209655 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material Physical or chemical etching
Sub-classes:CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MANUFACTURING METHOD OF THE CONDUCTIVE STRUCTURE
#2SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3Seal ring structures and methods of forming same
#4Seal ring structures and methods of forming same
#5Method of forming vias using silicon on insulator substrate
#6Interconnect crack arrestor structure and methods
#7Semiconductor devices and semiconductor packages
#8Seal ring structures and methods of forming same
#9Tall and fine pitch interconnects
#10Mixed UBM and mixed pitch on a single die
#11Seal ring structures and methods of forming same
#12Mixed UBM and mixed pitch on a single die
#13Mixed UBM and mixed pitch on a single die
#14Tall and fine pitch interconnects
#15Electrical connectivity of die to a host substrate
#16Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#17Semiconductor devices and semiconductor packages
#18Die attachment for packaged semiconductor device
#19Tall and fine pitch interconnects
#20Semiconductor substrate and semiconductor package structure having the same
#21Semiconductor device
#22Method of producing a hybridized device including microelectronic components
#23Bump structures, semiconductor device and semiconductor device package having the same
#24Method of producing an interposer with microspring contacts
#25Die attachment for packaged semiconductor device
#26Interconnect crack arrestor structure and methods
#27Micro-pillar assisted semiconductor bonding
#28Semiconductor device and manufacturing method therefor
#29Metal contact for semiconductor device
#30Semiconductor device
#31Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#32Electrical connectivity of die to a host substrate
#33Self-aligning conductive bump structure and method of fabrication
#34Wiring board having an opening with an angled surface
#35Method of fabricating bump structure and bump structure
#36Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#37Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#38Packaging substrate
#39Bump package and methods of formation thereof
#40Interconnect crack arrestor structure and methods
#41Integrated circuit devices including through-silicon-vias having integral contact pads
#42Microspring structures adapted for target device cooling
#43SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE
#44Semiconductor device and manufacturing method therefor
#45Self-aligning conductive bump structure and method of making the same
#46Heterostructure containing IC and LED and method for fabricating the same
#47Semiconductor structure and fabrication method thereof
#48Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar
#49Microsprings partially embedded in a laminate structure and methods for producing same
#50Interposer with microspring contacts
#51SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#52Conductive sidewall for microbumps
#53Method of fabricating bump structure
#54Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#55SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT
#56Electrical connectivity for circuit applications
#57Detection device and method for manufacturing the same
#58Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#59Method for manufacturing metal chips by plasma from a layer comprising several elements
#60Method for manufacturing semiconductor device with reduced damage to metal wiring layer
#61Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#62Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#63Electronic circuit device and porduction method therefor