209627 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in liquid form Wave coating
Metal bonding pads for packaging applications
#2Integrated circuit system with carrier construction configuration and method of manufacture thereof
#3Metal bonding pads for packaging applications
#4METHOD FOR CHIP TO PACKAGE INTERCONNECT