209638 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods using a lift-off mask
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE
#602METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE
#603SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#604SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
#605Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
#606Semiconductor device and method of manufacturing the same
#607Microelectronic assemblies having compliancy and methods therefor
#608Under-bump metallization (UBM) structure and method of forming the same
#609Method and system for forming conductive bumping with copper interconnection
#610SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#611Semiconductor assembly and semiconductor package including a solder channel
#612CHIP STACKED STRUCTURE
#613Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
#614Method for reducing UBM undercut in metal bump structures
#615Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
#616Semiconductor device having pad structure with stress buffer layer
#617Compliant printed circuit wafer level semiconductor package
#618Semiconductor device and manufacturing method of semiconductor device
#619SEMICONDUCTOR DEVICE
#620Alignment marks in substrate having through-substrate via (TSV)
#621Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process
#622SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#623Bump structure with underbump metallization structure and integrated redistribution layer
#624Semiconductor apparatus
#625Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method
#626Semiconductor die terminal
#627Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#628Mechanisms for forming copper pillar bumps using patterned anodes
#629Method of manufacturing and assembling semiconductor chips with offset pads
#630Process for chip capacitive coupling
#631SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#632SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#633CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT
#634Doping minor elements into metal bumps
#635Conductive sidewall for microbumps
#636Substrate stand-offs for semiconductor devices
#637INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#638Solder bump with inner core pillar in semiconductor package
#639Method of forming Cu pillar capped by barrier layer
#640Method of forming semiconductor die
#641Conductive pillar for semiconductor substrate and method of manufacture
#642Method of fabricating semiconductor device allowing smooth bump surface
#643Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same
#644Plasma treatment for semiconductor devices
#645SEMICONDUCTOR CHIP WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME
#646Manufacturing method of bump structure with annular support
#647Chip package having a chip combined with a substrate via a copper pillar
#648Chip bump structure and method for forming the same
#649Reliable metal bumps on top of I/O pads after removal of test probe marks
#650Magnetic microelectronic device attachment
#651Method of manufacturing a printed circuit board (PCB)
#652PATTERNED CONTACT
#653Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#654Semiconductor chip with post-passivation scheme formed over passivation layer
#655MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY
#656Cu pillar bump with non-metal sidewall protection structure
#657Photosensitive composition
#658Cu pillar bump with electrolytic metal sidewall protection
#659Conductive feature for semiconductor substrate and method of manufacture
#660Method for fabricating bump structure without UBM undercut
#661Inverse chip connector
#662Semiconductor device and method of manufacturing the same
#663Structure and method of forming pillar bumps with controllable shape and size
#664Dummy metal design for packaging structures
#665Radiate under-bump metallization structure for semiconductor devices
#666Electronic device package and fabrication method thereof
#667Semiconductor device and semiconductor device manufacturing method
#668Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#669Integrated circuit system with stress redistribution layer and method of manufacture thereof
#670Cu pillar bump with non-metal sidewall protection structure
#671Under-Bump Metallization Structure for Semiconductor Devices
#672Die stacking with an annular via having a recessed socket
#673Pin-type chip tooling
#674Method for fabricating circuit component
#675METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#676Manufacturing method of a bump structure having a reinforcement member
#677Rigid-backed, membrane-based chip tooling
#678SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME
#679CHIP PACKAGE
#680METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST
#681Chip structure
#682Method of fabricating a conductive post on an electrode
#683Semiconductor chip with a bonding pad having contact and test areas
#684Conductive pillar structure for semiconductor substrate and method of manufacture
#685SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE
#686Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#687Package substrate capable of controlling the degree of warpage
#688Semiconductor Device and Bump Formation Process
#689Stacked semiconductor components having conductive interconnects
#690Solder Pillars in Flip Chip Assembly
#691Micro-bump structure
#692Semiconductor device and method for manufacturing the same
#693Overcoming laminate warpage and misalignment in flip-chip packages
#694Contact-based encapsulation
#695Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#696Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#697Conductor bump method and apparatus
#698Semiconductor device and method for making the same
#699Semiconductor device and method of forming electrical interconnect with stress relief void
#700Electrical bond connection system
#701Stacked electronic device and method of making such an electronic device
#702Method for forming post bump
#703Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#704Semiconductor element and method of manufacturing the same
#705Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
#706Mechanisms for forming copper pillar bumps
#707Copper bump joint structures with improved crack resistance
#708PILLAR BUMP WITH BARRIER LAYER
#709Post passivation interconnect with oxidation prevention layer
#710Semiconductor die contact structure and method
#711Robust joint structure for flip-chip bonding
#712Substrate anchor structure and method
#713Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
#714Method of making a connection component with hollow inserts
#715Preventing UBM oxidation in bump formation processes
#716SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE
#717METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF
#718Semiconductor device and manufacturing method thereof
#719Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
#720Chip having a metal pillar structure
#721Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same
#722Wafers including patterned back side layers thereon
#723Flip chip interconnection with double post
#724Semiconductor device and method for manufacturing same
#725Plating apparatus
#726Layered chip package
#727Protection layer for preventing UBM layer from chemical attack and oxidation
#728Fabrication for electroplating thick metal pads
#729Enhanced copper posts for wafer level chip scale packaging
#730Terminal face contact structure and method of making same
#731Semiconductor device and manufacturing method therefor
#732Semiconductor Chip with Stair Arrangement Bump Structures
#733Front side copper post joint structure for temporary bond in TSV application
#734Self-aligned protection layer for copper post structure
#735Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods
#736Die stacking with an annular via having a recessed socket
#737Semiconductor devices having stress relief layers and methods for fabricating the same
#738Method for insertion bonding and device thus obtained
#739Method of forming electrical connections
#740Manufacturing method of semiconductor device and semiconductor device
#741Post bump and method of forming the same
#742Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
#743Structures and methods to improve lead-free C4 interconnect reliability
#744METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#745Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#746Formation of TSV backside interconnects by modifying carrier wafers
#747Manufacturing method of semiconductor device including Au bump on seed film
#748Methods for producing an ultrathin semiconductor circuit
#7493-D semiconductor die structure with containing feature and method
#750Die stacking apparatus and method
#751Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
#752METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
#753Substrate for flip chip bonding and method of fabricating the same
#754INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP
#755Processed wafer via
#756CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#757Electronic component mounting structure, electronic component mounting method, and electronic component mounting board
#758Semiconductor device
#759Wafer backside structures having copper pillars
#760Barrier layer for fine-pitch mask-based substrate bumping
#761Microelectronic packages fabricated at the wafer level and methods therefor
#762Manufacture method for semiconductor device with bristled conductive nanotubes
#763Ball-limiting-metallurgy layers in solder ball structures
#764Integrated circuit chip using top post-passivation technology and bottom structure technology
#765Interconnect structure and a method of fabricating the same
#766Microelectronic assemblies having compliancy and methods therefor
#767Flip chip semiconductor package and fabrication method thereof
#768Reducing stress between a substrate and a projecting electrode on the substrate
#769Conductive ball mounting apparatus and conductive ball mounting method
#770METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#771Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
#772Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#773Chip capacitive coupling
#774Semiconductor device and method of manufacturing semiconductor device
#775Multi-component integrated circuit contacts
#776Gap capacitors for monitoring stress in solder balls in flip chip technology
#777Lock and key through-via method for wafer level 3D integration and structures produced
#778Semiconductor device and a method of manufacturing the same
#779Coaxial through chip connection
#780Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion
#781Semiconductor device
#782Electrical connectivity for circuit applications
#783Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof
#784Isolation Structure for Stacked Dies
#785Detection device and method for manufacturing the same
#786Method of manufacturing semiconductor device
#787SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF
#788SEMICONDUCTOR DEVICE
#789Semiconductor device and method of manufacturing the same
#790Wafer structure with conductive bumps and fabrication method thereof
#791Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#792Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
#793Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#7943-D circuits with integrated passive devices
#795Method for manufacturing semiconductor device
#796Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#797SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
#798BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS
#799Semiconductor device including a reduced stress configuration for metal pillars
#800Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers
#801Solder joint flip chip interconnection having relief structure
#802IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV
#803Electronic device and method for fabricating the same
#804LITHOGRAPHIC CONTACT ELEMENTS
#805Semiconductor device and method of manufacturing the same
#806Metallic bump structure without under bump metallurgy and manufacturing method thereof
#807Method for manufacturing semiconductor device having electrode for external connection
#808Lock and key through-via method for wafer level 3 D integration and structures produced
#809Connection by fitting together two soldered inserts
#810Solder joint flip chip interconnection
#811Methods of forming solder connections and structure thereof
#812Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
#813Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#814Electronic component mounting structure and method for manufacturing the same
#815Crystal structure of a solder bump of flip chip semiconductor device
#816Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#817LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#818Semiconductor device
#819Method of making a sidewall-protected metallic pillar on a semiconductor substrate
#820Semiconductor chip and semiconductor device
#821Under bump metallization for on-die capacitor
#822Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
#823Method and system for forming conductive bumping with copper interconnection
#824Semiconductor device and manufacturing method therefor
#825Chip package and method for fabricating the same
#826SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS
#827Electrode structure and semiconductor device
#828Circuitry component and method for forming the same
#829FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING
#830Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#831PLATING APPARATUS AND PLATING METHOD
#832FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#833Transponder and method of producing a transponder
#834Semiconductor chip and method for fabricating the same
#835METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER
#836Semiconductor device and a semiconductor device manufacturing method
#837SEMICONDUCTOR DEVICE
#838Display device and manufacturing method of the same
#839Chip-based thermo-stack
#840Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#841Low fabrication cost, fine pitch and high reliability solder bump
#842Die stacking with an annular via having a recessed socket
#843Semiconductor device fabrication method
#844Integrated circuit system having different-size solder bumps and different-size bonding pads
#845Contact structure and forming method thereof and connecting structure thereof
#846Semiconductor package and method of manufacturing the same
#847Mock bump system for flip chip integrated circuits
#848Mock bump system for flip chip integrated circuits
#849Method for mounting semiconductor device
#850Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
#851Methods for bonding and micro-electronic devices produced according to such methods
#852Flip chip semiconductor assembly with variable volume solder bumps
#853Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps
#854Gap capacitors for monitoring stress in solder balls in flip chip technology
#855Semiconductor device and method of manufacturing the same
#856System, apparatus, and method for advanced solder bumping
#857Post bump and method of forming the same
#858Process for producing semiconductor device and apparatus therefor
#859Method for processing a base that includes connecting a first base to a second base with an insulating film
#860Semiconductor device having a refractory metal containing film and method for manufacturing the same
#861Method for processing a base that includes connecting a first base to a second base
#862Semiconductor Device
#863ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#864Forming a 3-D semiconductor die structure with an intermetallic formation
#8653-D semiconductor die structure with containing feature and method
#866WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING
#867Forming robust solder interconnect structures by reducing effects of seed layer underetching
#868Semiconductor chip, method of fabricating the same and semiconductor chip stack package
#869Method of fabricating semiconductor device having three-dimensional stacked structure
#870METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE
#871Flip chip interconnection with double post
#872Flexible column die interconnects and structures including same
#873Soft error rate mitigation by interconnect structure
#874Method of Forming Conductive Lines and Similar Features
#875Isolating chip-to-chip contact
#876Low fabrication cost, high performance, high reliability chip scale package
#877Semiconductor device fabrication method
#878Protected solder ball joints in wafer level chip-scale packaging
#879Manufacturing method of redistribution circuit structure
#880FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF
#881Undercut-free BLM process for Pb-free and Pb-reduced C4
#882Semiconductor device
#883Copper pillar tin bump on semiconductor chip and method of forming the same
#884Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
#885Semiconductor device and a method of manufacturing the same
#886Manufacturing method of semiconductor integrated device with inverting plating cup
#887Method for micro component self-assembly
#888Back end integrated WLCSP structure without aluminum pads
#889Substrate anchor structure and method
#890Wafer of circuit board and joining structure of wafer or circuit board
#891Chip structure
#892Method of forming micro metal bump
#893Method of forming metallic bump and seal for semiconductor device
#894Method of forming metallic bump on I/O pad
#895Bump I/O contact for semiconductor device
#896Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
#897SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION
#898Forming method of electrode and manufacturing method of semiconductor device
#899Semiconductor device
#900Solder bump with inner core pillar in semiconductor package