Patents-Review.com
ClassID:

209609 ⎘

H01L2224/1112 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Manufacture and pre-treatment of the bump connector preform Applying permanent coating

Recent Application in this class:
#1
20250174588
2025-05-29

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS WITH WETTABLE FLANKS

 #2
20250022826
2025-01-16

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

 #3
20240332233
2024-10-03

METHOD OF BONDING COLUMN TYPE DEPOSITS

 #4
20240088079
2024-03-14

METAL PILLAR FOR CONDUCTIVE CONNECTION

 #5
20230044737
2023-02-09

PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION DEVICE

 #6
20210313287
2021-10-07

Solderless interconnection structure and method of forming same

 #7
20200343209
2020-10-29

Interconnect structures and methods of forming same

 #8
20200303333
2020-09-24

Electronic package and manufacturing method thereof

 #9
20190295971
2019-09-26

Solderless interconnection structure and method of forming same

 #10
20190244920
2019-08-08

Interconnect structures and methods of forming same

 #11
20190013287
2019-01-10

Tall and fine pitch interconnects

 #12
20190013285
2019-01-10

Conductive ball and electronic device

 #13
20180374812
2018-12-27

Method of forming solder bumps

 #14
20180348259
2018-12-06

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED

 #15
20180254254
2018-09-06

Copper pillar bump structure and manufacturing method therefor

 #16
20180226373
2018-08-09

Interconnect structures and methods of forming same

 #17
20180174949
2018-06-21

Metal cored solder decal structure and process

 #18
20180096960
2018-04-05

Tall and fine pitch interconnects

 #19
20180076165
2018-03-15

Method of forming solder bumps

 #20
20180076164
2018-03-15

Method of forming solder bumps

 #21
20180076163
2018-03-15

Method of forming solder bumps

 #22
20170117245
2017-04-27

Solderless interconnection structure and method of forming same

 #23
20170069587
2017-03-09

Conductive contacts having varying widths and method of manufacturing same

 #24
20160148885
2016-05-26

Cu core ball

 #25
20160118359
2016-04-28

Interconnect structures and methods of forming same

 #26
20160084882
2016-03-24

Test probe head for full wafer testing

 #27
20150357301
2015-12-10

Bump structure and method of forming same

 #28
20150325542
2015-11-12

Conductive contacts having varying widths and method of manufacturing same

 #29
20150318251
2015-11-05

Metal cored solder decal structure and process

 #30
20150318238
2015-11-05

Device packaging with substrates having embedded lines and metal defined pads

 #31
20150241476
2015-08-27

Method of forming surface protrusions on an article and the article with the protrusions attached

 #32
20150187724
2015-07-02

Method and apparatus for a conductive pillar structure

 #33
20150061129
2015-03-05

Bump electrode, board which has bump electrodes, and method for manufacturing the board

 #34
20150008578
2015-01-08

Device packaging with substrates having embedded lines and metal defined pads

 #35
20140262003
2014-09-18

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

 #36
20140110835
2014-04-24

Bump package and methods of formation thereof

 #37
20140077360
2014-03-20

Interconnection structure and method of forming same

 #38
20140077359
2014-03-20

Structures having a tapering curved profile and methods of making same

 #39
20140035150
2014-02-06

Metal cored solder decal structure and process

 #40
20130196504
2013-08-01

Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate

 #41
20130043573
2013-02-21

Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores

 #42
20120280388
2012-11-08

Copper pillar bump with non-metal sidewall protection structure and method of making the same

 #43
20120161330
2012-06-28

Device packaging with substrates having embedded lines and metal defined pads

 #44
20110266667
2011-11-03

Cu pillar bump with non-metal sidewall protection structure

 #45
20090134207
2009-05-28

Solder ball attachment ring and method of use