Patents-Review.com
ClassID:

209562 ⎘

H01L2224/08057 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area; Shape in side view

Recent Application in this class:
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SEMICONDUCTOR PACKAGE

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20250105110
2025-03-27

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

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2025-01-30

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

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2024-06-06

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2024-04-04

Low temperature bonded structures

 #9
20230411327
2023-12-21

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

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20230361145
2023-11-09

Semiconductor device including a structure for higher integration

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20230238343
2023-07-27

Semiconductor device and method of manufacturing the same

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20230132272
2023-04-27

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

 #13
20230060360
2023-03-02

Semiconductor package and method of fabricating the same

 #14
20230005885
2023-01-05

SEMICONDUCTOR PACKAGE

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20220262751
2022-08-18

Chip Package on Package Structure, Packaging Method Thereof, and Electronic Device

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20220208706
2022-06-30

Semiconductor device and method of manufacturing the same

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20220165692
2022-05-26

Low temperature bonded structures

 #18
20220068773
2022-03-03

Lead frame-based semiconductor package

 #19
20210398933
2021-12-23

Electronic device and display device using the same

 #20
20210391369
2021-12-16

Semiconductor device, method of manufacturing semiconductor device, and imaging element

 #21
20210066224
2021-03-04

Semiconductor device and method of manufacturing the same

 #22
20200051937
2020-02-13

Low temperature bonded structures

 #23
20200006269
2020-01-02

Semiconductor devices

 #24
20190243179
2019-08-08

Display device and method of manufacturing the same

 #25
20180068965
2018-03-08

Conductive pad structure for hybrid bonding and methods of forming same

 #26
20160377905
2016-12-29

Display device and method of manufacturing the same

 #27
20160343679
2016-11-24

Conductive pad structure for hybrid bonding and methods of forming same

 #28
20160181228
2016-06-23

Semiconductor device and method for manufacturing same

 #29
20150171050
2015-06-18

Conductive pad structure for hybrid bonding and methods of forming same

 #30
20150084202
2015-03-26

Die edge side connection

 #31
20140015088
2014-01-16

Three-dimensional integrated structure capable of detecting a temperature rise

 #32
20120252189
2012-10-04

Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods