209697 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector Coating
Sub-classes:Semiconductor structure and manufacturing method thereof
#2Semiconductor package with semiconductor die directly attached to lead frame and method
#3Substrate interconnections having different sizes
#4Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#5Semiconductor device
#6Cu pillar bump with non-metal sidewall spacer and metal top cap
#7Substrate interconnections having different sizes