Patents-Review.com
ClassID:

209734 ⎘

H01L2224/165 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector Material

Sub-classes:
Recent Application in this class:
#1
20250174604
2025-05-29

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

 #2
20240312941
2024-09-19

ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS

 #3
20240213163
2024-06-27

INTERCONNECT DEVICE AND METHOD

 #4
20230017939
2023-01-19

Semiconductor device and a method of manufacturing thereof

 #5
20220208736
2022-06-30

Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same

 #6
20220013484
2022-01-13

Chip, circuit board and electronic device comprising polygonal pads

 #7
20210305184
2021-09-30

Chip, circuit board and electronic device

 #8
20210151405
2021-05-20

Semiconductor device and a method of manufacturing thereof

 #9
20200395337
2020-12-17

Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same

 #10
20200227371
2020-07-16

Semiconductor device and a method of manufacturing thereof

 #11
20190109111
2019-04-11

Semiconductor device and a method of manufacturing thereof

 #12
20190067037
2019-02-28

Flip-chip high speed components with underfill

 #13
20180269143
2018-09-20

Lateral vias for connections to buried microconductors and methods thereof

 #14
20170271290
2017-09-21

Semiconductor device and a method of manufacturing thereof

 #15
20170110428
2017-04-20

Semiconductor chip with patterned underbump metallization and polymer film

 #16
20150318238
2015-11-05

Device packaging with substrates having embedded lines and metal defined pads

 #17
20150214162
2015-07-30

Passive component structure and manufacturing method thereof

 #18
20150041974
2015-02-12

Sintered body made from silver fine particles

 #19
20150008578
2015-01-08

Device packaging with substrates having embedded lines and metal defined pads

 #20
20130130496
2013-05-23

Semiconductor apparatus

 #21
20120235301
2012-09-20

Semiconductor apparatus including a metal alloy between a first contact and a second contact

 #22
20120161330
2012-06-28

Device packaging with substrates having embedded lines and metal defined pads

 #23
20110254146
2011-10-20

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

 #24
20110201195
2011-08-18

Flip chip mounting method and bump forming method

 #25
20090275191
2009-11-05

Method and apparatus for electrostatic discharge protection using a temporary conductive coating

 #26
20090126876
2009-05-21

Flip chip mounting method and method for connecting substrates

 #27
20090117688
2009-05-07

Flip chip mounting method and bump forming method

 #28
20090115071
2009-05-07

Flip chip mounting method and method for connecting substrates

 #29
20090108442
2009-04-30

SELF-ASSEMBLED STRESS RELIEF INTERFACE

 #30
20090065932
2009-03-12

Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

 #31
20090023245
2009-01-22

Flip chip mounting method and bump forming method

 #32
20080284046
2008-11-20

Flip chip mounting method and bump forming method

 #33
20080128664
2008-06-05

Flip-chip mounting resin composition and bump forming resin composition

 #34
15175312
2018-05-15

Lateral vias for connections to buried microconductors