209638 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods using a lift-off mask
Multiple bond via arrays of different wire heights on a same substrate
#302Etching liquid, etching method, and method of manufacturing solder bump
#303Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant
#304Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop
#305Copper-containing layer on under-bump metallization layer
#306Semiconductor devices having through electrodes, methods of fabricating the same, electronic systems including the same, and memory cards including same
#307Semiconductor devices having through electrodes, methods of manufacturing the same, and semiconductor packages including the same
#308Method of forming semiconductor device having a conductive via structure
#309Multiple bond via arrays of different wire heights on a same substrate
#310Method of forming an integrated circuit device including a pillar capped by barrier layer
#311Semiconductor device and a method of manufacturing the same
#312Testing of semiconductor chips with microbumps
#313Phenolic polymers and photoresists comprising same
#314Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
#315Adjusting sizes of connectors of package components
#316Methods of fabricating semiconductor chip solder structures
#317Copper pillar sidewall protection
#318Semiconductor device having solderable and bondable electrical contact pads
#319Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#320Semiconductor device
#321Semiconductor device having low dielectric insulating film and manufacturing method of the same
#322Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
#323Metal contact for semiconductor device
#324Power management applications of interconnect substrates
#325Optoelectronic component with integrated protection diode and method of producing same
#326Semiconductor device
#327Integrated circuit chip and fabrication method
#328Manufacture of coated copper pillars
#329Solder stud structure
#330Semiconductor device structure and manufacturing method
#331Bump structure and method for forming the same
#332Package structure and manufacturing method
#333Solder ball protection in packages
#334Electrical connectivity of die to a host substrate
#335Semiconductor device and method of manufacturing same
#336Substrate design for semiconductor packages and method of forming same
#337Semiconductor device
#338Semiconductor device and manufacturing method thereof
#339Test structure and method of testing electrical characteristics of through vias
#340Semiconductor device with through silicon via and alignment mark
#341Method of manufacturing semiconductor device
#342Semiconductor package
#343Reduced stress TSV and interposer structures
#344Solder-on-die using water-soluble resist system and method
#345Bump structures for semiconductor package
#346Semiconductor device and manufacturing method thereof
#347Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#348Semiconductor element
#3493D die stacking structure with fine pitches
#350Semiconductor devices and methods of forming thereof
#351Semiconductor device and method for manufacturing the same
#352Alignment marks in substrate having through-substrate via (TSV)
#353Semiconductor structure
#354Structure to prevent solder extrusion
#355Plug via formation with grid features in the passivation layer
#356Liquid compositions and methods of fabricating a semiconductor device using the same
#357Hollow metal pillar packaging scheme
#358Bump structures in semiconductor packages and methods of fabricating the same
#359Semiconductor device and fabrication method thereof and semiconductor structure
#360Copper pillar bump and flip chip package using same
#361Three-dimensional chip stack and method of forming the same
#362Semiconductor interconnect structure
#363Semiconductor device and manufacturing method thereof
#364Semiconductor device
#365Semiconductor device with improved metal pillar configuration
#366Semiconductor device having low dielectric insulating film and manufacturing method of the same
#367Dummy flip chip bumps for reducing stress
#368Semiconductor device and method of manufacturing same
#369Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP
#370Mechanisms for forming hybrid bonding structures with elongated bumps
#371Method of forming a reliable microelectronic assembly
#372Method of making a pillar structure having a non-metal sidewall protection structure
#373Electroplating baths of silver and tin alloys
#374Techniques for fabricating fine-pitch micro-bumps
#375Method of making a conductive pillar bump with non-metal sidewall protection structure
#376Methods of forming 3-D circuits with integrated passive devices
#377Semiconductor device
#378Testing of semiconductor chips with microbumps
#379Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
#380Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces
#381Metal bump structure for use in driver IC and method for forming the same
#382Metal bump structure for use in driver IC and method for forming the same
#383Image pickup device and method for producing the same
#384Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
#385Semiconductor device and a method of manufacturing the same
#386Adjusting sizes of connectors of package components
#387Chip interposer, semiconductor device, and method for manufacturing a semiconductor device
#388Semiconductor device manufacturing method and semiconductor device
#389Chip and manufacturing method thereof
#390Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#391Solder joint flip chip interconnection
#392Scheme for connector site spacing and resulting structures
#393Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#394Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#395Copper nanorod-based thermal interface material (TIM)
#396Etching agent for copper or copper alloy
#397Front side copper post joint structure for temporary bond in TSV application
#398Isolation structure for stacked dies
#399Semiconductor device including a solder and method of fabricating the same
#400High density package interconnects
#401Semiconductor device and manufacturing method of the same
#402Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#403Semiconductor device
#404Metal routing architecture for integrated circuits
#405Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#406Semiconductor device with through silicon via and alignment mark
#407Pillar on pad interconnect structures, semiconductor devices including same and related methods
#408Flip chip package structure and fabrication process thereof
#409Bump structures for semiconductor package
#410Method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
#411Advanced device assembly structures and methods
#412Semiconductor manufacturing method and semiconductor structure thereof
#413Organic thin film passivation of metal interconnections
#414Connector design for packaging integrated circuits
#415Plasma treatment for semiconductor devices
#416Method of forming a plurality of bumps on a substrate and method of forming a chip package
#417Semiconductor packaging structure and method for forming the same
#418Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same
#419Semiconductor packaging structure and method
#420Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#421Self-aligned protection layer for copper post structure
#422Semiconductor device and a method of manufacturing the same
#423IC wafer having electromagnetic shielding effects and method for making the same
#424Bump structures having an extension
#425Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#426Semiconductor device having low dielectric insulating film and manufacturing method of the same
#427Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#428Direct injection molded solder process for forming solder bumps on wafers
#429Manufacturing method for micro bump structure
#430Structure to increase resistance to electromigration
#431GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
#432Bump structures for semiconductor package
#433Terminal structure, and semiconductor element and module substrate comprising the same
#434Terminal structure, and semiconductor element and module substrate comprising the same
#435Terminal structure and semiconductor device
#436Terminal structure and semiconductor device
#437Solder on trace technology for interconnect attachment
#438Packaging structures and methods with a metal pillar
#439Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#440Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections
#441SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
#442SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PACKAGE STRUCTURE THEREOF
#443Semiconductor package structure and method for making the same
#444Bump structure for yield improvement
#445Solder volume compensation with C4 process
#446Semiconductor manufacturing method and semiconductor structure thereof
#447Redistribution layer (RDL) with variable offset bumps
#448Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
#449Method of manufacturing semiconductor packaging
#450Integrated WLUF and SOD process
#451Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#452SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
#453Semiconductor package structure and method for making the same
#454Reduced stress TSV and interposer structures
#455Coaxial solder bump support structure
#456Scheme for connector site spacing and resulting structures
#457Mounting structure of electronic component with joining portions and method of manufacturing the same
#458Selective solder bump formation on wafer
#459Protected solder ball joints in wafer level chip-scale packaging
#460Semiconductor package with stacked semiconductor chips
#461Cu pillar bump with electrolytic metal sidewall protection
#462Interlocking type solder connections for alignment and bonding of wafers and/or substrates
#463Package structure and substrate bonding method
#464Method for chip packaging
#465Controlled solder-on-die integrations on packages and methods of assembling same
#466Cleaning methods and compositions
#467Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
#468Connecting elements for producing hybrid electronic circuits
#469DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
#470STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#471Shallow via formation by oxidation
#472Semiconductor device
#473Electrode body, wiring substrate, and semiconductor device
#474SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
#475Plating bath and method
#476Electromigration-resistant lead-free solder interconnect structures
#477Conductive bump structure on substrate and fabrication method thereof
#478Method for manufacturing fine-pitch bumps and structure thereof
#479Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
#480ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
#481Integrated circuit chip using top post-passivation technology and bottom structure technology
#482Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package
#483Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#484Mechanisms for controlling bump height variation
#485Semiconductor device and method of manufacturing semiconductor device
#486Bumping process and structure thereof
#487Method of manufacturing a semiconductor device and wafer
#488Interconnect crack arrestor structure and methods
#489Method for building vertical pillar interconnect
#490Crack stopper on under-bump metallization layer
#491Package structure and semiconductor structure thereof
#492Bump structure and electronic packaging solder joint structure and fabricating method thereof
#493Semiconductor device
#494Planarized bumps for underfill control
#495Adjusting sizes of connectors of package components
#496Device having electrodes formed from bumps with different diameters
#497Mechanisms for forming fine-pitch copper bump structures
#498Test structure and method of testing electrical characteristics of through vias
#499PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
#500Package of electronic device including connecting bump, system including the same and method for fabricating the same
#501Methods of forming bump structures that include a protection layer
#502SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE
#503Bump with protection structure
#504Method and System for Metal Deposition in Semiconductor Processing
#505Power management applications of interconnect substrates
#506Method for formation of an electrically conducting through via
#507SEMICONDUCTOR DEVICE
#508METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE
#509Structure design for 3DIC testing
#510Interconnection Between Integrated Circuit and Package
#511Manufacturing method of semiconductor integrated circuit device
#512Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#513Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#514METHOD FOR THE FABRICATION OF BONDING SOLDER LAYERS ON METAL BUMPS WITH IMPROVED COPLANARITY
#515Self-aligned protection layer for copper post structure
#516Methods of fabricating semiconductor chip solder structures
#517Dummy flip chip bumps for reducing stress
#518Semiconductor package with under bump metallization routing
#519Method and system for forming conductive bumping with copper interconnection
#520Electronic chip comprising connection pillars and manufacturing method
#521METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS
#522Coaxial solder bump support structure
#523Bump structures in semiconductor device and packaging assembly
#524Metal bump structure
#525Bumping process and structure thereof
#526Semiconductor device and a method of manufacturing the same
#527Solder bump cleaning before reflow
#528Solder ball contact susceptible to lower stress
#529Solder bump with inner core pillar in semiconductor package
#530Bump I/O contact for semiconductor device
#531PLATING APPARATUS AND PLATING METHOD
#532UBM etching methods for eliminating undercut
#533SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
#534Ball-limiting-metallurgy layers in solder ball structures
#535Multi-component integrated circuit contacts
#536Conductive connecting member and manufacturing method of same
#537Method of manufacturing semiconductor device
#538Joint structures having organic preservative films
#539Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
#540Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
#541Metal bump formation
#542SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
#543METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES
#544Semiconductor device having magnetic alignment marks and underfill resin layers
#545Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump
#546Heterostructure containing IC and LED and method for fabricating the same
#547CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME
#5483D IC packaging structures and methods with a metal pillar
#549Connector design for packaging integrated circuits
#550Injection molded solder process for forming solder bumps on substrates
#551Injection molded solder process for forming solder bumps on substrates
#552Conductive via structure
#553Solder collapse free bumping process of semiconductor device
#554Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package
#555Die stacking with an annular via having a recessed socket
#556Doping Minor Elements into Metal Bumps
#557Wafer level package with thermal pad for higher power dissipation
#558Copper pillar bump with non-metal sidewall protection structure and method of making the same
#559Integrated circuit device including a copper pillar capped by barrier layer
#560Solder joint flip chip interconnection having relief structure
#561Etchant and method for manufacturing semiconductor device using same
#562Mechanisms for forming copper pillar bumps using patterned anodes
#563Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#564Etchant and method for manufacturing semiconductor device using same
#565Solder ball contact susceptible to lower stress
#566Semiconductor device with through silicon via and alignment mark
#567PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
#568SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#569IC wafer having electromagnetic shielding effects and method for making the same
#570Manufacturing method of a semiconductor load board
#571SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#572Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#573Method for manufacturing semiconductor device
#574Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer
#575Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer
#576Process for forming an anti-oxidant metal layer on an electronic device
#577Testing of semiconductor chips with microbumps
#578Semiconductor device, method of manufacturing semiconductor device, and electronic device
#579Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits
#580Packaging substrate with conductive structure
#581Dummy metal design for packaging structures
#582Method of forming metal pillar
#583Integrated circuit chip and fabrication method
#584Integrated circuit chip and fabrication method
#585Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#586Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
#587Semiconductor device and a method of manufacturing the same
#588Soft error rate mitigation by interconnect structure
#589Mechanisms for resistivity measurement of bump structures
#590Solder joint flip chip interconnection
#591METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#592Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
#593SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF
#594Semiconductor package
#595METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#596SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
#597METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM
#598Electroplated posts with reduced topography and stress
#599ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
#600BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE