209543 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area; External layer Material
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2WIRE BOND WIRES FOR INTERFERENCE SHIELDING
#3PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
#4STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#5PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
#6STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#7TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
#8Package-on-package assembly with wire bond vias
#9Wire bond wires for interference shielding
#10Bump structure having a side recess and semiconductor structure including the same
#11SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#12SEMICONDUCTOR PACKAGE
#13SEMICONDUCTOR PACKAGE
#14CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
#15Wire bond wires for interference shielding
#16Electrical component with a dielectric passivation stack
#17STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
#18Package-on-package assembly with wire bonds to encapsulation surface
#19Package-on-package assembly with wire bond vias
#20PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#21Electrical component with a dielectric passivation stack
#22Stacked semiconductor die assemblies with support members and associated systems and methods
#23Stacked semiconductor die assemblies with die support members and associated systems and methods
#24Microelectronic device including fiber-containing build-up layers
#25CHIP ARRANGEMENTS
#26Process for Making a Semiconductor System
#27Semiconductor structure and manufacturing method thereof
#28Package-on-package assembly with wire bonds to encapsulation surface
#29Package-on-package assembly with wire bond vias
#30Bump structure having a side recess and semiconductor structure including the same
#31SEMICONDUCTOR DEVICE
#32Wide injection range open circuit voltage decay system
#33Semiconductor structure and manufacturing method thereof
#34Stacked semiconductor die assemblies with die support members and associated systems and methods
#35Semiconductor chip package having optical interface
#36Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#37Package-on-package assembly with wire bonds to encapsulation surface
#38SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#39Wire bond wires for interference shielding
#40Stacked semiconductor die assemblies with support members and associated systems and methods
#41Microelectronic device including fiber-containing build-up layers
#42Integrated circuit packages and methods for forming the same
#43Integrated circuit package including miniature antenna
#44Positional relationship among components of semiconductor device
#45Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#46Semiconductor device with lead terminals having portions thereof extending obliquely
#47Bump structure having a side recess and semiconductor structure including the same
#48Grid array connection device and method
#49Method and apparatus used for testing a device under test
#50Semiconductor packages
#51Semiconductor device and method for manufacturing semiconductor device
#52Semiconductor light emitting device
#53Method of making a wire support leadframe for a semiconductor device
#54Semiconductor chip package having optical interface
#55Semiconductor device and method for manufacturing semiconductor device
#56Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#57Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#58Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#59Multichip modules and methods of fabrication
#60SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#61Wireless communication link using near field coupling
#62Solder metallization stack and methods of formation thereof
#63On-bonder automatic overhang die optimization tool for wire bonding and related methods
#64Method for fabricating glass substrate package
#65Wire bond wires for interference shielding
#66Wire support for a leadframe
#67Stacked microfeature devices and associated methods
#68Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#69Package-on-package assembly with wire bonds to encapsulation surface
#70Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#71CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL STIMULATION
#72Integrated circuit package including miniature antenna
#73Electrical interconnections for semiconductor devices and methods for forming the same
#74Positional relationship among components of semiconductor device
#75Manufacturing method of semiconductor structure
#76Integrated circuit packages and methods for forming the same
#77Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#78Semiconductor device and ball bonder
#79BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE
#80Parallel plate waveguide for power semiconductor package
#81Power semiconductor package having a parallel plate waveguide
#82Grid array connection device and method
#83Stacked semiconductor die assemblies with die support members and associated systems and methods
#84SEMICONDUCTOR DEVICE
#85Molding compound including a carbon nano-tube dispersion
#86Package substrate, method for fabricating the same, and package device including the package substrate
#87PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
#88Selective planishing method for making a semiconductor device
#89Method of making a wire support leadframe for a semiconductor device
#90Light emitting element
#91Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
#92Semiconductor packages with leadframes and related methods
#93Light emitting device and method for manufacturing light emitting device
#94Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#95Semiconductor device and method for manufacturing the same
#96Semiconductor device
#97Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps
#98Semiconductor chip package having optical interface
#99Lead and lead frame for power package
#100Semiconductor system
#101Leadframe package with stable extended leads
#102Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package
#103Wire bond wires for interference shielding
#104Bump structure having a side recess and semiconductor structure including the same
#105Semiconductor device
#106Semiconductor device with lead terminals having portions thereof extending obliquely
#107INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSOCIATED SYSTEMS AND METHODS
#108Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#109Package-on-package assembly with wire bond vias
#110FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#111Integrated circuit packages and methods for forming the same
#112Camera module and electronic device
#113Electronic device having a liquid crystal polymer solder mask and related devices
#114Chip arrangements
#115Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#116Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#117Embedded chip packages and methods for manufacturing an embedded chip package
#118Package-on-package assembly with wire bonds to encapsulation surface
#119Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#120Wire support for a leadframe
#121Flexible electronic system with wire bonds
#122Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device
#123Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad
#124Semiconductor device and method for manufacturing semiconductor device
#125Compact semiconductor package and related methods
#126Bump structure having a side recess and semiconductor structure including the same
#127Semiconductor device with lead terminals having portions thereof extending obliquely
#128Grid array connection device and method
#129Solder metallization stack and methods of formation thereof
#130Stacked semiconductor die assemblies with support members and associated systems and methods
#131Interconnect structure with improved conductive properties and associated systems and methods
#132Stacked semiconductor die assemblies with die support members and associated systems and methods
#133Silicone adhesive composition and solid-state imaging device
#134Adjustable losses of bond wire arrangement
#135Mounting structure of semiconductor device and method of manufacturing the same
#136Method of forming bump structure having a side recess and semiconductor structure including the same
#137Compact semiconductor package and related methods
#138Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad
#139Integrated circuit packages and methods for forming the same
#140Template and pattern forming method
#141Semiconductor package and method for fabricating the same
#142Bump pad structure
#143Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#144Interconnect structure with improved conductive properties and associated systems and methods
#145Systems and methods for high-speed, low-profile memory packages and pinout designs
#146Semiconductor device and method of manufacturing semiconductor device
#147Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device
#148Bump structure having a side recess and semiconductor structure including the same
#149Stacked semiconductor die assemblies with die support members and associated systems and methods
#150Stacked semiconductor die assemblies with support members and associated systems and methods
#151Binding wire and semiconductor package structure using the same
#152Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
#153Integrated circuit package including miniature antenna
#154Integrated electronic device including an interposer structure and a method for fabricating the same
#155Wire bonding apparatus
#156Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#157Semiconductor device and method for manufacturing semiconductor device
#158Semiconductor devices and methods of making semiconductor devices
#159Combined QFN and QFP semiconductor package
#160Integrated circuit chip and fabrication method
#161Heat management in electronics packaging
#162Flexible electronic system with wire bonds
#163Package-on-package assembly with wire bond vias
#164Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#165Semiconductor device with lead terminals having portions thereof extending obliquely
#166Enhanced flip chip structure using copper column interconnect
#167Semiconductor packaging structure and manufacturing method for the same
#168Semiconductor device and connection checking method for semiconductor device
#169Semiconductor device with through silicon via and alignment mark
#170Grid array connection device and method
#171Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system
#172Camera module and electronic device
#173Semiconductor device and method for producing the same
#174Semiconductor device and method for manufacturing the same
#175Processes and structures for IC fabrication
#176Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#177Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#178Segmented bond pads and methods of fabrication thereof
#179Bump pad structure
#180Packaging process tools and packaging methods for semiconductor devices
#181Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#182Lead and lead frame for power package
#183Wafer scale technique for interconnecting vertically stacked dies
#184Through silicon via with embedded barrier pad
#185System and method of sensing current in a power semiconductor device
#186Integrated circuit device and electronic apparatus
#187Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#188Semiconductor device including dummy pattern
#189Method of manufacturing semiconductor device
#190Semiconductor device with through silicon via and alignment mark
#191Apparatuses and methods to enhance passivation and ILD reliability
#192OLED device in contact with a conductor
#193High frequency device
#194Packaged microelectronic components
#195Semiconductor device having conductive pads and a method of manufacturing the same
#196Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
#197PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME
#198Routing layer for mitigating stress in a semiconductor die
#199Techniques for packaging multiple device components
#200Packaged IC having printed dielectric adhesive on die pad
#201Semiconductor device with stacked semiconductor chips
#202Power semiconductor housing with redundant functionality
#203Method for fabricating glass substrate package
#204Voltage regulator using N-type substrate
#205Metal pads with openings in integrated circuits
#206Multilayer packaged semiconductor device and method of packaging
#207Devices for metallization
#208INTEGRATED CIRCUIT PACKAGE HAVING MEDIUM-INDEPENDENT SIGNALING INTERFACE COUPLED TO CONNECTOR ASSEMBLY
#209Integrated circuit packaging system with array contacts and method of manufacture thereof
#210Semiconductor device and programming method
#211Embedded package security tamper mesh
#212Mounting structure of semiconductor device and method of manufacturing the same
#213Packaged semiconductor die with power rail pads
#214Lead Frame Packages and Methods of Formation Thereof
#215Integrated circuit packages and methods for forming the same
#216Package structure having micro-electro-mechanical system element and method of fabrication the same
#217TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES
#218PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
#219Scheme for connector site spacing and resulting structures
#220FINE-PITCH FLEXIBLE WIRING
#221MULTI-CORE WIRE
#222Method for the wafer-level integration of shape memory alloy wires
#223Leadframe having selective planishing
#224Through silicon via with embedded barrier pad
#225Chip assembly and chip assembling method
#226Vertically packaged integrated circuit
#227Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#228Semiconductor device including a polymer disposed on a carrier
#229Lead frame with grooved lead finger
#230Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life
#231Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof
#232Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die
#233Power semiconductor device module
#234Method for manufacturing fine-pitch bumps and structure thereof
#235Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
#236Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape
#237Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same
#238Chip assembly and chip assembling method
#239Joint structure for substrates and methods of forming
#240Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package
#241Wire Bonding Structures for Integrated Circuits
#242SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME
#243Structures and methods for detecting solder wetting of pedestal sidewalls
#244Method for package-on-package assembly with wire bonds to encapsulation surface
#245Magnetic attachment structure
#246Mechanisms for controlling bump height variation
#247Enhanced flip chip structure using copper column interconnect
#248Semiconductor package with integrated selectively conductive film interposer
#249Wafer-scale package structures with integrated antennas
#250Processes and structures for IC fabrication
#251Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication
#252Bump pad structure
#253Leadframe and semiconductor package made using the leadframe
#254Integrated circuit package and method of assembling an integrated circuit package
#255Stackable microelectronic package structures
#256Chip package structure
#257Package carrier and manufacturing method thereof
#258Gate driver with digital ground
#259Integrated circuit packages having redistribution structures
#260Semiconductor device and method of manufacturing the same
#261Packaged leadless semiconductor device
#262Semiconductor package
#263Circuit board component shim structure
#264Packaging process tools and systems, and packaging methods for semiconductor devices
#265Semiconductor devices including protected barrier layers
#266Semiconductor device having shielded conductive vias
#267Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
#268Device having multiple wire bonds for a bond area and methods thereof
#269Packaged die for heat dissipation and method therefor
#270Integrated circuit having staggered bond pads and I/O cells
#271Device having electrodes formed from bumps with different diameters
#272Die power structure
#273Thermal pad shorts test for wire bonded strip testing
#274Method for developing a custom device
#275Method and apparatus for monitoring free air ball (FAB) formation in wire bonding
#276Methods of fabricating electronics assemblies
#277Package on package devices and methods of packaging semiconductor dies
#278PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDING
#279Package-on-package assembly with wire bond vias
#280Package-on-package assembly with wire bond vias
#281Package-on-package assembly with wire bond vias
#282MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#283Packaging process tools and packaging methods for semiconductor devices
#284DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME
#285Semiconductor structure and method for making same
#286Electrical device with protruding contact elements and overhang regions over a cavity
#287Semiconductor Chips and Semiconductor Packages and Methods of Fabricating the Same
#288Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method
#289Systems and methods for lowering interconnect capacitance
#290Semiconductor device and method of forming semiconductor package using panel form carrier
#291Method for manufacturing a chip packaging structure
#292MANUFACTURING A FILLING OF A GAP REGION
#293Multi-chip packages providing reduced signal skew and related methods of operation
#294Low loop wire bonding
#295Packaging methods and structures using a die attach film
#296Semiconductor device including cladded base plate
#297Spot plated leadframe and IC bond pad via array design for copper wire
#298Microelectromechanical system having movable element integrated into substrate-based package
#299Semiconductor chip
#300Reduction of etch microloading for through silicon vias