209789 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors; Disposition the connectors being bonded to at least one common bonding area
WAFER-ON-WAFER CASCODE HEMT DEVICE
#2METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THERMAL ATOMIC LAYER DEPOSITION ON CONDUCTIVE CONTACTS AND STRUCTURES FORMED USING THE SAME
#3Wafer-on-wafer Cascode HEMT Device
#4Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same
#5Electronic packages with three-dimensional conductive planes, and methods for fabrication