H01L2224/11505 - CPC Classification Index

ClassID:

209644 ⎘

H01L2224/11505 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Sintering

Recent Application in this class:

20240297135

2024-09-05

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUFACTURING MEMBER PROVIDED WITH SOLDER BUMPS

20230215830

2023-07-06

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

20230041521

2023-02-09

Conductive pillar, method for manufacturing the same, and method for manufacturing bonded structure

20220293543

2022-09-15

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE PILLAR

20210202433

2021-07-01

System and method for extreme performance die attach

20210125950

2021-04-29

Forming of bump structure

20200258856

2020-08-13

EXPANDED HEAD PILLAR FOR BUMP BONDS

20200152590

2020-05-14

Method of forming a solder bump structure

20200058612

2020-02-20

Method of forming a solder bump structure

#10

20200058517

2020-02-20

Semiconductor device and method for manufacturing semiconductor device

#11

20190157229

2019-05-23

Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure

#12

20190148328

2019-05-16

Method of manufacturing chip-on-chip structure comprising sinterted pillars

#13

20190109108

2019-04-11

Expanded head pillar for bump bonds

#14

20180374813

2018-12-27

Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process

#15

20180204991

2018-07-19

Light emitting device and method of fabricating the same

#16

20180061797

2018-03-01

Method of forming a solder bump structure

#17

20170279020

2017-09-28

Light emitting device and method of fabricating the same

#18

20170144221

2017-05-25

Sintering materials and attachment methods using same

#19

20170084566

2017-03-23

Method of manufacturing electronic component module and electronic component module

#20

20170033068

2017-02-02

Formation of solder and copper interconnect structures and associated techniques and configurations

#21

20170028477

2017-02-02

Method for manufacturing metal powder

#22

20160365328

2016-12-15

Chip-on-chip structure and methods of manufacture

#23

20160268223

2016-09-15

Methods for forming pillar bumps on semiconductor wafers

#24

20160181217

2016-06-23

Formation of solder and copper interconnect structures and associated techniques and configurations

#25

20140295619

2014-10-02

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

#26

20140262003

2014-09-18

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

#27

20140049922

2014-02-20

Method of manufacturing electronic component module and electronic component module

#28

20130196499

2013-08-01

Method for building vertical pillar interconnect

#29

20130043573

2013-02-21

Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores

#30

20120252164

2012-10-04

Method for manufacturing semiconductor device

#31

20120049342

2012-03-01

Semiconductor die terminal

#32

20110284158

2011-11-24

Method and apparatus of manufacturing functionally gradient material

#33

20110272802

2011-11-10

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

#34

20110198733

2011-08-18

Semiconductor device and method of patterning resin insulation layer on substrate of the same

#35

20110003470

2011-01-06

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

#36

20100219444

2010-09-02

Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element

#37

20100013094

2010-01-21

Semiconductor package and methods of manufacturing the same

#38

20090230172

2009-09-17

Method of bonding

#39

20090039507

2009-02-12

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

#40