209523 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process Bonding areas specifically adapted for layer connectors
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2FLIP CHIP LIGHT EMITTING DIODE (LED) INTERCONNECT
#3SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#6SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#7SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#8SEMICONDUCTOR DEVICE
#9ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
#10ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS WITH STRUCTURAL SUPPORT
#11HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELECTRONICS APPLICATIONS
#12DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELECTRONIC DEVICES
#13LOW PRESSURE SINTERING POWDER
#14DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#15THICK-SILVER LAYER INTERFACE
#16DISPLAY DEVICE
#17INTEGRATED CIRCUIT FLIP-CHIP AND LIGHT-EMITTING DEVICE
#18SEMICONDUCTOR DEVICE
#19ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
#20SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODULE, AND METHODS OF FORMING THE SEMICONDUCTOR DIE AND THE SEMICONDUCTOR DIE STACK
#21METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND DRY ETCHING AND SEMICONDUCTOR DEVICE
#22INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#23Structure and Method of Forming a Joint Assembly
#24LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
#253-D IC in Embedded Die Substrate
#26COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#27CONNECTING ARRANGEMENT
#28Method for Fabricating a Power Semiconductor Device
#29Electronic device with multi-layer contact and system
#30SEMICONDUCTOR DEVICE
#31Display apparatus
#32SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#33CHIP-ON-FILM PACKAGE
#34INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#35Packaging of a semiconductor device with a plurality of leads
#36SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR CHIP, AND METHOD OF FORMING A CHIP SYSTEM
#37Pad Design For Reliability Enhancement in Packages
#38Semiconductor device and method for manufacturing the same
#39ADHESIVE BONDING COMPOSITION AND METHOD OF USE
#40Semiconductor die, a semiconductor die stack, and a semiconductor module
#41SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#42SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
#43METHOD FOR THE LOCALIZED DEPOSITION OF A MATERIAL ON A METAL ELEMENT
#44Devices and methods related to stack structures including passivation layers for distributing compressive force
#45High reliability lead-free solder alloys for harsh environment electronics applications
#46Display apparatus
#47Structure and method of forming a joint assembly
#48Display device including connection pad part and electronic component connected to connection pad part
#49Semiconductor arrangement and method for producing a semiconductor arrangement
#50Transistor packages with improved die attach
#51Electronic component and semiconductor device
#52Micro LED display and manufacturing method therefor
#53Packaging of a semiconductor device with a plurality of leads
#54Semiconductor device and method for manufacturing the same
#55Display device
#56Display device and method of manufacturing the same
#57Semiconductor packages with an intermetallic layer
#58Semiconductor module including heat dissipation layer
#59Display device including adhesive film with conductive ball
#60Low pressure sintering powder
#61Display apparatus
#62Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
#63METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS
#64SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE
#65Soldering a conductor to an aluminum metallization
#66Display device incorporating self-assembled monolayer and method of manufacturing the same
#67DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#68Packaging of a semiconductor device with a plurality of leads
#69Solder pads of variable thickness in an optoelectronic semiconductor chip, on a connection substrate for mounting a semiconductor chip, method of producing an optoelectronic component, and optoelectronic component having the solder pads
#70Pad design for reliability enhancement in packages
#71Integrated circuit backside metallization
#72Integration and bonding of micro-devices into system substrate
#73Die attach methods and semiconductor devices manufactured based on such methods
#74Active package substrate having anisotropic conductive layer
#75Adhesive bonding composition and method of use
#76Semiconductor device and method of manufacturing the same
#77Thick-silver layer interface
#78Packaged dies with metal outer layers extending from die back sides toward die front sides
#79Semiconductor devices and methods of making the same
#80Wound body of sheet for sintering bonding with base material
#81Methods for processing high electron mobility transistor (HEMT)
#82Illumination device
#83Die stack assembly using an edge separation structure for connectivity through a die of the stack
#84Semiconductor arrangement and method for producing a semiconductor arrangement
#85Soldering a conductor to an aluminum metallization
#86Display apparatus
#87Chip assembly
#88Soldering a conductor to an aluminum metallization
#89Integrated circuit backside metallization
#90Die attach surface copper layer with protective layer for microelectronic devices
#91Electronic component and semiconductor device
#92Integrated passive device and fabrication method using a last through-substrate via
#93High reliability lead-free solder alloys for harsh environment electronics applications
#94Semiconductor device
#95Stacked semiconductor system having interposer of half-etched and molded sheet metal
#96Electronic device with multi-layer contact and system
#97Active package substrate having anisotropic conductive layer
#98Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#99Method of manufacturing a semiconductor device
#100Structure and method of forming a joint assembly
#101Method of manufacturing a semiconductor element front side electrode
#102Electronic device
#103Method for fabricating the electronic component, and method for transposing a micro-element
#104Stress relieving structure for semiconductor device
#105Die attach methods and semiconductor devices manufactured based on such methods
#106Adhesive bonding composition and method of use
#107SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
#108Pad design for reliability enhancement in packages
#109Illumination device
#110Cascode semiconductor package and related methods
#111Light-emitting device
#112Display device
#113Semiconductor device and method of manufacture
#114Foldable display design
#115Resistive element and method of manufacturing the resistive element
#116Line-integrated switch and method for producing a line-integrated switch
#117Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#118Wafer level chip scale package structure and manufacturing method thereof
#119Method of manufacturing a semiconductor device
#120Integration and bonding of micro-devices into system substrate
#121Electronic element and electronic device comprising the same
#122SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#123Conductive paste and die bonding method
#124Packaging structure with recessed outer and inner lead surfaces
#125Semiconductor device
#126Semiconductor device and method of manufacturing a semiconductor device
#127Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#128High electron mobility transistor (HEMT)
#129Adhesive for semiconductor mounting, and semiconductor sensor
#130Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
#131Display device
#132Semiconductor device
#133Semiconductor package with a heat spreader and method of manufacturing thereof
#134A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#135Power electronics assembly having an adhesion layer, and method for producing said assembly
#136Semiconductor chip and method of processing a semiconductor chip
#137Semiconductor device and method for manufacturing the same
#138Soldering a conductor to an aluminum metallization
#139Anisotropic conductive film (ACF) and forming method thereof, ACF roll, bonding structure and display device
#140Semiconductor device
#141Electronic component device
#142Method of wafer dicing for wafers with backside metallization and packaged dies
#143Semiconductor device and semiconductor module
#144Method for producing electronic device with multi-layer contact
#145Power semiconductor device and method for manufacturing power semiconductor device
#146Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#147Electronic packaging structure
#148A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#149METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#150Power module with improved reliability
#151Semiconductor chip, semiconductor device, and electronic device
#152Dam for three-dimensional integrated circuit
#153Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#154Power semiconductor module for an inverter circuit and method of manufacturing the same
#155FLEXIBLE DISPLAY PANELS AND THE MANUFACTURING METHODS THEREOF
#156Display apparatus
#157Semiconductor device
#158Electronic assembly with enhanced thermal dissipation
#159Bonded structure and method of manufacturing the same
#160Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element
#161Compound semiconductor substrate and power amplifier module
#162Semiconductor device including built-in crack-arresting film structure
#163Semiconductor device and method of manufacturing the same
#164Solution deposited magnetically guided chiplet displacement
#165Low-temperature bonding with spaced nanorods and eutectic alloys
#166Semiconductor device and manufacturing method therefor
#167Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#168Hermetically sealed MEMS device and its fabrication
#169Semiconductor devices and methods of making the same
#170Cascode semiconductor package and related methods
#171Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#172Electrical interconnect structure for an embedded electronics package
#173Array substrate and methods of manufacturing same, and display panel and display apparatus including the array substrate
#174Semiconductor package and method for fabricating the same
#175Pad design for reliability enhancement in packages
#176Chip assembly
#177Wafer level semiconductor device with wettable flanks
#178LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#179Die attach methods and semiconductor devices manufactured based on such methods
#180Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#181Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#182METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#183Electrically conductive composition
#184Method of manufacturing semiconductor device
#185Methods for forming a semiconductor device and semiconductor devices
#186Structure and method of forming a joint assembly
#187Advanced through substrate via metallization in three dimensional semiconductor integration
#188Advanced through substrate via metallization in three dimensional semiconductor integration
#189Semiconductor package and fabrication method thereof
#190High electron mobility transistor (HEMT)
#191Semiconductor laser mounting with intact diffusion barrier layer
#192METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#193Laminate package of chip on carrier and in cavity
#194Integrated circuits with backside metalization and production method thereof
#195Sinterable bonding material and semiconductor device using the same
#196Sinterable bonding material and semiconductor device using the same
#197SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
#198Non-eutectic bonding
#199Die stack assembly using an edge separation structure for connectivity through a die of the stack
#200Electronic device and method for producing an electronic device
#201Thick-silver layer interface
#202Display apparatus including a micro light-emitting diode
#203Method for manufacturing semiconductor device
#204Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering
#205Method of producing optoelectronic component with integrated protection diode
#206Semiconductor device including built-in crack-arresting film structure
#207Semiconductor devices with a thermally conductive layer and methods of their fabrication
#208Electronic device
#209Power semiconductor device including a semiconductor switching element
#210Bonding structure and method for producing bonding structure
#211Capacitor formed on heavily doped substrate
#212Method of manufacturing a semiconductor device
#213Adhesive bonding composition and method of use
#214Sintering materials and attachment methods using same
#215Method of manufacturing semiconductor device
#216Semiconductor devices and methods of making the same
#217Semiconductor packages with an intermetallic layer
#218Semiconductor device and semiconductor package
#219Gallium arsenide devices with copper backside for direct die solder attach
#220Method for bonding substrates
#221Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#222Semiconductor device
#223Cascode semiconductor package and related methods
#224Semiconductor chip, semiconductor package including the same, and method of fabricating the same
#225Semiconductor devices and methods of making the same
#226Power electronic submodule comprising a bipartite housing
#227Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel
#228Semiconductor die attachment with embedded stud bumps in attachment material
#229Semiconductor device with insulation layers
#230Low pressure sintering powder
#231Semiconductor devices and methods of forming thereof
#232Semiconductor device
#233Lead-free soldering method and soldered article
#234Semiconductor device having a bonding pad
#235Alternative compositions for high temperature soldering applications
#236Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#237Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#238Semiconductor device
#239Integrated packaging of multiple double sided cooling planar bond power modules
#240Semiconductor structure having thermal backside core
#241THERMOCOMPRESSION BONDING WITH RAISED FEATURE
#242A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#243High reliability lead-free solder alloys for harsh environment electronics applications
#244Semiconductor device including built-in crack-arresting film structure
#245Integration of backside heat spreader for thermal management
#246Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#247Power module and method of manufacturing power module
#248Au-based solder die attachment semiconductor device and method for manufacturing the same
#249Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material
#250Chip part and method of making the same
#251Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications
#252Method of manufacturing semiconductor device and semiconductor device
#253Metal joining structure using metal nanoparticles and metal joining method and metal joining material
#254Anisotropic conductive film
#255Electrode connection structure and electrode connection method
#256Method for the diffusion soldering of an electronic component to a substrate
#257Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#258Manufacturing method of ultra-thin semiconductor device package assembly
#259Method of attaching an electronic part to a copper plate having a surface roughness
#260Semiconductor chip and method of processing a semiconductor chip
#261Semiconductor device
#262Semiconductor package and manufacturing method thereof
#263Laser assisted transfer welding process
#264Wafer to wafer bonding process and structures
#265Wiring substrate
#266Chip package and method for forming the same
#267Integrated circuits with backside metalization and production method thereof
#268Methods of manufacturing a semiconductor device
#269Semiconductor device and an electronic device
#270Package substrate, semiconductor package and method of manufacturing the same
#271Printed circuit board
#272Method for manufacturing a semiconductor device, and semiconductor device
#273Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#274Semiconductor device and method of manufacturing semiconductor device
#275Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof
#276Light emitting diodes and a method of packaging the same
#277Method of forming a chip assembly with a die attach liquid
#278Semiconductor component having inner and outer semiconductor component housings
#279Power module, power converter and drive arrangement with a power module
#280Electronic devices with semiconductor die coupled to a thermally conductive substrate
#281Chip package and method for forming the same
#282Integration of backside heat spreader for thermal management
#283Wafer-level flip chip device packages and related methods
#284Semiconductor package structure with polymeric layer and manufacturing method thereof
#285Wafer process for molded chip scale package (MCSP) with thick backside metallization
#286Semiconductor package structure including die and substrate electrically connected through conductive segments
#287Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#288Semiconductor device having multiple bonded heat sinks
#289Stack structures in electronic devices including passivation layers for distributing compressive force
#290Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof
#291Semiconductor device and method of manufacturing the same
#292Batch process for connecting chips to a carrier
#293Common drain semiconductor device structure and method
#294Semiconductor device and method of fabricating same
#295Semiconductor laser mounting with intact diffusion barrier layer
#296Semiconductor laser structure
#297Pad design for reliability enhancement in packages
#298Semiconductor device with metal film and method for manufacturing semiconductor device with metal film
#299WAFER PACKAGING STRUCTURE AND PACKAGING METHOD
#300Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages