209819 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the layer connector
Sub-classes:PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#2PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#3THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
#4Method of manufacturing die stack structure
#5Die stack structure with hybrid bonding structure and method of fabricating the same and package
#6Method for attaching a semiconductor die to a carrier
#7Stacked dies with wire bonds and method
#8Embedded electrical component surface interconnect