Power device integration on a common substrate

Sensor protection

Integrated circuit device having through-silicon-via structure

Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections

Light emitting device and method of manufacturing the same

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor device having through electrode and method for manufacturing the same

Semiconductor light emitting device

SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE

Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Camera Module and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Methods and apparatus for via last through-vias

Light emitting device and system providing white light with various color temperatures

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Light-emitting device

System and method for modeling through silicon via

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor chip and stacked semiconductor package having the same

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light emitting device and method

Pad and circuit layout for semiconductor devices

Method for manufacturing an integrated circuit comprising vias crossing the substrate

Image pickup apparatus and camera module

Semiconductor light-emitting device and manufacturing method

Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Semiconductor device and process for producing semiconductor device

Image pickup unit and method of manufacturing the same

Through silicon via and method of forming the same

Electronics device package and fabrication method thereof

Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

WAFER LEVEL CHIP SIZE PACKAGE

Broadband infrared light emitting device

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR LIGHT EMITTING DEVICE

LIGHT EMITTING DIODE

Light emitting device and light emitting device package including series of light emitting regions

Semiconductor package having a contamination preventing layer formed in the semiconductor chip

EMI SHIELD FOR CAMERA MODULE

Chips having rear contacts connected by through vias to front contacts

Semiconductor structure and method for making same

System and method for 3D integrated circuit stacking

POST-POLYMER REVEALING OF THROUGH-SUBSTRATE VIA TIPS

Semiconductor device, solid-state imaging device, and camera system

Self-aligned protection layer for copper post structure

Chip package and method for forming the same

Image pickup apparatus and camera module

Camera module, and manufacturing device and method for the same

Light emitting diode package and manufacturing method thereof

Method and system for forming conductive bumping with copper interconnection

Compact camera module and method for fabricating the same

Embedded passive integration

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

Semiconductor device

Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device

Method of processing device wafer

Glass composition, light source device and illumination device

Silicone resin reflective substrate, manufacturing method for same, and base material composition used in reflective substrate

LED lampwick, LED chip, and method for manufacturing LED chip

Chip package and method for forming the same

Through wafer vias and method of making same

Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Flip chip interconnect solder mask

Flip chip interconnect solder mask

Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same

Bump structure and process of manufacturing the same

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Light emitting device with electrode having plurality of adhesive seeds spaced from one another on the light emitting structure

SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND CAMERA MODULE

Semiconductor device and method of manufacturing semiconductor device

Camera module and method for manufacturing camera module

Light emitting device and system providing white light with various color temperatures

Microelectronic devices having conductive through via electrodes insulated by gap regions

SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor component having a plated through-hole and method for the production thereof

Electronic device packaging structure

Multi-level options for power MOSFETS

Method for fabricating multi-chip module with multi-level interposer

Phosphor composition and method for producing the same, and light-emitting device using the same

Sealed electric element package

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Deposition method

Imaging device and camera module

Method of forming metal interconnections of semiconductor device

Producing method of light emitting diode device and light emitting diode element

Light emitting device and method for manufacturing the same

Solid-state image sensing device, camera module, and solid-state image sensing device manufacturing method

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Techniques for packaging multiple device components

Chip scale package assembly in reconstitution panel process format

Light-emitting device, light-emitting device module, and vehicle lighting unit

Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing

Power module for an automobile

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

ETCHING LIQUID FOR ETCHING SILICON SUBSTRATE REAR SURFACE IN THROUGH SILICON VIA PROCESS AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP HAVING THROUGH SILICON VIA USING THE ETCHING LIQUID

Preventing the cracking of passivation layers on ultra-thick metals

Sensor mounted in flip-chip technology at a substrate edge

Mosfet package

Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Semiconductor device

Nitride semiconductor element having -plane angled semiconductor region and electrode including Mg and Ag

Compliant core peripheral lead semiconductor test socket

BSI IMAGE SENSOR PACKAGE WITH VARIABLE LIGHT TRANSMISSION FOR EVEN RECEPTION OF DIFFERENT WAVELENGTHS

Circuit substrate and method of manufacturing same

Electrostatic chucking of an insulator handle substrate

Methods for forming backside illuminated image sensors with front side metal redistribution layers

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

Light sensor having transparent substrate with lens formed therein

Light sensor having a transparent substrate, a contiguous IR suppression filter and through-substrate vias

LED WIRING BOARD, LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LED WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT EMITTING MODULE

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

LIGHTING DEVICE AND PRODUCTION METHOD OF THE SAME

Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer

LIGHT EMITTING DEVICE AND PACKAGE STRUCTURE THEREOF

Semiconductor package with a metal post and manufacturing method thereof

Protecting T-contacts of chip scale packages from moisture

Wafer-level interconnect for high mechanical reliability applications

Solder bump connections

Manufacturing of a camera module

Wafer-scale X-ray detector and method of manufacturing the same

Semiconductor light-emitting element, semiconductor light-emitting device, method for producing semiconductor light-emitting element, method for producing semiconductor light-emitting device, illumination device using semiconductor light-emitting device, and electronic apparatus

Light emitting device and light emitting device package

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Light emitting diode with a light source suitable structure

Semiconductor device and method of manufacturing the same

Low cost metal-insulator-metal capacitors

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

SEMICONDUCTOR DEVICE, METHOD FOR FORMING THE SAME, AND DATA PROCESSING SYSTEM

Semiconductor devices having backside illuminated image sensors

Method and system for forming conductive bumping with copper interconnection

Elastic encapsulated carbon nanotube based electrical contacts

Semiconductor structure and method for making same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Method and system for improving reliability of a semiconductor device

Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition

Image sensing device including through vias electrically connecting imaging lens unit to image sensors

Method of manufacturing light-emitting device

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

Methods of manufacturing the gallium nitride based semiconductor devices

Method for manufacturing semiconductor device

Imaging device, imaging module and method for manufacturing imaging device

Chip package

Semiconductor light emitting device and vehicle light

Method of manufacturing optical sensor, optical sensor, and camera including optical sensor

Image sensor chip package and method for forming the same

Semiconductor light-emitting element, method for producing the same, lamp, lighting device, electronic equipment, mechanical device and electrode

Structure and process for electrical interconnect and thermal management

Multilevel interconnection system

Terminal structure, printed wiring board, module substrate, and electronic device

Image pickup module with improved flatness of image sensor and via electrodes

Light emitting diode

Electronic component and method for manufacturing the same

Light emitting diode submount with high thermal conductivity for high power operation

Light Emitting Diode Package Structure

Embedded wafer-level bonding approaches

Solder interconnect on IC chip

BALL GRID ARRAY PACKAGE

Substrate bonding system and method of modifying the same

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

Semiconductor device and the method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Image sensor module, method of manufacturing the same, camera module including the same and electronic device including the camera module

Wiring board and method for manufacturing the same

Methods, devices, and materials for metallization

Method for packaging electronic devices and integrated circuits

Alignment mark and method of formation

Nitride semiconductor light-emitting element and process for production thereof

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

LIGHT EMITTING MODULE, METHOD OF MANUFACTURING THE LIGHT EMITTING MODULE, AND LAMP UNIT

Semiconductor integrated circuit

Semiconductor package module and electric circuit assembly with the same

COMPOSITE FILM AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME

Methods of packaging semiconductor devices including bridge patterns

Vertical conductive connections in semiconductor substrates

MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT

Method of manufacturing an inductor for a microelectronic device

Semiconductor device

Chip structure

Method and system for forming a thin semiconductor device

Wafer level image sensor packaging structure and manufacturing method for the same

Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same

SEMICONDUCTOR DEVICE

Chip package and method for forming the same

Semiconductor integrated circuit device

Electronic device and manufacturing method therefor

Dual sided processing and devices based on freestanding nitride and zinc oxide films

Chip structure and process for forming the same

Optical imaging apparatus and methods of making the same

Semiconductor light-emitting device, light-emitting module, and illumination device

Semiconductor device

Method of manufacturing packages

Semiconductor light-emitting device with sealing material including a phosphor

Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package

Wafer level image sensor packaging structure and manufacturing method of the same

Manufacturing method and structure of a wafer level image sensor module with package structure

Methods and systems for material bonding

Semiconductor chip with coil element over passivation layer

Chip package

Integrated circuit packages

Exposure mask used for manufacturing a semiconductor device having impurity layer and a semiconductor device

Component comprising a chip in a cavity and a stress-reduced attachment

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Integrated circuit having TSVS including hillock suppression

Multi-chip module with multi-level interposer

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

SOLID STATE IMAGING DEVICE

Electrical connection interfaces and methods for adjacently positioned circuit components

Chip package and method for fabricating the same

Light emitting device

Double flip-chip LED package components

Resin multilayer device and method for manufacturing same

Through-substrate via and redistribution layer with metal paste

Light emitting module, method of manufacturing the light emitting module, and lamp unit

Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

System and Method for Improving Reliability of Integrated Circuit Packages

Light emitting diode with metal piles and multi-passivation layers and its manufacturing method

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Electronic device package and method for fabricating the same

LED Reflective Structure and Method of Fabricating the Same

Semiconductor device structures and electronic devices including same hybrid conductive vias

Semiconductor package and method of manufacturing the same

Grid array connection device and method

Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same

OPTICAL DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming

Semiconductor device having elastic solder bump to prevent disconnection

Image sensor module and method of manufacturing the same

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

LED packaging method

OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL PICKUP DEVICE AND ELECTRONIC DEVICE USING THE OPTICAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Light emitting device

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Light emitting diodes with smooth surface for reflective electrode

Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device

SEMICONDUCTOR LIGHT-EMITTING DEVICE

SEMICONDUCTOR DEVICE FORMATION SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof

Growth of Single Crystal Nanowires

Method for producing semiconductor light-emitting element

Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Semiconductor device

Semiconductor die contact structure and method

WAFER-SHAPED OPTICAL APPARATUS AND MANUFACTURING METHOD THEREOF, ELECTRONIC ELEMENT WAFER MODULE, SENSOR WAFER MODULE, ELECTRONIC ELEMENT MODULE,SENSOR MODULE, AND ELECTRONIC INFORMATION DEVICE

Semiconductor device and method of manufacturing the same

Method for manufacturing and testing an integrated electronic circuit

Semiconductor device and electronic apparatus equipped with the semiconductor device

SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE

LIGHT-EMITING DEVICE CHIP WITH MICRO-LENSES AND METHOD FOR FABRICATING THE SAME

Semiconductor device and information processing system including the same

Wavelength converted light emitting diode with reduced emission of unconverted light

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

Semiconductor device and method of forming bump-on-lead interconnection

Isostress grid array and method of fabrication thereof

Semiconductor device and method for manufacturing the same

Method for forming a current distribution structure

Protected semiconductor device and method of manufacturing thereof

Semiconductor wafer coat layers and methods therefor

Method for manufacturing a chip-size double side connection package

CARBON NANOTUBE INTERCONNECT AND METHOD OF MANUFACTURING THE SAME

Electronic assembly for an image sensing device

Solder joint reliability in microelectronic packaging

Self-aligned protection layer for copper post structure

Semiconductor light emitting element and semiconductor light emitting device

Chip structure with bumps and testing pads

Semiconductor device having a wafer level chip size package structure

Electrostatic chucking of an insulator handle substrate

Method for fabricating a decoupling composite capacitor in a wafer and related structure

Light emitting apparatus

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Method for insertion bonding and device thus obtained

LUMINOUS DEVICE

Electric via comprising lateral outgrowths

Semiconductor device

Electronic device, method of producing the same, and semiconductor device

Method of electrically connecting a microelectronic component

METHOD FOR FABRICATING FLIP CHIP GALLIUM NITRIDE LIGHT EMITTING DIODE

Wafer-level image sensor module, method of manufacturing the same and camera module

Semiconductor device and method of fabricating the same

Light emitting diodes with smooth surface for reflective electrode

MEMS package and method for the production thereof

Semiconductor apparatus manufacturing method and semiconductor apparatus

Flip-chip module and method for the production thereof

Semiconductor device, semiconductor package and wiring structure

Semiconductor device including through-electrode

Semiconductor device