209607 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods Manufacture and pre-treatment of the bump connector preform
Sub-classes:MULTI-CHIP PACKAGE AND METHOD OF MAKING
#2CONNECTING PILLAR
#3PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND METHOD FOR MANUFACTURING THE SAME
#4EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE
#5Combination polyimide decal with a rigid mold
#6Fabrication method of semiconductor package with stacked semiconductor chips
#7Semiconductor device and method of manufacture
#8Semiconductor devices having cutouts in an encapsulation material and associated production methods
#9Semiconductor device manufacturing method
#10Semiconductor device and method of manufacture
#11Tall and fine pitch interconnects
#12METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED
#13Fabrication method of semiconductor package with stacked semiconductor chips
#14Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure
#15Metal cored solder decal structure and process
#16Tall and fine pitch interconnects
#17Multilayer substrate
#18Conductive connections, structures with such connections, and methods of manufacture
#19Multilayer substrate
#20Method for producing metal ball, joining material, and metal ball
#21Transient interface gradient bonding for metal bonds
#22Sintering materials and attachment methods using same
#23Method for manufacturing metal powder
#24Semiconductor structure and manufacturing method thereof
#25Conductive connections, structures with such connections, and methods of manufacture
#26Semiconductor structure and method of fabricating the same
#27Cu core ball
#28Test probe head for full wafer testing
#29Integrated circuit packages and methods of forming same
#30Conductive connections, structures with such connections, and methods of manufacture
#31Conductive connections, structures with such connections, and methods of manufacture
#32Metal cored solder decal structure and process
#33Method for bonding bare chip dies
#34Method of forming surface protrusions on an article and the article with the protrusions attached
#35Package on package structure and method of manufacturing the same
#36Packaging methods and packaged semiconductor devices
#37Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate
#38Method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
#39Metal cored solder decal structure and process
#40Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method
#41Semiconductor package with stacked semiconductor chips
#42Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
#43Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
#44SEMICONDUCTOR DEVICE INTERCONNECT
#45Solder cap bump in semiconductor package and method of manufacturing the same
#46METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK
#47Metal bump formation
#48Removing material from defective opening in glass mold
#49Removing material from defective opening in glass mold and related glass mold for injection molded solder
#50CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL
#51Template wafer and process for small pitch flip-chip interconnect hybridization
#52Solder bump connections
#53SEMICONDUCTOR CHIP, STACKED CHIP SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND FABRICATING METHOD THEREOF
#54Method of making a semiconductor device having a conductive particle on an electric pad
#55Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink
#56Integrated (multilayer) circuits and process of producing the same
#57Template process for small pitch flip-chip interconnect hybridization
#58ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT
#59Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal
#60Semiconductor device and manufacturing method thereof
#61Semiconductor package, semiconductor module, and method for fabricating the semiconductor package
#62Microelectronic contact structure
#63Semiconductor package with joint reliability, entangled wires including insulating material
#64Process for Preparing a Solder Stand-Off
#65Removing material from defective opening in glass mold
#66REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD
#67METHOD OF FORMING CONDUCTIVE BUMPS
#68COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS
#69Interconnect structure with stress buffering ability and the manufacturing method thereof
#70Techniques for forming interconnects
#71MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
#72Interconnect structure with stress buffering ability and the manufacturing method thereof
#73Nanoscale probes for electrophysiological applications
#74Fluxless solder transfer and reflow process
#75Method and apparatus for forming metal contacts on a substrate
#76Method and apparatus for forming metal contacts on a substrate