High-frequency device

Method of making multilayered printed circuit board with filled conductive holes

Stacked semiconductor device assembly and method for forming

Various structure/height bumps for wafer level-chip scale package

Method and apparatus for improved power routing

System and method for increasing the ball pitch of an electronic circuit package

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and the method of producing the same

Semiconductor package with improved solder joint reliability

[METHOD OF FORMING BOND MICROSTRUCTURE]

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Semiconductor device and manufacturing method thereof

Chip and wafer integration process using vertical connections

Support structure for low-k dielectrics

Wafer level packages for chips with sawn edge protection

Multilayer metallization

Techniques for packaging multiple device components

Wafer level chip scale packaging structure and method of fabricating the same

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Electronic device with reduced entrapment of material between die and substrate electrical connections

Inductor formed in an integrated circuit

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Semiconductor integrated circuit device

Structure and method of making capped chips having vertical interconnects

Semiconductor circuit with multiple contact sizes

Semiconductor device, process of producing semiconductor device, and ink jet recording head

Back-face and edge interconnects for lidded package

Chip structure and process for forming the same

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Semiconductor device manufacturing method

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Light emitting diode and manufacturing method thereof

Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate

Integrally packaged imaging module

Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same

Integrated circuit with dual electrical attachment PAD configuration

Semiconductor device and method of fabricating the same

Method of mounting wafer on printed wiring substrate

Semiconductor device and electronic apparatus equipped with the semiconductor device

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Integrated circuit die/package interconnect

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor apparatus and method for fabricating the same

Light-emitting device with enlarged active light-emitting region

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Super high density module with integrated wafer level packages

Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure

Inorganic thin layer, organic electroluminescence device including the same, and fabrication method thereof

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Fluxless assembly of chip size semiconductor packages

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip chip die bond pads, die bond pad placement and routing optimization

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Flip chip on lead frame

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

CSP semiconductor device having signal and radiation bump groups

Circuit board transferring apparatus and method and solder ball mounting method

Growth of single crystal nanowires

Under bump metallurgic layer

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Method for producing a semiconductor device in chip format

Semiconductor integrated circuit device

Conductive block mounting process for electrical connection

Semiconductor device and semiconductor device manufacturing method

CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME

Semiconductor device and a method of manufacturing the same

IC chip with improved pillar bumps

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Interconnecting component

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device having chip size package with improved strength

Method of fabricating an electronic device

Manufacturing method for semiconductor device

Manufacturing method of semiconductor device, including differently spaced bump electrode arrays

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

Semiconductor device and manufacturing method thereof

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Semiconductor device and method for manufacturing the same

Arrangement comprising a capacitor

Semiconductor device and manufacturing method thereof

Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Chip scale package and method of fabricating the same