209604 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bump connector, e.g. solder flow barrier
MULTI-CHIP PACKAGING
#2MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW
#3MULTIPLE POLYMER LAYERS AS THE ENCAPSULANT OF CONDUCTIVE VIAS
#4SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#5Multiple Polymer Layers as the Encapsulant of Conductive Vias
#6Method for packaging stacking flip chip
#7SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#8WAFER CHIP SCALE PACKAGE
#9ELECTRONIC PACKAGE AND A PACKAGING METHOD
#10SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METHODS FOR MANUFACTURING THE SAME
#11MULTI-CHIP PACKAGING
#12SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#13ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
#14SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
#15SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#16SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#17Methods of manufacturing semiconductor device with bump interconnection
#18CHIP STRUCTURE AND CHIP PREPARATION METHOD
#19Metal-bump sidewall protection
#20Sidewall wetting barrier for conductive pillars
#21Light-emitting device and displayer
#22Multi-chip packaging
#23Barrier structures between external electrical connectors
#24BALL PLACEMENT STRUCTURE AND PREPARATION PROCESS THEREOF
#25Multi-chip packaging
#26PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME
#27Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
#28Semiconductor device and manufacturing method for semiconductor device
#29Solderless interconnect for semiconductor device assembly
#30Integrated circuit structure and method for reducing polymer layer delamination
#31Solderless interconnection structure and method of forming same
#32Method of Packaging an Integrated Circuit
#33Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor device
#34Solderless interconnect for semiconductor device assembly
#35Semiconductor device structure with protected bump and method of forming the same
#36Wafer chip scale package
#37Semiconductor device and manufacturing method thereof
#38Metal-bump sidewall protection
#39Dielectric molded indium bump formation and INP planarization
#40Multi-chip packaging
#41Method for manufacturing compliant bump
#42Method of manufacturing electronic component and method of manufacturing semiconductor device
#43Metal-bump sidewall protection
#44Fabrication of solder balls with injection molded solder
#45Multi-chip packaging
#46Barrier structures between external electrical connectors
#47Solderless interconnection structure and method of forming same
#48Semiconductor device
#49Packaged semiconductor devices and methods of packaging thereof
#50Semiconductor device and method of manufacturing the same
#51Flux-free solder ball mount arrangement
#52Tall and fine pitch interconnects
#53Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#54Combing bump structure and manufacturing method thereof
#55Semiconductor device and manufacturing method thereof
#56Fabrication of solder balls with injection molded solder
#57Crystal controlled oscillator and manufacturing method of crystal controlled oscillator
#58Semiconductor device and method for manufacturing the same
#59Methods of forming integrated circuit structure for joining wafers and resulting structure
#60Semiconductor device and manufacturing method thereof
#61Semiconductor device and manufacturing method for semiconductor device
#62Fabrication of solder balls with injection molded solder
#63Fabrication of solder balls with injection molded solder
#64Tall and fine pitch interconnects
#65Chip mounting structure
#66Semiconductor package structure and method for forming the same
#67SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
#68Manufacturing method of semiconductor package
#69Flip chip
#70Methods and structures for packaging semiconductor dies
#71Barrier structures between external electrical connectors
#72Semiconductor device and method for manufacturing the same
#73Integrated circuit structure and method for reducing polymer layer delamination
#74Optimized solder pads for microelectronic components
#75Solderless interconnection structure and method of forming same
#76Semiconductor device and manufacturing method thereof
#77Conductive contacts having varying widths and method of manufacturing same
#78Semiconductor package structure and method for forming the same
#79Packaging devices and methods of manufacture thereof
#80Chip mounting structure
#81Semiconductor device and manufacturing method thereof
#82Packaging devices and methods of manufacture thereof
#83Flip chip package and manufacturing method thereof
#84Packaging devices and methods of manufacture thereof
#85Systems, methods and devices for inter-substrate coupling
#86Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#87Fabricating pillar solder bump
#88Methods for solder for through-mold interconnect
#89Bump structure and method of forming same
#90REDUCED TITANIUM UNDERCUT IN ETCH PROCESS
#91Wafer level packages having non-wettable solder collars and methods for the fabrication thereof
#92Conductive contacts having varying widths and method of manufacturing same
#93Metal contact for semiconductor device
#94Bowl-shaped solder structure
#95Metal contact for chip packaging structure
#96Packaging devices and methods of manufacture thereof
#97Methods and structures for packaging semiconductor dies
#98Barrier structures between external electrical connectors
#99Fabricating pillar solder bump
#100Packaging devices and methods of manufacture thereof
#101Packaging devices and methods of manufacture thereof
#102System and process for fabricating semiconductor packages
#103Interconnection structure and method of forming same
#104Structures having a tapering curved profile and methods of making same
#105Method of manufacturing semiconductor device
#106Method and apparatus of manufacturing functionally gradient material
#107Alignment structures for integrated-circuit packaging
#108Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#109Solder contacts and methods of forming same
#110Driving circuit for a liquid crystal display device, method of manufacturing the same and display device having the same
#111Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#112Semiconductor structure and manufacturing method thereof
#113Combing bump structure and manufacturing method thereof
#114Fabrication of solder balls with injection molded solder
#115Robust pillar structure for semicondcutor device contacts