209702 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector; Coating Plural coating layers
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
#2Semiconductor device with solder on pillar
#3SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
#4Harvested Reconstitution Bumping
#5Metal core solder ball interconnector fan-out wafer level package
#6Cu pillar bump with L-shaped non-metal sidewall protection structure
#7Flip chip interconnection with reduced current density
#8Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#9BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
#10Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
#11Cu pillar bump with L-shaped non-metal sidewall protection structure
#12High strength solder joint formation method for wafer level packages and flip applications