H01L2224/11444 - CPC Classification Index

ClassID:

209631 ⎘

H01L2224/11444 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in gaseous form

Sub-classes:

H01L2224/1145 » Physical vapour deposition [PVD], e.g. evaporation, or sputtering 467
H01L2224/11452 » Chemical vapour deposition [CVD], e.g. laser CVD 152

Recent Application in this class:

20200266074

Multi-die package with bridge layer

20170236724

Methods for making multi-die package with bridge layer

20160126217

Systems, methods and devices for inter-substrate coupling

20160093597

Multi-die package with bridge layer and method for making the same

20130143361

Packaging process tools and systems, and packaging methods for semiconductor devices

20130089952

Packaging process tools and packaging methods for semiconductor devices

20130037933

Semiconductor package with under bump metallization routing

20120273951

Contact Metal for Hybridization and Related Methods

20120127660

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

20120012985

Substrate stand-offs for semiconductor devices