209787 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors Disposition
Sub-classes:Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
#2Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
#3Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
#4Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby