Warpage resistant semiconductor package and method for manufacturing the same

Imaging Device and Manufacturing method therefor

Integrated package

Wafer level chip scale package

Substrate structure

Techniques for packaging multiple device components

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor integrated circuit device

Piezoelectric device

Semiconductor image sensor module and method of manufacturing the same

LED with substrate modifications for enhanced light extraction and method of making same

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor die packages using thin dies and metal substrates

Semiconductor component having through wire interconnect (TWI) with compressed wire

Light-emitting device, surface light-emitting apparatus, display system

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor light-emitting device and manufacturing method of the same

Semiconductor device having elastic solder bump to prevent disconnection

Electronic board, method of manufacturing the same, and electronic device

Three-dimensional semiconductor architecture

Semiconductor device

SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Light emitting device

Light emitting device package

Metal-metal bonding of compliant interconnect

Structure and method for sealing cavity of micro-electro-mechanical device

SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE ELEMENT, AND METHOD FOR MANUFACTURING THE DEVICE

Imaging device

Chips having rear contacts connected by through vias to front contacts

Stress buffering package for a semiconductor component

Stress barrier structures for semiconductor chips

Method of manufacturing ball grid array type semiconductor device

Method of making an imaging tablet-lens structure comprising an index of refraction that varies directionally

Photosensitizing chip package and manufacturing method thereof

Stacked semiconductor package having reduced height

Method of refining solder materials

Semiconductor light emitting element and manufacturing method thereof

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Dual sided processing and devices based on freestanding nitride and zinc oxide films

Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Reduced bottom roughness of stress buffering element of a semiconductor component

System and method for 3D integrated circuit stacking

Semiconductor device and method for manufacturing semiconductor device

Light sensor using wafer-level packaging

RF/EMI SHIELD

Semiconductor device and electronic apparatus equipped with the semiconductor device

Chip-scale package conversion technique for dies

Light emitting device with improved light extraction efficiency

Electrically shielded through-wafer interconnect

Semiconductor optical sensor element and method of producing the same

Semiconductor device

Semiconductor device

Power module having stacked flip-chip and method of fabricating the power module

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Grid array connection device and method

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR DESIGNING THE SAME

Semiconductor device with solder balls having high reliability

Illumination system comprising composite monolithic ceramic luminescence converter

Interconnection of lead frame to die utilizing flip chip process

Alpha shielding techniques and configurations

Sealed surface acoustic wave element package

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

THIN LIGHT-EMITTING DEVICES AND FABRICATION METHODS

Photodiode array, method of manufacturing the same, and radiation detector

SEMICONDUCTOR DEVICE

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

Structure and method for stacked wafer fabrication

Semiconductor package and method of manufacturing the same

Camera module and manufacturing method thereof

Semiconductor module

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Single chip LED as compact color variable light source

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

Semiconductor device and manufacturing method thereof

Semiconductor package with passivation island for reducing stress on solder bumps

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

Semiconductor package with a metal post

Semiconductor integrated circuit device

MEMS package and packaging method thereof

Image sensor module and method of manufacturing the same

Optical element wafer and method for manufacturing optical element wafer, optical element, optical element module, electronic element wafer module, electronic element module, and electronic information device

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

Light emitting device and system providing white light with various color temperatures

Method for packaging electronic devices and integrated circuits

Camera module and method of producing the same

Acoustic wave device and method for manufacturing the same

Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor light-emitting device and method for manufacturing same

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

Method for manufacturing a semiconductor device

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Through silicon via bonding structure

Semiconductor light emitting element and method for manufacturing semiconductor light emitting device

Solder joint reliability in microelectronic packaging

Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same

Camera module and method of manufacturing camera module

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Camera module and method of manufacturing the same

Semiconductor device, through hole having expansion portion and thin insulating film

Solid-state imaging device and method for manufacturing same

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method of the same

Back illuminated photodetector

Method and system for forming conductive bumping with copper interconnection

Chip mounting

SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING

Semiconductor device with fuse and a method of manufacturing the same

ILLUMINATION SYSTEM COMPRISING MONOLITHIC CERAMIC LUMINESCENCE CONVERTER

Circuit board and semiconductor device

Electronic device package with electromagnetic compatibility (EMC) coating thereon

LED

THIN GALLIUM NITRIDE LIGHT EMITTING DIODE DEVICE

Light emitting diode submount with high thermal conductivity for high power operation

METHOD OF MANUFACTURING AN INDUCTOR FOR A MICROELECTRONIC DEVICE, METHOD OF MANUFACTURING A SUBSTRATE CONTAINING SUCH AN INDUCTOR, AND SUBSTRATE MANUFACTURED THEREBY,

Circuitry component and method for forming the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Methods for protecting imaging elements of photoimagers during back side processing

Manufacturing method of wafer level chip scale package of image-sensing module

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Light-emitting device

Methods of forming interlayer dielectrics having air gaps

Phosphor composition and method for producing the same, and light-emitting device using the same

Light emitting device and illumination apparatus

Semiconductor device including electrode structure with first and second openings and manufacturing method thereof

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

Semiconductor device

Electronic element wafer module with reduced warping

Bonded wafer package module

Semiconductor device and a method for manufacturing the same

Structure and manufacturing method of chip scale package

Silver-coated ball and method for manufacturing same

CONDUCTIVE STRUCTURE OF A CHIP

Image sensor structure and integrated lens module thereof

Image sensor package, camera module having same and manufacturing method for the same

Method and apparatus for facilitating proximity communication and power delivery

Semiconductor light-emitting device

Enhanced architectural interconnect options enabled with flipped die on a multi-chip package

Semiconductor component with improved contact pad and method for forming the same

Rectangular-shaped controlled collapse chip connection

Interconnection of lead frame to die utilizing flip chip process

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Emission tuning methods and devices fabricated utilizing methods

Semiconductor device fabrication method

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor light-emitting device

Flip-chip mounting substrate and flip-chip mounting method

Phosphor composition and method for producing the same, and light-emitting device using the same

CONTACT STRUCTURE AND CONNECTING STRUCTURE

Light emitting diodes with smooth surface for reflective electrode

Glass-coated light-emitting element, light-emitting element-attached wiring board, method for producing light-emitting element-attached wiring board, lighting device and projector

Semiconductor arrangement and method for the measurement of a resistance

Method of electrically connecting a microelectronic component

LED with substrate modifications for enhanced light extraction and method of making same

Semiconductor light-emitting element

A1InGaP LED having reduced temperature dependence

Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor module

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Chip scale package fabrication methods

Power semiconductor device including a double metal contact

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Passivated Copper Chip Pads

Method of electrically connecting a microelectronic component

Method of electrically connecting a microelectronic component

Image sensor having through via

Solid-state image pickup device and method for manufacturing the same

Lighting device and production method of the same

Semiconductor chip package and method for manufacturing thereof

Method for manufacturing a semiconductor device

Image sensor module, camera module including the same and electronic device including the camera module

Method of making phosphor containing glass plate, method of making light emitting device

Flip chip interconnect solder mask

Light emitting device package

Light-emitting device with magnetic field

Light emitting device with magnetic field

Light emitting device

Flip-chip phosphor coating method and devices fabricated utilizing method

Electrical connection interfaces and methods for adjacently positioned circuit components

Semiconductor Device

CONSTRUCTION METHODS FOR BACKSIDE ILLUMINATED IMAGE SENSORS

Positive photosensitive resin composition, and semiconductor device and display therewith

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Electronic device and method of manufacturing thereof

Semiconductor device

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

System and Method for Improving Reliability of Integrated Circuit Packages

Warpage resistant semiconductor package and method for manufacturing the same

Camera modules and methods of fabricating the same

Substrate for mounting electronic part and electronic part

Low profile stacking system and method

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Back end integrated WLCSP structure without aluminum pads

C4 joint reliability

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor chip with coil element over passivation layer

Robust LED structure for substrate lift-off

Inductor formed in an integrated circuit

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Solid state imaging device and method for manufacturing same, and solid state imaging module

Current distribution structure and method

Wafer-level image sensor module, method of manufacturing the same, and camera module

Semiconductor package with passivation island for reducing stress on solder bumps

Semiconductor device and method of manufacturing the same

Solid-state optical device

Semiconductor device

Image sensor package

PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE

Imager die package and methods of packaging an imager die on a temporary carrier

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Anti-stiction technique for electromechanical systems and electromechanical device employing same

Dual-sided chip attached modules

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Structure and process for electrical interconnect and thermal management

Semiconductor light emitting device and method for manufacturing same

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Backlight including side-emitting semiconductor light emitting devices

Optical element coupled to low profile side emitting LED

Sensor-type package and method for fabricating the same

Image sensor package with trench insulator and fabrication method thereof

Method of manufacturing semiconductor device

System and method for providing semiconductor device features using a protective layer

Electronic device, method of producing the same, and semiconductor device

PACKAGING WITH A CONNECTION STRUCTURE

Semiconductor die package with internal bypass capacitors

Method of manufacturing an electronic part mounting structure

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Wafer level package structure and fabrication methods

Substrate removal during LED formation

Manufacturing method of semiconductor integrated circuit device

Flip-chip package structure, and the substrate and the chip thereof

Image sensor module at wafer level, method of manufacturing the same, and camera module

Image sensor package and fabrication method thereof

Back-illuminated type solid-state image pickup device and camera module using the same

Method of fabricating chip package

Chip package

Optical semiconductor device

Method of machining wafer

LED with phosphor layer having different thickness or different phosphor concentration

IC chip with finger-like bumps

Semiconductor package and multi-chip semiconductor package using the same

Structure and manufactruing method of chip scale package

Low profile side emitting LED with window layer and phosphor layer

Semiconductor device, chip package and method of fabricating the same

Thin flash or video recording light using low profile side emitting LED

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Contact pad and method of forming a contact pad for an integrated circuit

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Integrated circuit package and method for operating and fabricating thereof

Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module

Chip scale package having flip chip interconnect on die paddle

Semiconductor device

Semiconductor device

Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

Semiconductor device packaged into chip size and manufacturing method thereof

SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD OF FABRICATION

BUMP STRUCTURE

Dimple free gold bump for drive IC

Methods of assembling integrated circuit packages

Electronic Device Comprising a Mems Element

Semiconductor device

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure

Semiconductor Device

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Semiconductor substrates including vias of nonuniform cross-section and associated structures

Compound semiconductor light-emitting device and production method thereof

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Highly reliable low cost structure for wafer-level ball grid array packaging

Semiconductor device and method of fabricating the same

Phosphor composition and method for producing the same, and light-emitting device using the same

Interconnection designs and materials having improved strength and fatigue life

Method of forming through-silicon vias with stress buffer collars and resulting devices

Solder connector structure and method

THERMAL BONDING PROCESS FOR CHIP PACKAGING

Growth of single crystal nanowires

Wiring substrate and wiring substrate manufacturing method

Chips having rear contacts connected by through vias to front contacts

Print mask and method of manufacturing electronic components using the same

Encapsulated wafer level package with protection against damage and manufacturing method

METHOD FOR FORMING CONTACT PADS

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE