209700 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector; Coating Disposition
Semiconductor device
#2Semiconductor device
#3Semiconductor device
#4Methods of forming flip chip systems
#5Die-die stacking structure and method for making the same
#6Method for manufacturing a conducting contact on a conducting element
#7SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE HAVING THE SAME, AND STACKED SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR PACKAGE
#8Semiconductor device