Patents-Review.com
ClassID:

209587 ⎘

H01L2224/10122 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected

Sub-classes:
Recent Application in this class:
#1
20250285905
2025-09-11

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #2
20250157972
2025-05-15

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

 #3
20240297131
2024-09-05

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT

 #4
20240222306
2024-07-04

Electronic package structure and method for manufacturing the same

 #5
20240222301
2024-07-04

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES

 #6
20240047397
2024-02-08

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

 #7
20230360949
2023-11-09

Semiconductor package and manufacturing method thereof

 #8
20230268196
2023-08-24

Redistribution structures for semiconductor packages and methods of forming the same

 #9
20230197632
2023-06-22

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

 #10
20230163091
2023-05-25

Electronic package structure and method for manufacturing the same

 #11
20220246559
2022-08-04

Semiconductor packages having a die, an encapsulant, and a redistribution structure

 #12
20220189877
2022-06-16

Thermally and electrically conductive interconnects

 #13
20220108970
2022-04-07

Semiconductor die with capillary flow structures for direct chip attachment

 #14
20220076982
2022-03-10

Semiconductor package and manufacturing method thereof

 #15
20210327726
2021-10-21

Redistribution structures for semiconductor packages and methods of forming the same

 #16
20210193610
2021-06-24

Semiconductor die with capillary flow structures for direct chip attachment

 #17
20210125951
2021-04-29

Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer

 #18
20210091057
2021-03-25

Driving substrate and manufacturing method thereof, and micro LED bonding method

 #19
20210057259
2021-02-25

Semiconductor package, manufacturing method of semiconductor device and semiconductor package

 #20
20200098713
2020-03-26

Semiconductor device

 #21
20190378807
2019-12-12

Semiconductor package and method of manufacturing same

 #22
20190304803
2019-10-03

Redistribution structures for semiconductor packages and methods of forming the same

 #23
20190295972
2019-09-26

Methods of forming semiconductor packages having a die with an encapsulant

 #24
20190229081
2019-07-25

Semiconductor devices

 #25
20190027452
2019-01-24

Semicondcutor device and manufacturing method thereof

 #26
20180301429
2018-10-18

Semiconductor device

 #27
20160336288
2016-11-17

Semiconductor device

 #28
20150325541
2015-11-12

Semiconductor device

 #29
20150214208
2015-07-30

Microelectronic assembly having a heat spreader for a plurality of die

 #30
20140197541
2014-07-17

Microelectronic assembly having a heat spreader for a plurality of die

 #31
20120153410
2012-06-21

Semiconductor chip capable of improving mounting reliability and semiconductor package having the same

 #32
20120104600
2012-05-03

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

 #33
20100244246
2010-09-30

Electronic component with mechanically decoupled ball connections

 #34
20100187685
2010-07-29

Semiconductor device

 #35
20090243091
2009-10-01

Mock bump system for flip chip integrated circuits

 #36
20090230547
2009-09-17

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

 #37
20090117729
2009-05-07

Electrostatic discharge (ESD) protection structure

 #38
20090035959
2009-02-05

INTERCONNECT ASSEMBLIES AND METHODS

 #39
20080119029
2008-05-22

WAFER SCALE THIN FILM PACKAGE

 #40
20070257347
2007-11-08

CHIP STRUCTURE AND FABRICATING PROCESS THEREOF