H01L2224/15 - CPC Classification Index

ClassID:

209717 ⎘

H01L2224/15 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto Structure, shape, material or disposition of the bump connectors after the connecting process

Sub-classes:

H01L2224/16 » of an individual bump connector 5,2K
H01L2224/17 » of a plurality of bump connectors 22

Recent Application in this class:

20190103341

2019-04-04

Electrode connection structure, lead frame, and method for forming electrode connection structure

20170359093

2017-12-14

Attachment structure for electronic component accommodation box

20170098623

2017-04-06

IC structure with angled interconnect elements