209737 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Sub-classes:Printed circuit board with embedded electronic component and manufacturing method thereof
#2Circuit substrate and package structure
#3Circuit board comprising an insulating diamond material
#4Light emitting diode
#5Light emitting diode
#6Semiconductor device and semiconductor device manufacturing method
#7Method for producing a non-plane element
#8SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#9Solder limiting layer for integrated circuit die copper bumps
#10Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device
#11Rotation joint and semiconductor device having the same
#12HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#13ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM
#14Electronic devices including solder bumps on compliant dielectric layers
#15Semiconductor component and method for production of a semiconductor component
#16Microelectronic packages and methods therefor
#17Electrically-isolated interconnects and seal rings in packages using a solder preform
#18Substrate package structure and packaging method thereof
#19Highly compliant plate for wafer bonding
#20Package modification for channel-routed circuit boards
#21Microelectronic packages and methods therefor
#22PDA security system