209561 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area; Shape in top view
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
#2HYBRID BONDING WITH UNIFORM PATTERN DENSITY
#3SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#4CHIP STRUCTURE
#5Hybrid bonding with uniform pattern density
#6Chip structure and method for forming the same
#7Hybrid bonding with uniform pattern density
#8Method for manufacturing chip cards and chip card obtained by said method
#9Display apparatus and method for binding the same
#10Hybrid bonding with uniform pattern density
#11Array substrate, method for fabricating the same and display device
#12Electronic device and mounting structure of the same
#13Hybrid bonding with uniform pattern density