209614 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the bump connector in liquid form Screen printing, i.e. using a stencil
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
#302Semiconductor device and fabrication method
#303Semiconductor packaging structure and method for forming the same
#304Semiconductor IC packaging methods and structures
#305Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same
#306Semiconductor packaging structure and method
#307Glass carrier with embedded semiconductor device and metal layers on the top surface
#308Routing layer for mitigating stress in a semiconductor die
#309Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
#310Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
#311Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#312Semiconductor device with protective layer over exposed surfaces of semiconductor die
#313Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#314Methods and apparatus of packaging semiconductor devices
#315Copper post solder bumps on substrates
#316Solder on trace technology for interconnect attachment
#317Interposer system and method
#318Integrated system and method of making the integrated system
#319Wafer-level device packaging
#320Method of manufacturing semiconductor packaging
#3213DIC stacking device and method of manufacture
#322Integrated WLUF and SOD process
#323SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
#324Semiconductor device and method of forming an embedded SOP fan-out package
#325Shaped and oriented solder joints
#326Coaxial solder bump support structure
#327Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces
#328Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
#329Protected solder ball joints in wafer level chip-scale packaging
#330Methods and apparatus for solder connections
#331Method for designing a package and substrate layout
#332Electrode body, wiring substrate, and semiconductor device
#333SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
#334Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief
#335Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
#336Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration
#337Integrated circuit chip using top post-passivation technology and bottom structure technology
#338Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP
#339Integrated antennas in wafer level package
#340Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#341Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#342Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
#343Solder bump joint in a device including lamellar structures
#344Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM
#345Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#346Method for building vertical pillar interconnect
#347Semiconductor device
#348Apparatus and method for placing solder balls
#349Microspring structures adapted for target device cooling
#350Method of manufacturing bump
#351Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
#352Device including two power semiconductor chips and manufacturing thereof
#353Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
#354Piezoelectric device
#355Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#356Solder ball mounting tool
#357Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSON
#358Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
#359Methods and apparatus of under bump metallization in packaging semiconductor devices
#360Conductive structure and method for forming the same
#361Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer
#362Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#363Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
#364Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#365SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT
#366Semiconductor device and method of forming conductive pillar having an expanded base
#367Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#368Semiconductor device and method of forming interconnect substrate for FO-WLCSP
#369Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#370Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
#371Method for manufacturing a circuit device
#372Routing layer for mitigating stress in a semiconductor die
#373Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#374Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#375SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
#376METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS
#377Coaxial solder bump support structure
#378Pillar design for conductive bump
#379SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
#380Conductive connecting member and manufacturing method of same
#381Electrically conductive paste, and electrically conducive connection member produced using the paste
#382Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump
#383SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES
#384Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump
#385Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
#386MEMS anchor and spacer structure
#387Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer
#388Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
#389Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#390Wafer level package with thermal pad for higher power dissipation
#391Copper pillar bump with non-metal sidewall protection structure and method of making the same
#392Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
#393Integrated circuit device including a copper pillar capped by barrier layer
#394Solder joint flip chip interconnection having relief structure
#395Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar
#396Routing layer for mitigating stress in a semiconductor die
#397Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
#398Copper post solder bumps on substrate
#399Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps
#400Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#401Method of fabricating a semiconductor chip with supportive terminal pad
#402Reinforcement structure for flip-chip packaging
#403SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME
#404Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP
#405Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump
#406Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#407Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device
#408Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP
#409Copper pillar full metal via electrical circuit structure
#410Solder paste, joining method using the same and joined structure
#411Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
#412Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
#413Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#414Solder joint flip chip interconnection
#415Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#416CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME
#417Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
#418STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING
#419THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY
#420Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#421Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#422Integrated antennas in wafer level package
#423SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#424Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
#425Microelectronic assemblies having compliancy and methods therefor
#426Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same
#427Conductive pillar structure
#428Manufacturing method of semiconductor device
#429Semiconductor device and method of bonding different size semiconductor die at the wafer level
#430Method for mounting luminescent device
#431Semiconductor device having pad structure with stress buffer layer
#432Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#433Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers
#434SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
#435Pillar bumps and process for making same
#436SQUEEGEE MODULE
#437Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#438Semiconductor device and electronic apparatus including the same
#439WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
#440Method of manufacturing and assembling semiconductor chips with offset pads
#441Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#442Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP
#443Electrical contact alignment posts
#444Semiconductor device cover mark
#445Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
#446Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
#447Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die
#448Methods of forming semiconductor chip underfill anchors
#449Method of forming Cu pillar capped by barrier layer
#450Method of forming semiconductor die
#451Conductive pillar for semiconductor substrate and method of manufacture
#452DOUBLE MOLDED CHIP SCALE PACKAGE
#453Semiconductor device and manufacturing method thereof
#454Wafer level package (WLP) device having bump assemblies including a barrier metal
#455Electronic package with stacked semiconductor chips
#456Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect
#457Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#458Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#459Semiconductor apparatus and semiconductor apparatus unit
#460Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#461Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#462Method of manufacturing a printed circuit board (PCB)
#463Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#464IC CHIP AND IC CHIP MANUFACTURING METHOD THEREOF
#465WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#466MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY
#467Cu pillar bump with non-metal sidewall protection structure
#468Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
#469Wafer-bump structure
#470Routing layer for mitigating stress in a semiconductor die
#471CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#472Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#473Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
#474Wafer level integrated interconnect decal and manufacturing method thereof
#475Cu pillar bump with non-metal sidewall protection structure
#476Tape residue-free bump area after wafer back grinding
#477Methods of forming semiconductor chip underfill anchors
#478Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#479Semiconductor device and method of forming IPD in fan-out level chip scale package
#480SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
#481Stacked semiconductor components having conductive interconnects
#482Chip package and fabrication method thereof
#483Chip package and fabrication method thereof
#484Chip package
#485Semiconductor devices including voltage switchable materials for over-voltage protection
#486Conductor bump method and apparatus
#487Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
#488EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS
#489Semiconductor device and method of forming electrical interconnect with stress relief void
#490Die mounting substrate and method of fabricating the same
#491Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip
#492Pad structure for semiconductor devices
#493Post passivation interconnect with oxidation prevention layer
#494Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#495Routing layer for mitigating stress in a semiconductor die
#496Semiconductor module, method of manufacturing semiconductor module, and mobile device
#497Semiconductor Chip with Stair Arrangement Bump Structures
#498Method For Fabricating A Through Interconnect On A Semiconductor Substrate
#499NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
#500Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#501Solder interconnect by addition of copper
#502SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF AND STACK PACKAGE USING THE SAME
#503METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#504Die stacking apparatus and method
#505Chip-size-package semiconductor chip and manufacturing method
#506Integrated circuit chip using top post-passivation technology and bottom structure technology
#507Filp chip interconnection structure with bump on partial pad and method thereof
#508Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#509Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#510METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#511Microelectronic assemblies having compliancy and methods therefor
#512Semiconductor device having a conductive bump
#513Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#514Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
#515Solder bump UBM structure
#516Semiconductor module having semiconductor device mounted on device mounting substrate
#517Underbump metallization structure
#518Semiconductor device and method of fabricating the same
#519Semiconductor device and manufacturing method thereof
#520Electronic device package and fabrication method thereof
#521LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
#522Semiconductor device and method for fabricating the same
#523Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
#524DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE
#525Device mounting board and semiconductor module
#526Method of manufacturing semiconductor device
#527Wafer level package using stud bump coated with solder
#528Solder joint flip chip interconnection having relief structure
#529Solder joint flip chip interconnection
#530SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#531Method of packaging and interconnection of integrated circuits
#532Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device
#533Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
#534Semiconductor package and method for manufacturing semiconductor package
#535CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME
#536CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCESS OF FABRICATING THE SAME
#537Electronic packages
#538Integrated circuit system having different-size solder bumps and different-size bonding pads
#539Flip-chip mounting substrate and flip-chip mounting method
#540Semiconductor device and manufacturing method of the same
#541Semiconductor device and method for manufacturing same
#542Flip chip interconnection structure with bump on partial pad and method thereof
#543Method of bonding
#544Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween
#545SEMICONDUCTOR DEVICE
#546MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS
#547ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#548Protected solder ball joints in wafer level chip-scale packaging
#549FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF
#550Method for micro component self-assembly
#551Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#552Semiconductor device and method of laser-marking wafers with tape applied to its active surface
#553Semiconductor device and method of forming interconnect structure in non-active area of wafer
#554Die stacking apparatus and method
#555Under Bump Routing Layer Method and Apparatus
#556Conductor bump method and apparatus
#557Substrate and mask aligning apparatus
#558Apparatus and method of mounting conductive ball
#559Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure
#560Semiconductor device
#561Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method
#562Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
#563Through silicon via dies and packages
#564Substrate manufacturing method
#565Metal interconnect System and Method for Direct Die Attachment
#566Semiconductor device and manufacturing method of the same
#567SOLDER SUPPLYING METHOD
#568Semiconductor module manufacturing method, semiconductor module, and mobile device
#569Semiconductor device
#570SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD
#571System for fabricating semiconductor components with conductive interconnects
#572Device having a bonding structure for two elements
#573Semiconductor package and fabricating method thereof
#574Semiconductor module, method of manufacturing semiconductor module, and mobile device
#575Methods for fabricating semiconductor components with conductive interconnects
#576Semiconductor components with conductive interconnects
#577Integrated circuit including conductive bumps
#578Under bump metallurgy structure of a package and method of making same
#579Voltage regulator integrated with semiconductor chip
#580Microelectronic assemblies having compliancy and methods therefor
#581Method of manufacturing wafer level chip size package
#582Stacked die in die BGA package
#583Chip and manufacturing method and application thereof
#584Use of palladium in IC manufacturing with conductive polymer bump
#585Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
#586Solder ball mounting method and solder ball mounting substrate manufacturing method
#587Semiconductor device
#588Stacked die with a recess in a die BGA package
#589SOLDER BUMPS FORMATION USING SOLDER PASTE WITH SHAPE RETAINING ATTRIBUTE
#590Method of providing solder bumps on a substrate using localized heating
#591Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#592Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same
#593Semiconductor device
#594Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
#595Method of fabricating a stacked die having a recess in a die BGA package
#596Semiconductor device and its wiring method
#597Semiconductor device and its wiring method
#598Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
#599Method of providing mixed size solder bumps on a substrate using a solder delivery head
#600Electronics package and associated method