrated circuit package
#763Bonding structure with buffer layer and method of forming the same
#764Lead-free solder composition for substrates
#765Diffusion solder position, and process for producing it
#766Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween
#767Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
#768Flip-chip bonding of light emitting devices
#769Light-emitting semiconductor component
#770Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
#771Semiconductor device
#772Flip-chip wire bondless power device
#773Display device
#774Display device
#775Vertically stacked wafers and methods of forming same