209690 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Semiconductor device and method of manufacturing the same
#1202Semiconductor device
#1203Semiconductor device and a method of manufacturing the same
#1204Semiconductor device and method of manufacturing the same
#1205Flip chip package with reduced thermal stress
#1206On-chip test circuit for assessing chip integrity
#1207Semiconductor device, electronic module, and method of manufacturing electronic module
#1208Microelectronic bond pad
#1209Packaging method
#1210Method for modifying surface of substrate and method for manufacturing semiconductor device
#1211Device, system and electric element
#1212Micro camera module and method of manufacturing the same
#1213Light emitting diode device having advanced light extraction efficiency and preparation method thereof
#1214Method for mounting electronic element on a circuit board
#1215Electronic component unit
#1216Seedless wirebond pad plating
#1217Semiconductor device
#1218Backside-illuminated photodetector
#1219Flip-chip bonding structure using multi chip module-deposited substrate
#1220Under bump metallization design to reduce dielectric layer delamination
#1221BUMP FOR OVERHANG DEVICE
#1222Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#1223Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#1224Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures
#1225Circuitry component and method for forming the same
#1226Method of fabricating a stacked die in die BGA package
#1227Method of fabricating a stacked die in die BGA package
#1228Stacked die in die BGA package
#1229Grid array connection device and method
#1230Method of forming through-silicon vias with stress buffer collars and resulting devices
#1231Electronic board, method of manufacturing the same, and electronic device
#1232Electronic board, method of manufacturing the same, and electronic device
#1233Semiconductor device and circuit board
#1234Low stress chip attachment with shape memory materials
#1235Semiconductor device and method for manufacturing the same
#1236Backside-illuminated photodetector
#1237Microelectronic assemblies having low profile connections
#1238Semiconductor device having reduced number of external pad portions
#1239Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
#1240Through electrode and method for forming the same
#1241Solder joints for copper metallization having reduced interfacial voids
#1242Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming
#1243Semiconductor chip with coil element over passivation layer
#1244Flip chip interconnect solder mask
#1245Semiconductor device chip and semiconductor device chip package
#1246Handling and positioning of metallic plated balls for socket application in ball grid array packages
#1247Photodiode array, method for manufacturing same, and radiation detector
#1248Technique for defining a wettable solder joint area for an electronic assembly substrate
#1249Method of fabricating wafer level package
#1250Contact structure on chip and package thereof
#1251Semiconductor device with substrate having penetrating hole having a protrusion
#1252Anti-stiction technique for electromechanical systems and electromechanical device employing same
#1253Semiconductor package with controlled solder bump wetting and fabrication method therefor
#1254Semiconductor device production method and semiconductor device
#1255Electronic component and electronic configuration
#1256Semiconductor device having a leading wiring layer
#1257System having semiconductor component with multiple stacked dice
#1258Substrate for mounting electronic part and electronic part
#1259Semiconductor device
#1260Method of fabricating a substrate with a concave surface
#1261Manufacturing managing method of semiconductor devices and a semiconductor substrate
#1262Semiconductor wafer coat layers and methods therefor
#1263Semiconductor device
#1264Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads
#1265A1InGaP LED having reduced temperature dependence
#1266Stacked die-in-die BGA package with die having a recess
#1267C4 joint reliability
#1268Method of forming an interconnection element
#1269METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES
#1270Semiconductor device and manufacturing method for the same
#1271Package of a semiconductor device with a flexible wiring substrate and method for the same
#1272Semiconductor package and method for manufacturing the same
#1273Methods of refining lead-containing materials
#1274CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
#1275Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
#1276Die attach material for TBGA or flexible circuitry
#1277MOSFET package
#1278MOSFET package
#1279CHIP STRUCTURE AND WAFER STRUCTURE
#1280Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another
#1281Semiconductor device and method for producing same
#1282Microfeature devices and methods for manufacturing microfeature devices
#1283Inductor formed in an integrated circuit
#1284Semiconductor flip chip package having substantially non-collapsible spacer
#1285Chip scale package having flip chip interconnect on die paddle
#1286Microfeature devices and methods for manufacturing microfeature devices
#1287Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#1288Integrated circuit package-in-package system
#1289Trace design to minimize electromigration damage to solder bumps
#1290LED lamp
#1291Method of providing printed circuit board with conductive holes and board resulting therefrom
#1292Semiconductor device and manufacturing method of the same
#1293Semiconductor chip having solder bumps and dummy bumps
#1294Semiconductor module for making electrical contact with a connection device via a rewiring device
#1295Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#1296Chip scale package and method for manufacturing the same
#1297Circuit board and semiconductor device
#1298Light emitting apparatus
#1299Structure and manufacturing method of a chip scale package
#1300Apparatus for plating a semiconductor wafer and plating solution bath used therein
#1301Method of manufacturing semiconductor device and method of treating electrical connection section
#1302Under bump metallurgy in integrated circuits
#1303Interconnection structure through passive component
#1304Electronic component, electro-optical device, and electronic apparatus
#1305Structure for joining a semiconductor package to a substrate using a solder column
#1306Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
#1307Thermal interface apparatus, systems, and fabrication methods
#1308Semiconductor integrated device and method for manufacturing same
#1309Layered microelectronic contact and method for fabricating same
#1310Semiconductor device and fabrication method thereof
#1311Midair semiconductor device and manufacturing method of the same
#1312Method of manufacturing semiconductor device and support structure for semiconductor substrate
#1313Electronic component with a housing package
#1314Protection of an integrated capacitor
#1315Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#1316Multi-chip module
#1317Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#1318Metallization structure over passivation layer for IC chip
#1319Semiconductor device
#1320Method of manufacturing a semiconductor device with light shading means
#1321Thin gallium nitride light emitting diode device
#1322Method of manufacturing a device-incorporated substrate
#1323Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components
#1324Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
#1325Semiconductor device and the method of producing the same
#1326MSD raised metal interface features
#1327Bi-directional power switch
#1328Attachment of flip chips to substrates
#1329Semiconductor device and manufacturing method thereof
#1330Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
#1331Integrated circuit package and assembly thereof
#1332Die attach material for TBGA or flexible circuitry
#1333REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
#1334Socket grid array
#1335Wide emitting lens for LED useful for backlighting
#1336Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#1337Method and structure to reduce risk of gold embrittlement in solder joints
#1338Wafer structure, chip structure and bumping process
#1339Semiconductor packaging device comprising a semiconductor chip including a MOSFET
#1340Structure of mounting electronic component
#1341Wiring board and method for producing same
#1342Semiconductor device and manufacturing method of the same
#1343Package structure module of bump posited type lead frame
#1344Semiconductor device and manufacturing method for the same
#1345Method for manufacturing wafer level chip scale package using redistribution substrate
#1346Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
#1347Integrated circuit with at least one bump
#1348Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
#1349Semiconductor device
#1350Reliable printed wiring board assembly employing packages with solder joints
#1351Top layers of metal for integrated circuits
#1352Semiconductor device packaged into chip size and manufacturing method thereof
#1353Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
#1354Radiant energy heating for die attach
#1355Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#1356Chip structure
#1357Method for producing bumps on an electrical component
#1358Method for forming a redistribution layer in a wafer structure
#1359Method of making a solder ball
#1360Bump structure
#1361Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#1362Sealed surface acoustic wave element package
#1363Spectrally tunable detector
#1364Method for supplying solder
#1365Semiconductor device and method for fabricating the same
#1366Solid-state optical device
#1367Manufacturing method of stack-type semiconductor device
#1368Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#1369Semiconductor chip packages and methods for fabricating the same
#1370Semiconductor device
#1371High-reliable semiconductor device using hermetic sealing of electrodes
#1372Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus
#1373Semiconductor device with simplified constitution
#1374Method of electrically connecting a microelectronic component
#1375Thermal fatigue resistant tin-lead-silver solder
#1376Integrated inductors and compliant interconnects for semiconductor packaging
#1377Stacked packages
#1378Wafer level package, multi-package stack, and method of manufacturing the same
#1379Power gridding scheme
#1380Semiconductor device with sidewall wiring
#1381Power gridding scheme
#1382Metal-metal bonding of compliant interconnect
#1383Wafer level package structure of optical-electronic device and method for making the same
#1384Semiconductor device
#1385Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#1386Interconnect assemblies and methods
#1387Method of manufacturing semiconductor device with two-step etching of layer
#1388Semiconductor device with signal line having decreased characteristic impedance
#1389Semiconductor component having a CSP housing
#1390Semiconductor device and manufacturing method thereof
#1391Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#1392Die and die-package interface metallization and bump design and arrangement
#1393Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#1394Semiconductor package including rivet for bonding of lead posts
#1395Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#1396Light extraction from a semiconductor light emitting device via chip shaping
#1397Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#1398Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#1399Bonding pad and chip structure
#1400Through electrode and method for forming the same
#1401Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
#1402LED with substrate modifications for enhanced light extraction and method of making same
#1403LED with substrate modifications for enhanced light extraction and method of making same
#1404Stacked multi-chip semiconductor package improving connection reliability of stacked chips
#1405Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
#1406Semiconductor light emitting device and manufacturing method thereof
#1407Interposer containing bypass capacitors for reducing voltage noise in an IC device
#1408Semiconductor die package with internal bypass capacitors
#1409Microfeature devices and methods for manufacturing microfeature devices
#1410Pre-doped reflow interconnections for copper pads
#1411Stress mitigation layer to reduce under bump stress concentration
#1412Method of manufacturing semiconductor device
#1413Image pickup device and camera module
#1414Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#1415Semiconductor device that improves electrical connection reliability
#1416Semiconductor device with slanting side surface for external connection
#1417Semiconductor package including redistribution pattern and method of manufacturing the same
#1418Preparation of front contact for surface mounting
#1419Integrated circuit packages with reduced stress on die and associated methods
#1420Method of manufacturing semiconductor device and support structure for semiconductor substrate
#1421Chip structure and process for forming the same
#1422Semiconductor device
#1423Semiconductor device and method of manufacturing the same
#1424Semiconductor device and manufacturing process therefor
#1425Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#1426Method for fabrication of wafer level package incorporating dual compliant layers
#1427Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#1428Semiconductor device
#1429Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#1430Chip package, image sensor module including chip package, and manufacturing method thereof
#1431Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#1432Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#1433Semiconductor device
#1434Semiconductor light emitting device on insulating substrate and its manufacture method
#1435Semiconductor light-emitting device and fabrication method of the same
#1436Electronic device including chip parts and a method for manufacturing the same
#1437Flip chip semiconductor package for testing bump and method of fabricating the same
#1438Selectable decoupling capacitors for integrated circuits and associated methods
#1439Method of manufacturing an electronic parts packaging structure
#1440Semiconductor chip having pads with plural junctions for different assembly methods
#1441Integrated circuit die for wire bonding and flip-chip mounting
#1442FCBGA package structure
#1443Semiconductor component having multiple stacked dice
#1444Structure of package
#1445Compliant multi-composition interconnects
#1446Semiconductor chip having pads with plural junctions for different assembly methods
#1447Method for manufacturing semiconductor device
#1448Method and apparatus for improved power routing
#1449Wafer level chip scale packaging structure and method of fabricating the same
#1450Electronic component, mounted structure, electro-optical device, and electronic device
#1451Method for depositing a solder material on a substrate
#1452Electronic component mounting method and apparatus
#1453Extension of fatigue life for C4 solder ball to chip connection
#1454Method for maintaining solder thickness in flipchip attach packaging processes
#1455Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#1456Wafer support and release in wafer processing
#1457Semiconductor device
#1458Underfill fluxing curative
#1459Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#1460Semiconductor device and manufacturing method of the same
#1461Method of producing an electronic component with flexible bonding
#1462Manufacturing method of semiconductor device
#1463Microelectronic device interconnects
#1464Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#1465Semiconductor element and wafer level chip size package therefor
#1466Driver chip and display apparatus having the same
#1467Semiconductor device and manufacturing method for the same
#1468Semiconductor device and manufacturing method of the same
#1469Electronic component products and method of manufacturing electronic component products
#1470High-density illumination system
#1471Semiconductor device
#1472Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#1473Semiconductor device and method of manufacturing the same
#1474Semiconductor integrated circuit device
#1475Wafer-level chip scale package and method for fabricating and using the same
#1476Microelectronic assembly having array including passive elements and interconnects
#1477Socket grid array
#1478Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#1479Light source, method for manufacturing light source, and projector
#1480Methods for reducing flip chip stress
#1481Bumped IC, display device and electronic device using the same
#1482Semiconductor device and method of fabricating the same
#1483Partially etched dielectric film with conductive features
#1484Solder alloy and semiconductor device
#1485Bumpless wafer scale device and board assembly
#1486Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
#1487Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#1488Method and structure to reduce risk of gold embrittlement in solder joints
#1489WAFER-LEVEL PACKAGE STRUCTURE
#1490Package of a semiconductor device with a flexible wiring substrate and method for the same
#1491Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#1492Colored conductive wires for a semiconductor package
#1493Self-supporting connecting element for a semiconductor chip
#1494Test assembly including a test die for testing a semiconductor product die
#1495Electronic component mounting method and apparatus
#1496Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#1497Image sensor and manufacturing method thereof
#1498Low profile stacking system and method
#1499Method of forming bump pad of flip chip and structure thereof
#1500Method and device for manufacturing bonding pads for chip scale packaging