209614 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the bump connector in liquid form Screen printing, i.e. using a stencil
METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#602Test pads on flash memory cards
#603Solder joint flip chip interconnection having relief structure
#604Chip scale surface mount package for semiconductor device and process of fabricating the same
#605Method for manufacturing semiconductor device
#606Semiconductor device, electronic device and fabrication method of the same
#607Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#608Bare chip embedded PCB
#609Semiconductor device, method of manufacturing the same, and camera module
#610Test pads on flash memory cards
#611Object and bonding method thereof
#612CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS
#613Flip-chip mounting substrate and flip-chip mounting method
#614Semiconductor device and manufacturing method of the same
#615Semiconductor devices including voltage switchable materials for over-voltage protection
#616Method and apparatus for attaching solder balls to substrate
#617Solder joint flip chip interconnection
#618Junction structure for a terminal pad and solder, and semiconductor device having the same
#619Semiconductor package with controlled solder bump wetting
#620Method for forming improved bump structure
#621Integrated circuit solder bumping system
#622Semiconductor device and manufacturing method thereof
#623Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#624Method of packaging and interconnection of integrated circuits
#625Methods of bonding two semiconductor devices
#626Semiconductor device and manufacturing method of the same
#627Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#628Method of fabricating a stacked die in die BGA package
#629Method of fabricating a stacked die in die BGA package
#630Stacked die in die BGA package
#631Wafer level pre-packaged flip chip systems
#632Wafer level pre-packaged flip chip
#633Backside method for fabricating semiconductor components with conductive interconnects
#634Wafer level pre-packaged flip chip
#635Wafer level pre-packaged flip chip system
#636Semiconductor package with controlled solder bump wetting and fabrication method therefor
#637Packing method for electronic components
#638Stacked die-in-die BGA package with die having a recess
#639Semiconductor device and semiconductor-device manufacturing method
#640Microelectronic assemblies having compliancy
#641Semiconductor device and its writing method
#642Method for solder bumping, and solder-bumping structures produced thereby
#643Flip chip bonding structure using non-conductive adhesive and related fabrication method
#644Low melting-point solders, articles made thereby, and processes of making same
#645Method for fabricating semiconductor package with circuit side polymer layer
#646Solder bumps formation using solder paste with shape retaining attribute
#647Method and stencil for extruding material on a substrate
#648Method and stencil for extruding material on a substrate
#649High performance system-on-chip discrete components using post passivation process
#650Use of palladium in IC manufacturing with conductive polymer bump
#651High performance system-on-chip discrete components using post passivation process
#652Use of palladium in IC manufacturing with conductive polymer bump
#653Method of manufacturing wafer level chip size package
#654Moly mask construction and process
#655Flip-chip wire bondless power device
#656Semiconductor package with lateral bump structure
#657Semiconductor structure and manufacturing method thereof