209658 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material; Physical or chemical etching Chemical mechanical polishing [CMP]
Micro bump, method for forming micro bump, chip interconnection structure and chip interconnection method
#2Forming of bump structure
#3DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#4METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHANICAL PLANARIZATION IN WAFER-LEVEL PACKAGING APPLICATIONS
#5Semiconductor package structure and method of manufacturing the same
#6EXPANDED HEAD PILLAR FOR BUMP BONDS
#7Method of forming vias using silicon on insulator substrate
#8Device with pillar-shaped components
#9Interconnect crack arrestor structure and methods
#10Metal bonding pads for packaging applications
#11Vertical gallium nitride Schottky diode
#12Expanded head pillar for bump bonds
#13Chip on package structure and method
#143D integration method using SOI substrates and structures produced thereby
#15Combing bump structure and manufacturing method thereof
#163D integration method using SOI substrates and structures produced thereby
#17Termination structure for gallium nitride Schottky diode including junction barriar diodes
#18Dam for three-dimensional integrated circuit
#193D integration method using SOI substrates and structures produced thereby
#20Metal bonding pads for packaging applications
#21Chip on package structure and method
#22Termination structure for gallium nitride Schottky diode
#23Device with pillar-shaped components
#24Pillar design for conductive bump
#25Chip on package structure and method
#26Semiconductor device and manufacturing method thereof
#27Interconnect crack arrestor structure and methods
#28Preventing misshaped solder balls
#29Device with pillar-shaped components
#30Semiconductor device and manufacturing method therefor
#31Dam for three-dimensional integrated circuit
#32Method of fabricating bump structure and bump structure
#33Semiconductor device and manufacturing method thereof
#34Pillar design for conductive bump
#35Techniques for fabricating fine-pitch micro-bumps
#36Interconnect crack arrestor structure and methods
#37Vertical gallium nitride Schottky diode
#38Semiconductor device and manufacturing method therefor
#39TSV pillar as an interconnecting structure
#40Pillar design for conductive bump
#41Semiconductor device and method of manufacturing the same
#423D integration method using SOI substrates and structures produced thereby
#43Method of fabricating bump structure
#44METHOD FOR CHIP TO PACKAGE INTERCONNECT
#45Combing bump structure and manufacturing method thereof
#46Joint structure for metal pillars
#47Advanced metal-to-metal direct bonding