Patents-Review.com
ClassID:

209620 ⎘

H01L2224/1141 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in liquid form

Sub-classes:
Recent Application in this class:
#1
20240395768
2024-11-28

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

 #2
20230084360
2023-03-16

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

 #3
20220406749
2022-12-22

ELECTRICAL CONNECTION METHOD FOR ELECTRONIC ELEMENT, AND RELATED APPARATUS THEREOF

 #4
20200266074
2020-08-20

Multi-die package with bridge layer

 #5
20200150362
2020-05-14

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

 #6
20200150361
2020-05-14

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

 #7
20200126951
2020-04-23

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

 #8
20200035585
2020-01-30

Multiple sized bump bonds

 #9
20190304948
2019-10-03

Metal bonding pads for packaging applications

 #10
20190131266
2019-05-02

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

 #11
20180269177
2018-09-20

Metal bonding pads for packaging applications

 #12
20180056455
2018-03-01

Engineered polymer-based electronic materials

 #13
20170271295
2017-09-21

Electronic device and method for producing an electronic device

 #14
20170236724
2017-08-17

Methods for making multi-die package with bridge layer

 #15
20160240501
2016-08-18

Reduced volume interconnect for three-dimensional chip stack

 #16
20160160102
2016-06-09

Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device

 #17
20160118358
2016-04-28

Direct injection molded solder process for forming solder bumps on wafers

 #18
20160093597
2016-03-31

Multi-die package with bridge layer and method for making the same

 #19
20140317915
2014-10-30

Composition and methods of forming solder bump and flip chip using the same

 #20
20140069817
2014-03-13

Direct injection molded solder process for forming solder bumps on wafers

 #21
20110201195
2011-08-18

Flip chip mounting method and bump forming method

 #22
20110133137
2011-06-09

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME

 #23
20100047971
2010-02-25

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

 #24
20100006625
2010-01-14

Composition and methods of forming solder bump and flip chip using the same

 #25
20090117688
2009-05-07

Flip chip mounting method and bump forming method

 #26
20090023245
2009-01-22

Flip chip mounting method and bump forming method

 #27
20080284046
2008-11-20

Flip chip mounting method and bump forming method

 #28
20080142966
2008-06-19

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

 #29
20080128664
2008-06-05

Flip-chip mounting resin composition and bump forming resin composition

 #30
20070001280
2007-01-04

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages