H01L2224/115 - CPC Classification Index

ClassID:

209642 ⎘

H01L2224/115 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material

Sub-classes:

H01L2224/11502 » Pre-existing or pre-deposited material 28
H01L2224/11505 » Sintering 47
H01L2224/1151 » Anodisation 1
H01L2224/11515 » Curing and solidification, e.g. of a photosensitive bump material 26
H01L2224/1152 » Self-assembly, e.g. self-agglomeration of the bump material in a fluid 27
H01L2224/1155 » Selective modification 10

Recent Application in this class:

20250087613

SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND ARRANGEMENT

20170145579

Separation of alpha emitting species from plating baths

20170145576

Separation of alpha emitting species from plating baths

20170145575

Separation of alpha emitting species from plating baths

20160233188

Contact bumps methods of making contact bumps

20150340334

Methods of fabricating semiconductor chip solder structures

20150287688

Metal contact for semiconductor device

20130168851

Bump structure and electronic packaging solder joint structure and fabricating method thereof

20130105993

SEMICONDUCTOR DEVICE INTERCONNECT

20130049190

Methods of fabricating semiconductor chip solder structures

20120168937

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

20110297433

Solder bump formation on a circuit board using a transfer sheet

20110233767

Semiconductor device and semiconductor device manufacturing method

20090174052

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

20080251916

UBM structure for strengthening solder bumps

20070085175

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

20060226203

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles