209586 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto Auxiliary members for bump connectors, e.g. spacers
Sub-classes:SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
#2SEMICONDUCTOR PACKAGE
#3NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4Semiconductor package and method of manufacture
#5SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#6Semiconductor package and method of manufacture
#7Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#8Methods of fluxless micro-piercing of solder balls, and resulting devices
#9Tall and fine pitch interconnects
#10Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#11Tall and fine pitch interconnects
#12Method of assembly semiconductor device with through-package interconnect
#13Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#14Methods of fluxless micro-piercing of solder balls, and resulting devices
#15THERMAL FLEX CONTACT CARRIERS #2
#16MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT
#17Methods of fluxless micro-piercing of solder balls, and resulting devices
#18Methods of fluxless micro-piercing of solder balls, and resulting devices
#19TFCC (TM) and SWCC (TM) thermal flex contact carriers
#20Interconnections resistant to wicking
#21Integrated circuit package system with integrated circuit support