H01L2224/2733 - CPC Classification Index

ClassID:

209824 ⎘

H01L2224/2733 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the layer connector in solid form

Sub-classes:

H01L2224/27332 » using a powder 30
H01L2224/27334 » using preformed layer 152

Recent Application in this class:

20230290751

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

20180130766

3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

20180068972

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

20170084569

Semiconductor device and production method therefor

20170069595

3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

20150072473

Die attachment apparatus and method utilizing activated forming gas

20140008421

Method and apparatus for dispensing flux-free solder on a substrate

20120168946

Semiconductor device and production method therefor