209820 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the layer connector in liquid form
Sub-classes:SEMICONDUCTOR MANUFACTURING SYSTEM AND METHOD
#2Method of Electronic Devices Packaging Underfill
#3PACKAGES WITH LIQUID METAL AS HEAT-DISSIPATION MEDIA AND METHOD FORMING THE SAME
#4DUAL COOLED MOSFET FOR LOW RDSON AND LOW THERMAL POWER
#5FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING/DIE BONDING FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
#6ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
#7Manufacturing method of a system in package having several layers and associated manufacturing installation
#8UNDERFILL MATERIAL
#9Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach
#10PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#11Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same
#12Packaged electronic device with film isolated power stack
#13DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
#14STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#15Packaged electronic device with film isolated power stack
#16Packaged electronic device with film isolated power stack
#17Semiconductor devices and methods of making the same
#18Selectively cross-linked thermal interface materials
#19Anisotropic conductive film with conductive particles forming repeating units of polygons
#20A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#21A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#22CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
#23Systems and methods for improved delamination characteristics in a semiconductor package
#24Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#25Selectively cross-linked thermal interface materials
#26Electronic assembly with enhanced thermal dissipation
#27CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
#28Package on-package structure with epoxy flux residue
#29Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste
#30Engineered polymer-based electronic materials
#313D printed hermetic package assembly and method
#32Remapped packaged extracted die with 3D printed bond connections
#33Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
#34Package-on-package structure with epoxy flux residue
#35Bonding method for connecting two wafers
#36Method for bonding substrates
#37Semiconductor devices and methods of making the same
#38Method for manufacturing metal powder
#39PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#40Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#41A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#42Methods for forming semiconductor device packages
#43Semiconductor device packages
#44Method of manufacturing semiconductor device
#45Laser assisted transfer welding process
#46Integrated circuit with printed bond connections
#47Contact smart card
#48Electronic devices with semiconductor die coupled to a thermally conductive substrate
#49Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
#50Chip-scale packaging with protective heat spreader
#51Method for manufacturing semiconductor device and semiconductor device
#52Semiconductor device
#53TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CONNECTING MATERIAL BASED ON SILVER
#54Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
#55Lead frame having a perimeter recess within periphery of component terminal
#56Joint material, and jointed body
#57Method and apparatus for printing integrated circuit bond connections
#58Reactive hot-melt adhesive for use on electronics
#59Semiconductor device
#60Semiconductor packaging containing sintering die-attach material
#61Packaged IC having printed dielectric adhesive on die pad
#62Method of manufacturing semiconductor device
#63Method and apparatus for dispensing flux-free solder on a substrate
#64Method for manufacturing a chip package
#65Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof
#66Heterogeneous chip integration with low loss interconnection through adaptive patterning
#67Electrically bonded arrays of transfer printed active components
#68Method for dispensing solder on a substrate and method for mounting semiconductor chips
#69Laser assisted transfer welding process
#70METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
#71Method of producing a chip package, and chip package
#72Embedded package and method for manufacturing the same
#73Semiconductor device having a base, a cavity, a diaphragm, and a substrate
#74Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material
#75Chip-scale packaging with protective heat spreader
#76WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
#77WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES
#78Electronic component mounting structure
#79Methods of attaching a die to a substrate
#80Method for mounting electronic components
#81Bonding method and bonding material using metal particle
#82Semiconductor device with die attached heat spreader