H01L2224/11418 - CPC Classification Index

ClassID:

209622 ⎘

H01L2224/11418 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in liquid form Spray coating

Recent Application in this class:

20220059483

CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE

20190198376

Wafer level flat no-lead semiconductor packages and methods of manufacture

20190198375

Wafer level flat no-lead semiconductor packages and methods of manufacture

20190198374

Wafer level flat no-lead semiconductor packages and methods of manufacture

20180174881

Wafer level flat no-lead semiconductor packages and methods of manufacture

20180076169

CHIP BONDING PROCESS

20180056455

Engineered polymer-based electronic materials

20160379951

Magnetic intermetallic compound interconnect

20160027694

Wafer level flat no-lead semiconductor packages and methods of manufacture

20140268574

Component built-in board and method of manufacturing the same, and component built-in board mounting body

20070085175

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

20060226203

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

15297158

Solder ball, manufacturing method thereof, and semiconductor device